JP4778751B2 - 樹脂モールド金型 - Google Patents

樹脂モールド金型 Download PDF

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Publication number
JP4778751B2
JP4778751B2 JP2005239796A JP2005239796A JP4778751B2 JP 4778751 B2 JP4778751 B2 JP 4778751B2 JP 2005239796 A JP2005239796 A JP 2005239796A JP 2005239796 A JP2005239796 A JP 2005239796A JP 4778751 B2 JP4778751 B2 JP 4778751B2
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JP
Japan
Prior art keywords
block
mold
resin
movable
molded product
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2005239796A
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English (en)
Japanese (ja)
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JP2006088692A (ja
JP2006088692A5 (enExample
Inventor
友一 高橋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Apic Yamada Corp
Original Assignee
Apic Yamada Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Apic Yamada Corp filed Critical Apic Yamada Corp
Priority to JP2005239796A priority Critical patent/JP4778751B2/ja
Publication of JP2006088692A publication Critical patent/JP2006088692A/ja
Publication of JP2006088692A5 publication Critical patent/JP2006088692A5/ja
Application granted granted Critical
Publication of JP4778751B2 publication Critical patent/JP4778751B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP2005239796A 2004-08-26 2005-08-22 樹脂モールド金型 Expired - Lifetime JP4778751B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005239796A JP4778751B2 (ja) 2004-08-26 2005-08-22 樹脂モールド金型

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2004247266 2004-08-26
JP2004247266 2004-08-26
JP2005239796A JP4778751B2 (ja) 2004-08-26 2005-08-22 樹脂モールド金型

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2011125027A Division JP5325933B2 (ja) 2004-08-26 2011-06-03 樹脂モールド金型

Publications (3)

Publication Number Publication Date
JP2006088692A JP2006088692A (ja) 2006-04-06
JP2006088692A5 JP2006088692A5 (enExample) 2009-06-04
JP4778751B2 true JP4778751B2 (ja) 2011-09-21

Family

ID=36230096

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005239796A Expired - Lifetime JP4778751B2 (ja) 2004-08-26 2005-08-22 樹脂モールド金型

Country Status (1)

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JP (1) JP4778751B2 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5621146B2 (ja) * 2010-07-20 2014-11-05 アピックヤマダ株式会社 金型駆動装置
JP5621147B2 (ja) * 2010-07-20 2014-11-05 アピックヤマダ株式会社 樹脂モールド装置
TWI623071B (zh) 2010-11-25 2018-05-01 Apic Yamada Corporation 樹脂模塑裝置與樹脂模塑方法
JP5693931B2 (ja) * 2010-11-25 2015-04-01 アピックヤマダ株式会社 樹脂モールド装置
JP6096081B2 (ja) * 2013-08-06 2017-03-15 アピックヤマダ株式会社 樹脂封止金型、樹脂封止方法、および樹脂封止金型のクリーニング方法
CN108556233B (zh) * 2018-04-20 2023-05-12 天津昌润鹏科技有限公司 一种手机电池胶带吸取夹具挂胶治具
JP7465829B2 (ja) 2021-02-17 2024-04-11 Ｔｏｗａ株式会社 樹脂成形品の製造方法、成形型及び樹脂成形装置
JP7628707B2 (ja) 2021-11-10 2025-02-12 アピックヤマダ株式会社 樹脂封止装置及び樹脂封止方法
CN114714436B (zh) * 2022-03-25 2024-04-05 安徽金诚复合材料有限公司 Phc门板加工用定型模具及其操作方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3746357B2 (ja) * 1997-08-21 2006-02-15 アピックヤマダ株式会社 樹脂モールド装置
JP2001062839A (ja) * 1999-08-26 2001-03-13 Matsushita Electric Works Ltd 成形装置
JP3415575B2 (ja) * 2000-09-07 2003-06-09 Ｔｏｗａ株式会社 位置合わせ機構及び位置合わせ方法
JP4174263B2 (ja) * 2002-08-12 2008-10-29 アピックヤマダ株式会社 樹脂モールド方法

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Publication number Publication date
JP2006088692A (ja) 2006-04-06

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