JP4789755B2 - レーザ加工装置 - Google Patents

レーザ加工装置 Download PDF

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Publication number
JP4789755B2
JP4789755B2 JP2006241221A JP2006241221A JP4789755B2 JP 4789755 B2 JP4789755 B2 JP 4789755B2 JP 2006241221 A JP2006241221 A JP 2006241221A JP 2006241221 A JP2006241221 A JP 2006241221A JP 4789755 B2 JP4789755 B2 JP 4789755B2
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JP
Japan
Prior art keywords
laser
circuit board
unit
light
focal position
Prior art date
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Expired - Fee Related
Application number
JP2006241221A
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English (en)
Japanese (ja)
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JP2008062260A (ja
JP2008062260A5 (enExample
Inventor
良 森津
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Keyence Corp
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Keyence Corp
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Application filed by Keyence Corp filed Critical Keyence Corp
Priority to JP2006241221A priority Critical patent/JP4789755B2/ja
Publication of JP2008062260A publication Critical patent/JP2008062260A/ja
Publication of JP2008062260A5 publication Critical patent/JP2008062260A5/ja
Application granted granted Critical
Publication of JP4789755B2 publication Critical patent/JP4789755B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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  • Lasers (AREA)
  • Laser Beam Processing (AREA)
JP2006241221A 2006-09-06 2006-09-06 レーザ加工装置 Expired - Fee Related JP4789755B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006241221A JP4789755B2 (ja) 2006-09-06 2006-09-06 レーザ加工装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006241221A JP4789755B2 (ja) 2006-09-06 2006-09-06 レーザ加工装置

Publications (3)

Publication Number Publication Date
JP2008062260A JP2008062260A (ja) 2008-03-21
JP2008062260A5 JP2008062260A5 (enExample) 2009-05-28
JP4789755B2 true JP4789755B2 (ja) 2011-10-12

Family

ID=39285414

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006241221A Expired - Fee Related JP4789755B2 (ja) 2006-09-06 2006-09-06 レーザ加工装置

Country Status (1)

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JP (1) JP4789755B2 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5465495B2 (ja) * 2009-09-07 2014-04-09 株式会社キーエンス レーザ加工装置
JP6684472B2 (ja) * 2016-08-09 2020-04-22 ブラザー工業株式会社 レーザ加工装置
JP7020896B2 (ja) * 2017-12-14 2022-02-16 株式会社キーエンス レーザ加工装置
JP6848989B2 (ja) * 2019-01-30 2021-03-24 ブラザー工業株式会社 レーザマーカ
JP7243568B2 (ja) * 2019-10-18 2023-03-22 ブラザー工業株式会社 レーザ加工装置
CN111687540B (zh) * 2020-06-10 2022-03-29 广州新可激光设备有限公司 一种设有z轴调焦专用温控容纳空间的激光打标机

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000164958A (ja) * 1998-11-26 2000-06-16 Matsushita Electric Ind Co Ltd Ｌｄ励起レーザ発振方法とレーザ発振器、これによるレーザ加工装置
JP2000202655A (ja) * 1999-01-08 2000-07-25 Toray Eng Co Ltd レ―ザ―マ―キング装置
JP2004354780A (ja) * 2003-05-29 2004-12-16 Keyence Corp レーザ加工装置
JP2006142362A (ja) * 2004-11-24 2006-06-08 Keyence Corp レーザー加工装置

Also Published As

Publication number Publication date
JP2008062260A (ja) 2008-03-21

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