CN111929989B - 感光性树脂组合物及其制备方法、感光性有机载体及黄光浆料 - Google Patents
感光性树脂组合物及其制备方法、感光性有机载体及黄光浆料 Download PDFInfo
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- CN111929989B CN111929989B CN202010886340.4A CN202010886340A CN111929989B CN 111929989 B CN111929989 B CN 111929989B CN 202010886340 A CN202010886340 A CN 202010886340A CN 111929989 B CN111929989 B CN 111929989B
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- methacrylate
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- photosensitive resin
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
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- Materials For Photolithography (AREA)
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CN202010886340.4A CN111929989B (zh) | 2020-08-28 | 2020-08-28 | 感光性树脂组合物及其制备方法、感光性有机载体及黄光浆料 |
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CN202010886340.4A CN111929989B (zh) | 2020-08-28 | 2020-08-28 | 感光性树脂组合物及其制备方法、感光性有机载体及黄光浆料 |
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CN111929989A CN111929989A (zh) | 2020-11-13 |
CN111929989B true CN111929989B (zh) | 2022-03-15 |
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CN116543950B (zh) * | 2023-07-03 | 2023-10-17 | 乾宇微纳技术(深圳)有限公司 | 黄光浆料及其制备方法和其在异质结太阳能电池中的应用 |
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JP3614152B2 (ja) * | 2001-08-07 | 2005-01-26 | 株式会社村田製作所 | 感光性導電ペースト、それを用いた回路基板及びセラミック多層基板の製造方法 |
TW594404B (en) * | 2001-12-31 | 2004-06-21 | Ind Tech Res Inst | Photosensitive thick film composition |
JP4789426B2 (ja) * | 2004-04-26 | 2011-10-12 | 太陽ホールディングス株式会社 | 銀ペースト用ガラス組成物及びそれを用いた感光性銀ペースト及び電極パターン |
US20080268382A1 (en) * | 2005-11-30 | 2008-10-30 | Toray Industries, Inc. | Glass Paste, Method for Producing Display by Using Same, and Display |
JP5178178B2 (ja) * | 2006-12-22 | 2013-04-10 | 太陽ホールディングス株式会社 | 感光性樹脂組成物及びそれを用いて得られる焼成物パターンの製造方法 |
WO2012026151A1 (ja) * | 2010-08-27 | 2012-03-01 | 東レ株式会社 | 感光性ペースト、パターンの形成方法および平面ディスプレイパネル用部材の製造方法 |
CN110335700B (zh) * | 2019-06-28 | 2021-11-26 | 乾宇电子材料(苏州)有限公司 | 高温烧结型黄光导电浆料、导电线路及制备方法 |
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Address after: 518000 Building 1, Hengtai Yu Building, Tangwei Community, Fenghuang Street, Guangming District, Shenzhen City, Guangdong Province, 514-2 (one photo multi site enterprise) Patentee after: Qianyu Micro Nano Technology (Shenzhen) Co.,Ltd. Patentee after: Qianyu Electronic Materials (Suzhou) Co.,Ltd. Patentee after: Qianyu electronic materials (Dongguan) Co.,Ltd. Patentee after: QIANYE TECHNOLOGY DEVELOPMENT (DONGGUAN) Co.,Ltd. Address before: 518000 Room 401, No.7, LianJian Industrial Park, Huarong Road, Tongsheng community, Dalang street, Longhua District, Shenzhen City, Guangdong Province Patentee before: HANYU ELECTRONIC MATERIAL (SHENZHEN) Co.,Ltd. Patentee before: Qianyu Electronic Materials (Suzhou) Co.,Ltd. Patentee before: Qianyu electronic materials (Dongguan) Co.,Ltd. Patentee before: QIANYE TECHNOLOGY DEVELOPMENT (DONGGUAN) Co.,Ltd. |
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Effective date of registration: 20230726 Address after: 518000 Building 1, Hengtai Yu Building, Tangwei Community, Fenghuang Street, Guangming District, Shenzhen City, Guangdong Province, 514-2 (one photo multi site enterprise) Patentee after: Qianyu Micro Nano Technology (Shenzhen) Co.,Ltd. Patentee after: Qianyu Electronic Materials (Suzhou) Co.,Ltd. Patentee after: Qianyu electronic materials (Dongguan) Co.,Ltd. Address before: 518000 Building 1, Hengtai Yu Building, Tangwei Community, Fenghuang Street, Guangming District, Shenzhen City, Guangdong Province, 514-2 (one photo multi site enterprise) Patentee before: Qianyu Micro Nano Technology (Shenzhen) Co.,Ltd. Patentee before: Qianyu Electronic Materials (Suzhou) Co.,Ltd. Patentee before: Qianyu electronic materials (Dongguan) Co.,Ltd. Patentee before: QIANYE TECHNOLOGY DEVELOPMENT (DONGGUAN) Co.,Ltd. |
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