JP4782821B2 - 自己整合損傷層を有するデバイス構造体 - Google Patents
自己整合損傷層を有するデバイス構造体 Download PDFInfo
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- JP4782821B2 JP4782821B2 JP2008287315A JP2008287315A JP4782821B2 JP 4782821 B2 JP4782821 B2 JP 4782821B2 JP 2008287315 A JP2008287315 A JP 2008287315A JP 2008287315 A JP2008287315 A JP 2008287315A JP 4782821 B2 JP4782821 B2 JP 4782821B2
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- 108010075750 P-Type Calcium Channels Proteins 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 238000005229 chemical vapour deposition Methods 0.000 description 4
- 238000005468 ion implantation Methods 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
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- JJWKPURADFRFRB-UHFFFAOYSA-N carbonyl sulfide Chemical compound O=C=S JJWKPURADFRFRB-UHFFFAOYSA-N 0.000 description 3
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- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 2
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- 229910052732 germanium Inorganic materials 0.000 description 2
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- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
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- 238000005054 agglomeration Methods 0.000 description 1
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- 229910052786 argon Inorganic materials 0.000 description 1
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- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
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- 229910052735 hafnium Inorganic materials 0.000 description 1
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 description 1
- CJNBYAVZURUTKZ-UHFFFAOYSA-N hafnium(iv) oxide Chemical compound O=[Hf]=O CJNBYAVZURUTKZ-UHFFFAOYSA-N 0.000 description 1
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- 229910052754 neon Inorganic materials 0.000 description 1
- GKAOGPIIYCISHV-UHFFFAOYSA-N neon atom Chemical compound [Ne] GKAOGPIIYCISHV-UHFFFAOYSA-N 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
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- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
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- 235000012239 silicon dioxide Nutrition 0.000 description 1
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- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0603—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
- H01L29/0642—Isolation within the component, i.e. internal isolation
- H01L29/0649—Dielectric regions, e.g. SiO2 regions, air gaps
- H01L29/0653—Dielectric regions, e.g. SiO2 regions, air gaps adjoining the input or output region of a field-effect device, e.g. the source or drain region
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66568—Lateral single gate silicon transistors
- H01L29/66575—Lateral single gate silicon transistors where the source and drain or source and drain extensions are self-aligned to the sides of the gate
- H01L29/6659—Lateral single gate silicon transistors where the source and drain or source and drain extensions are self-aligned to the sides of the gate with both lightly doped source and drain extensions and source and drain self-aligned to the sides of the gate, e.g. lightly doped drain [LDD] MOSFET, double diffused drain [DDD] MOSFET
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66568—Lateral single gate silicon transistors
- H01L29/66659—Lateral single gate silicon transistors with asymmetry in the channel direction, e.g. lateral high-voltage MISFETs with drain offset region, extended drain MISFETs
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7842—Field effect transistors with field effect produced by an insulated gate means for exerting mechanical stress on the crystal lattice of the channel region, e.g. using a flexible substrate
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7842—Field effect transistors with field effect produced by an insulated gate means for exerting mechanical stress on the crystal lattice of the channel region, e.g. using a flexible substrate
- H01L29/7848—Field effect transistors with field effect produced by an insulated gate means for exerting mechanical stress on the crystal lattice of the channel region, e.g. using a flexible substrate the means being located in the source/drain region, e.g. SiGe source and drain
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
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- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
Description
14:基板
15:井戸(ウェル)
16:ゲート誘電体層
18:ゲート導電体層
20:ハードマスク層
22:基板14の上表面
24:レジスト層
25、27:ゲート電極26の側壁
26:ゲート電極
28:ゲート誘電体
30:ゲート構造部
32、34:側壁スペーサ
35、39:接合部(界面)
36:ソース領域
37:チャネル領域
38:ドレイン領域
40:注入マスク
42、48:イオン(一方向矢印)
44:ゲート電極26の上表面
46a、46b、52a、52b、54a、54b:結晶損傷層
47、49:結晶損傷層の端部
50、53、55:ボイド
56、58:導電層
60:誘電体層
62、64、66:コンタクト
65:デバイス構造体
Claims (5)
- 上表面を有する半導体材料の基板の内部に形成されるデバイス構造体であって、
前記基板の前記半導体材料内に画定された、第1導電型の第1ドープ領域と、
前記基板の前記半導体材料内に画定された、前記第1導電型の第2ドープ領域と、
前記第1ドープ領域および前記第2ドープ領域は、前記基板の前記半導体材料内に画定された前記第1導電型とは逆の第2導電型を有する第3ドープ領域内に配置されており、
前記基板の前記上表面の上にあり、前記第1ドープ領域と前記第2ドープ領域の間に形成された前記第3ドープ領域のチャネル領域と垂直方向に重なる関係にあるゲート構造部と、
前記基板の前記半導体材料の内部にあり、前記上表面と平行に延び、前記基板の前記半導体材料によって取り囲まれた不活性気体を含む複数のボイドを含んだ第1および第2結晶損傷層と、を備え、
前記第1結晶損傷層は、前記第1ドープ領域および前記第2ドープ領域の内部に配置され、前記第2結晶損傷層は、前記第1ドープ領域および前記第2ドープ領域よりも深い前記第1ドープ領域および前記第2ドープ領域下部の位置に配置され、
前記第1および第2結晶損傷層は前記ゲート構造部の下方を横方向に有意な距離は延びず、かつ前記ゲート構造の下方で連続性を有しておらず、
前記第2導電型はp型の導電性であり、従って前記第3ドープ領域内の前記半導体材料はp型導電性を有し、前記第1結晶損傷層は圧縮性応力を前記第3ドープ領域の前記チャネル領域に効果的に伝達し、かつ前記第2結晶損傷層は、前記基板を通り抜けるイオン化放射により生成する電荷キャリアを収集し、それにより前記第1ドープ領域への前記電荷キャリアの移動を効果的に防ぐ再結合中心を含み、前記第2結晶損傷層により、ソフト・エラー率を抑制する、デバイス構造体。 - 前記第1および第2結晶損傷層の前記チャネル領域側の端部は、前記第1ドープ領域および第2ドープ領域の前記チャネル領域側の端部と概ね一致した関係を有する、請求項1に記載のデバイス構造体。
- 前記第1ドープ領域は電界効果トランジスタのドレインであり、前記第2ドープ領域は前記電界効果トランジスタのソースであり、前記ゲート構造部は、ゲート電極と、該ゲート電極を前記基板の前記上表面から分離するゲート誘電体層とを含む、請求項1に記載のデバイス構造体。
- 前記第1結晶損傷層は、前記基板を通り抜けるイオン化放射により生成する電荷キャリアを収集し、それにより前記第1ドープ領域への前記電荷キャリアの移動を効果的に防ぐ再結合中心を含む、請求項1に記載のデバイス構造体。
- 前記第1ドープ領域と前記第3ドープ領域はp−n接合部で界面を形成し、前記第1結晶損傷層の前記チャネル領域側の終端部は前記p−n接合部と概ね横方向で一致している、請求項1に記載のデバイス構造体。
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US12/178,766 US7795679B2 (en) | 2008-07-24 | 2008-07-24 | Device structures with a self-aligned damage layer and methods for forming such device structures |
US12/178766 | 2008-07-24 |
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JP2011001856A Division JP5385926B2 (ja) | 2008-07-24 | 2011-01-07 | 自己整合損傷層を有するデバイス構造体の形成方法 |
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JP2010034488A JP2010034488A (ja) | 2010-02-12 |
JP4782821B2 true JP4782821B2 (ja) | 2011-09-28 |
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JP2011001856A Expired - Fee Related JP5385926B2 (ja) | 2008-07-24 | 2011-01-07 | 自己整合損傷層を有するデバイス構造体の形成方法 |
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Country Status (5)
Country | Link |
---|---|
US (1) | US7795679B2 (ja) |
EP (1) | EP2148372B1 (ja) |
JP (2) | JP4782821B2 (ja) |
CN (1) | CN101635312B (ja) |
AT (1) | ATE514189T1 (ja) |
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CN102005414B (zh) * | 2009-08-28 | 2012-12-12 | 中芯国际集成电路制造(上海)有限公司 | Cmos图像传感器像素、制造方法及图像捕获设备 |
US10128115B2 (en) * | 2010-02-26 | 2018-11-13 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method of forming ultra-shallow junctions in semiconductor devices |
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US7432553B2 (en) * | 2005-01-19 | 2008-10-07 | International Business Machines Corporation | Structure and method to optimize strain in CMOSFETs |
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JP2011097082A (ja) | 2011-05-12 |
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