JP4789426B2 - 銀ペースト用ガラス組成物及びそれを用いた感光性銀ペースト及び電極パターン - Google Patents

銀ペースト用ガラス組成物及びそれを用いた感光性銀ペースト及び電極パターン Download PDF

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Publication number
JP4789426B2
JP4789426B2 JP2004129764A JP2004129764A JP4789426B2 JP 4789426 B2 JP4789426 B2 JP 4789426B2 JP 2004129764 A JP2004129764 A JP 2004129764A JP 2004129764 A JP2004129764 A JP 2004129764A JP 4789426 B2 JP4789426 B2 JP 4789426B2
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JP
Japan
Prior art keywords
mass
silver paste
glass composition
photosensitive
composition
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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JP2004129764A
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English (en)
Japanese (ja)
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JP2005306699A (ja
Inventor
信之 鈴木
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Taiyo Holdings Co Ltd
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Taiyo Holdings Co Ltd
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Publication date
Application filed by Taiyo Holdings Co Ltd filed Critical Taiyo Holdings Co Ltd
Priority to JP2004129764A priority Critical patent/JP4789426B2/ja
Priority to KR1020050034075A priority patent/KR101113473B1/ko
Priority to CN2005100678025A priority patent/CN1690852B/zh
Publication of JP2005306699A publication Critical patent/JP2005306699A/ja
Application granted granted Critical
Publication of JP4789426B2 publication Critical patent/JP4789426B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/02Frit compositions, i.e. in a powdered or comminuted form
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/02Frit compositions, i.e. in a powdered or comminuted form
    • C03C8/04Frit compositions, i.e. in a powdered or comminuted form containing zinc
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/0045Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/0047Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/06Silver salts
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J11/00Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
    • H01J11/20Constructional details
    • H01J11/22Electrodes, e.g. special shape, material or configuration
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J11/00Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
    • H01J11/20Constructional details
    • H01J11/34Vessels, containers or parts thereof, e.g. substrates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Plasma & Fusion (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Ceramic Engineering (AREA)
  • Materials For Photolithography (AREA)
  • Conductive Materials (AREA)
  • Glass Compositions (AREA)
  • Gas-Filled Discharge Tubes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2004129764A 2004-04-26 2004-04-26 銀ペースト用ガラス組成物及びそれを用いた感光性銀ペースト及び電極パターン Expired - Lifetime JP4789426B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2004129764A JP4789426B2 (ja) 2004-04-26 2004-04-26 銀ペースト用ガラス組成物及びそれを用いた感光性銀ペースト及び電極パターン
KR1020050034075A KR101113473B1 (ko) 2004-04-26 2005-04-25 은페이스트용 유리 조성물, 이를 이용한 감광성 은페이스트, 전극 패턴 및 플라즈마 디스플레이 패널
CN2005100678025A CN1690852B (zh) 2004-04-26 2005-04-26 银浆用玻璃组合物、使用该组合物的感光性银浆、电极图形和等离子体显示板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004129764A JP4789426B2 (ja) 2004-04-26 2004-04-26 銀ペースト用ガラス組成物及びそれを用いた感光性銀ペースト及び電極パターン

Publications (2)

Publication Number Publication Date
JP2005306699A JP2005306699A (ja) 2005-11-04
JP4789426B2 true JP4789426B2 (ja) 2011-10-12

Family

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Family Applications (1)

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JP2004129764A Expired - Lifetime JP4789426B2 (ja) 2004-04-26 2004-04-26 銀ペースト用ガラス組成物及びそれを用いた感光性銀ペースト及び電極パターン

Country Status (3)

Country Link
JP (1) JP4789426B2 (ko)
KR (1) KR101113473B1 (ko)
CN (1) CN1690852B (ko)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007080904A1 (ja) * 2006-01-12 2007-07-19 Toray Industries, Inc. 感光性組成物、ディスプレイ部材およびその製造方法
US20090095344A1 (en) * 2006-04-25 2009-04-16 Tomohiro Machida Conductive Paste for Solar Cell Electrode
JP4714633B2 (ja) * 2006-04-25 2011-06-29 シャープ株式会社 太陽電池電極用導電性ペースト
JP4714634B2 (ja) * 2006-04-25 2011-06-29 シャープ株式会社 太陽電池電極用導電性ペースト
EP2058868A4 (en) 2006-08-29 2010-01-27 Hitachi Chemical Co Ltd CONDUCTIVE ADHESIVE FILM AND SOLAR CELL MODULE
KR100829667B1 (ko) 2006-09-07 2008-05-16 엘지전자 주식회사 전극용 페이스트 조성물, 이를 이용하여 제조된 플라즈마디스플레이 패널의 상판구조 및 그 제조방법
CN101593570B (zh) * 2008-05-29 2012-02-22 四川虹欧显示器件有限公司 黑色导电浆料和使用该浆料的等离子显示器
CN101728148B (zh) * 2009-01-05 2011-09-14 四川虹欧显示器件有限公司 电极浆料及利用其制造的电极和它们的制造方法以及具有该电极的pdp显示屏
JP5532512B2 (ja) * 2009-02-24 2014-06-25 日本電気硝子株式会社 電極形成用ガラス組成物および電極形成材料
KR20100109791A (ko) * 2009-04-01 2010-10-11 주식회사 동진쎄미켐 저온소성 가능한 전극 또는 배선 형성용 페이스트 조성물
CN102348656A (zh) * 2009-04-09 2012-02-08 E.I.内穆尔杜邦公司 用于光伏电池导体中的玻璃组合物
CN102103895B (zh) * 2010-11-23 2012-02-29 湖南威能新材料科技有限公司 一种太阳能电池正面电极及栅线用银浆料及其制备方法和含该银浆料制备的太阳能电池
CN101984494B (zh) * 2010-12-09 2012-05-23 东南大学 防沉降感光性银浆料及其制备方法
CN102097183B (zh) * 2011-02-24 2012-05-30 苏州晶银新材料股份有限公司 一种晶体硅太阳能电池正面电极用导电浆料的制备工艺
CN102768464B (zh) * 2011-05-04 2013-11-13 上海鑫力新材料科技有限公司 感光导电银浆及制备方法
KR101431509B1 (ko) * 2011-12-21 2014-08-22 주식회사 동진쎄미켐 태양전지 전극형성용 페이스트 조성물
CN102584505A (zh) * 2012-01-16 2012-07-18 南京理工大学 一种改善防潮性能的模块化无烟烟花药及其制备方法
CN102831958B (zh) * 2012-08-24 2014-09-10 合肥中南光电有限公司 无铅环保型晶体硅太阳能电池正面银浆及其制备方法
JP6814237B2 (ja) * 2018-03-23 2021-01-13 株式会社ノリタケカンパニーリミテド 感光性組成物とその利用
CN109277723B (zh) * 2018-10-06 2021-08-03 天津大学 一种高温环境下耐银电迁移的Ag-SiO2纳米焊膏的制备方法
CN111929989B (zh) * 2020-08-28 2022-03-15 乾宇电子材料(深圳)有限公司 感光性树脂组合物及其制备方法、感光性有机载体及黄光浆料

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06223617A (ja) * 1993-01-27 1994-08-12 Sumitomo Metal Mining Co Ltd 導電ペースト用組成物
JPH06295615A (ja) * 1993-04-07 1994-10-21 Sumitomo Metal Mining Co Ltd 厚膜抵抗体組成物
JP3297531B2 (ja) * 1994-06-27 2002-07-02 京セラ株式会社 導電性ペースト
JPH08153415A (ja) * 1994-11-29 1996-06-11 Futaba Corp 導電ペースト
TW367504B (en) * 1996-05-21 1999-08-21 Du Pont Photosensitive aqueous developable thick film composition employing vinylpyrrolidone polymer
JP3520721B2 (ja) * 1997-05-28 2004-04-19 東レ株式会社 感光性導電ペーストおよび電極の製造方法
JP2000232031A (ja) * 1999-02-12 2000-08-22 Murata Mfg Co Ltd 導電ペーストおよびこれを用いた積層セラミックコンデンサ
JP3534684B2 (ja) * 2000-07-10 2004-06-07 Tdk株式会社 導電ペーストおよび外部電極とその製造方法
JP2002352702A (ja) * 2001-05-28 2002-12-06 Matsushita Electric Ind Co Ltd プラズマディスプレイパネルの製造方法
JP2003226549A (ja) * 2001-11-30 2003-08-12 Matsushita Electric Ind Co Ltd 電極材料、誘電体材料、電極ペースト、誘電体ペーストおよびこれらを用いたプラズマディスプレイパネル

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Publication number Publication date
KR101113473B1 (ko) 2012-03-13
KR20060045846A (ko) 2006-05-17
JP2005306699A (ja) 2005-11-04
CN1690852A (zh) 2005-11-02
CN1690852B (zh) 2012-01-18

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