JP4775593B2 - 積層型軟磁性シートの製造方法 - Google Patents
積層型軟磁性シートの製造方法 Download PDFInfo
- Publication number
- JP4775593B2 JP4775593B2 JP2007260495A JP2007260495A JP4775593B2 JP 4775593 B2 JP4775593 B2 JP 4775593B2 JP 2007260495 A JP2007260495 A JP 2007260495A JP 2007260495 A JP2007260495 A JP 2007260495A JP 4775593 B2 JP4775593 B2 JP 4775593B2
- Authority
- JP
- Japan
- Prior art keywords
- soft magnetic
- magnetic sheet
- sheet
- laminated
- pressure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000004519 manufacturing process Methods 0.000 title claims description 15
- 239000000203 mixture Substances 0.000 claims description 38
- 239000006247 magnetic powder Substances 0.000 claims description 32
- 238000006243 chemical reaction Methods 0.000 claims description 28
- 239000000758 substrate Substances 0.000 claims description 23
- 229920000647 polyepoxide Polymers 0.000 claims description 16
- 239000003822 epoxy resin Substances 0.000 claims description 15
- 229920000800 acrylic rubber Polymers 0.000 claims description 7
- 239000003795 chemical substances by application Substances 0.000 claims description 7
- 238000001035 drying Methods 0.000 claims description 7
- 229920000058 polyacrylate Polymers 0.000 claims description 7
- 239000002904 solvent Substances 0.000 claims description 7
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 claims description 5
- 238000010030 laminating Methods 0.000 claims description 5
- 238000002156 mixing Methods 0.000 claims description 4
- 238000001723 curing Methods 0.000 description 28
- 230000008859 change Effects 0.000 description 23
- 238000000034 method Methods 0.000 description 21
- 230000035699 permeability Effects 0.000 description 20
- 230000000052 comparative effect Effects 0.000 description 15
- 229920000728 polyester Polymers 0.000 description 14
- 239000002356 single layer Substances 0.000 description 13
- 238000000576 coating method Methods 0.000 description 12
- 229910045601 alloy Inorganic materials 0.000 description 9
- 239000000956 alloy Substances 0.000 description 9
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 6
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 230000002950 deficient Effects 0.000 description 6
- 229920001971 elastomer Polymers 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 239000005060 rubber Substances 0.000 description 6
- 239000011230 binding agent Substances 0.000 description 5
- 238000004132 cross linking Methods 0.000 description 5
- 238000000635 electron micrograph Methods 0.000 description 5
- 238000004898 kneading Methods 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- 238000005096 rolling process Methods 0.000 description 5
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 230000006835 compression Effects 0.000 description 4
- 238000007906 compression Methods 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- 229910001004 magnetic alloy Inorganic materials 0.000 description 4
- 229920001187 thermosetting polymer Polymers 0.000 description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 3
- 238000004891 communication Methods 0.000 description 3
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 230000003247 decreasing effect Effects 0.000 description 3
- 230000001771 impaired effect Effects 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 2
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 2
- 229910000990 Ni alloy Inorganic materials 0.000 description 2
- 229910002796 Si–Al Inorganic materials 0.000 description 2
- 229910008458 Si—Cr Inorganic materials 0.000 description 2
- 239000006096 absorbing agent Substances 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- DKPFZGUDAPQIHT-UHFFFAOYSA-N butyl acetate Chemical compound CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 2
- 239000007822 coupling agent Substances 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005485 electric heating Methods 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 238000007602 hot air drying Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000696 magnetic material Substances 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 2
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 2
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- DGUJJOYLOCXENZ-UHFFFAOYSA-N 4-[2-[4-(oxiran-2-ylmethoxy)phenyl]propan-2-yl]phenol Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C1=CC=C(O)C=C1 DGUJJOYLOCXENZ-UHFFFAOYSA-N 0.000 description 1
- 229910021364 Al-Si alloy Inorganic materials 0.000 description 1
- 238000004438 BET method Methods 0.000 description 1
- 239000004709 Chlorinated polyethylene Substances 0.000 description 1
- 229910017758 Cu-Si Inorganic materials 0.000 description 1
- 229910017931 Cu—Si Inorganic materials 0.000 description 1
- 229910017082 Fe-Si Inorganic materials 0.000 description 1
- 229910017133 Fe—Si Inorganic materials 0.000 description 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- 229910018487 Ni—Cr Inorganic materials 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 229910008423 Si—B Inorganic materials 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- -1 amine imidazoles Chemical class 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000000740 bleeding effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- WCCJDBZJUYKDBF-UHFFFAOYSA-N copper silicon Chemical compound [Si].[Cu] WCCJDBZJUYKDBF-UHFFFAOYSA-N 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- OTARVPUIYXHRRB-UHFFFAOYSA-N diethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](C)(OCC)CCCOCC1CO1 OTARVPUIYXHRRB-UHFFFAOYSA-N 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229910000889 permalloy Inorganic materials 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 229910000702 sendust Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Landscapes
- Hard Magnetic Materials (AREA)
- Soft Magnetic Materials (AREA)
- Regulation Of General Use Transformers (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007260495A JP4775593B2 (ja) | 2006-10-31 | 2007-10-04 | 積層型軟磁性シートの製造方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006295289 | 2006-10-31 | ||
| JP2006295289 | 2006-10-31 | ||
| JP2007260495A JP4775593B2 (ja) | 2006-10-31 | 2007-10-04 | 積層型軟磁性シートの製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008135713A JP2008135713A (ja) | 2008-06-12 |
| JP2008135713A5 JP2008135713A5 (OSRAM) | 2010-06-24 |
| JP4775593B2 true JP4775593B2 (ja) | 2011-09-21 |
Family
ID=39560305
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007260495A Active JP4775593B2 (ja) | 2006-10-31 | 2007-10-04 | 積層型軟磁性シートの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4775593B2 (OSRAM) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5926011B2 (ja) * | 2011-07-19 | 2016-05-25 | 太陽誘電株式会社 | 磁性材料およびそれを用いたコイル部品 |
| JP6757117B2 (ja) * | 2014-10-02 | 2020-09-16 | 山陽特殊製鋼株式会社 | 軟磁性扁平粉末及びその製造方法 |
| JP6864498B2 (ja) * | 2017-02-28 | 2021-04-28 | 山陽特殊製鋼株式会社 | 高透磁率および高耐候性を有する軟磁性扁平粉末およびこれを含有する軟磁性樹脂組成物 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62176823A (ja) * | 1986-01-30 | 1987-08-03 | Mitsui Mining & Smelting Co Ltd | 熱成形用積層板の成形方法 |
| US5869412A (en) * | 1991-08-22 | 1999-02-09 | Minnesota Mining & Manufacturing Co. | Metal fibermat/polymer composite |
| JP2000101284A (ja) * | 1998-09-24 | 2000-04-07 | Sony Corp | 電磁波吸収体およびその製造方法 |
| JP2003191320A (ja) * | 2001-12-25 | 2003-07-08 | Sumitomo Chem Co Ltd | 易剥離性成型体 |
| JP2003229694A (ja) * | 2002-02-05 | 2003-08-15 | Sony Corp | 電磁波吸収体およびその製造方法 |
| JP2004140322A (ja) * | 2002-08-20 | 2004-05-13 | Alps Electric Co Ltd | 電波吸収体及び電波吸収体の製造方法 |
| JP2006073949A (ja) * | 2004-09-06 | 2006-03-16 | Showa Denko Kk | 電磁波吸収体 |
| JP2006128649A (ja) * | 2004-09-30 | 2006-05-18 | Nitta Ind Corp | 電磁干渉抑制体およびその製造方法 |
| WO2006059771A1 (ja) * | 2004-12-03 | 2006-06-08 | Nitta Corporation | 電磁干渉抑制体、アンテナ装置、及び電子情報伝達装置 |
| JP2006202266A (ja) * | 2004-12-20 | 2006-08-03 | Toppan Forms Co Ltd | 非接触型データ受送信体 |
-
2007
- 2007-10-04 JP JP2007260495A patent/JP4775593B2/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2008135713A (ja) | 2008-06-12 |
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