JP4773421B2 - 回転型memsデバイス - Google Patents
回転型memsデバイス Download PDFInfo
- Publication number
- JP4773421B2 JP4773421B2 JP2007333157A JP2007333157A JP4773421B2 JP 4773421 B2 JP4773421 B2 JP 4773421B2 JP 2007333157 A JP2007333157 A JP 2007333157A JP 2007333157 A JP2007333157 A JP 2007333157A JP 4773421 B2 JP4773421 B2 JP 4773421B2
- Authority
- JP
- Japan
- Prior art keywords
- torsion spring
- resistors
- resistor
- mems device
- stage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/10—Scanning systems
- G02B26/101—Scanning systems with both horizontal and vertical deflecting means, e.g. raster or XY scanners
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
- G01D5/12—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means
- G01D5/14—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage
- G01D5/18—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying effective impedance of discharge tubes or semiconductor devices
- G01D5/183—Sensing rotation or linear movement using strain, force or pressure sensors
- G01D5/185—Sensing rotation or linear movement using strain, force or pressure sensors using piezoelectric sensors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0018—Structures acting upon the moving or flexible element for transforming energy into mechanical movement or vice versa, i.e. actuators, sensors, generators
- B81B3/0021—Transducers for transforming electrical into mechanical energy or vice versa
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B5/00—Devices comprising elements which are movable in relation to each other, e.g. comprising slidable or rotatable elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16F—SPRINGS; SHOCK-ABSORBERS; MEANS FOR DAMPING VIBRATION
- F16F1/00—Springs
- F16F1/36—Springs made of rubber or other material having high internal friction, e.g. thermoplastic elastomers
- F16F1/42—Springs made of rubber or other material having high internal friction, e.g. thermoplastic elastomers characterised by the mode of stressing
- F16F1/48—Springs made of rubber or other material having high internal friction, e.g. thermoplastic elastomers characterised by the mode of stressing loaded mainly in torsion
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0051—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/03—Microengines and actuators
- B81B2201/034—Electrical rotating micromachines
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
- G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
- G02B26/0841—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD the reflecting element being moved or deformed by electrostatic means
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
- G02B6/35—Optical coupling means having switching means
- G02B6/3586—Control or adjustment details, e.g. calibrating
- G02B6/359—Control or adjustment details, e.g. calibrating of the position of the moving element itself during switching, i.e. without monitoring the switched beams
Description
20,120 固定フレーム、
30,130 ねじりバネ、
41 駆動くし型電極、
42 固定くし型電極、
C 導線、
P パッド、
R 抵抗体。
Claims (4)
- ステージの両側を支持する一対のねじりバネと、
前記ねじりバネに形成された4個の抵抗体と、
前記抵抗体の抵抗変化を検出する電気配線とを備え、
前記ねじりバネは、(100)面を有するn型シリコン基板であって<100>方向に形成され、前記ねじりバネに形成された前記4個の抵抗体は、それぞれが前記ねじりバネの中央軸と交差して、<110>方向に形成され、
前記4個の抵抗体はW字型に配されたことを特徴とする回転型MEMSデバイス。 - 前記抵抗体は、p型不純物でドーピングされていることを特徴とする請求項1に記載の回転型MEMSデバイス。
- 前記p型不純物は、ボロンであることを特徴とする請求項2に記載の回転型MEMSデバイス。
- 前記ねじりバネ上の前記4個の抵抗体は、隣接する抵抗体が互いに直交する方向に形成されたことを特徴とする請求項1〜3のいずれか一つに記載の回転型MEMSデバイス。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070004415A KR100868758B1 (ko) | 2007-01-15 | 2007-01-15 | 압저항 센서를 구비한 회전형 mems 디바이스 |
KR10-2007-0004415 | 2007-01-15 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008168423A JP2008168423A (ja) | 2008-07-24 |
JP4773421B2 true JP4773421B2 (ja) | 2011-09-14 |
Family
ID=39400916
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007333157A Expired - Fee Related JP4773421B2 (ja) | 2007-01-15 | 2007-12-25 | 回転型memsデバイス |
Country Status (5)
Country | Link |
---|---|
US (1) | US7642576B2 (ja) |
EP (1) | EP1944596B1 (ja) |
JP (1) | JP4773421B2 (ja) |
KR (1) | KR100868758B1 (ja) |
DE (1) | DE602008001728D1 (ja) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2194417B1 (en) * | 2008-12-05 | 2012-04-18 | Funai Electric Co., Ltd. | Vibrating mirror element |
JP5157857B2 (ja) | 2008-12-05 | 2013-03-06 | 船井電機株式会社 | 振動ミラー素子 |
DE102009026506A1 (de) * | 2009-05-27 | 2010-12-02 | Robert Bosch Gmbh | Mikromechanisches Bauteil und Herstellungsverfahren für ein mikromechanisches Bauteil |
DE102010029074B4 (de) * | 2010-05-18 | 2018-03-08 | Robert Bosch Gmbh | Anbindungsstruktur für Mikroschwingeneinrichtungen |
DE102010029925A1 (de) | 2010-06-10 | 2011-12-15 | Robert Bosch Gmbh | Vorrichtung und Verfahren zur Lageerkennung einer Mikroschwingvorrichtung |
JP2014182227A (ja) * | 2013-03-18 | 2014-09-29 | Seiko Epson Corp | 光スキャナー、画像表示装置およびヘッドマウントディスプレイ |
JP2014182226A (ja) * | 2013-03-18 | 2014-09-29 | Seiko Epson Corp | 光スキャナー、アクチュエーター、画像表示装置およびヘッドマウントディスプレイ |
DE102016200599A1 (de) * | 2016-01-19 | 2017-07-20 | Robert Bosch Gmbh | MEMS-Vorrichtung und Betriebsverfahren für eine MEMS-Vorrichtung |
CN109269690B (zh) * | 2018-09-18 | 2019-10-18 | 清华大学 | 应激传感系统及应用应激传感系统的机器人 |
CN111064173B (zh) * | 2019-12-03 | 2021-11-02 | 国网浙江平阳县供电有限责任公司 | 一种配电网防雷装置 |
CN112817143A (zh) * | 2020-12-31 | 2021-05-18 | 歌尔股份有限公司 | Mems扫描镜 |
CN113184799B (zh) * | 2021-04-09 | 2023-07-18 | 清华大学深圳国际研究生院 | 一种带硅基压阻式传感器的mems器件 |
Family Cites Families (21)
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NL171309C (nl) * | 1970-03-02 | 1983-03-01 | Hitachi Ltd | Werkwijze voor de vervaardiging van een halfgeleiderlichaam, waarbij een laag van siliciumdioxyde wordt gevormd op een oppervlak van een monokristallijn lichaam van silicium. |
US4696188A (en) * | 1981-10-09 | 1987-09-29 | Honeywell Inc. | Semiconductor device microstructure |
JPH0413975A (ja) * | 1990-05-07 | 1992-01-17 | Nec Corp | 半導体加速度センサ |
US5488862A (en) | 1993-10-18 | 1996-02-06 | Armand P. Neukermans | Monolithic silicon rate-gyro with integrated sensors |
DE69637351T2 (de) | 1995-06-05 | 2008-11-27 | Nihon Shingo K.K. | Elektromagnetischer stellantrieb |
US6000280A (en) * | 1995-07-20 | 1999-12-14 | Cornell Research Foundation, Inc. | Drive electrodes for microfabricated torsional cantilevers |
JPH09145509A (ja) * | 1995-11-29 | 1997-06-06 | Matsushita Electric Works Ltd | 圧力センサ |
US5694237A (en) | 1996-09-25 | 1997-12-02 | University Of Washington | Position detection of mechanical resonant scanner mirror |
US6388279B1 (en) * | 1997-06-11 | 2002-05-14 | Denso Corporation | Semiconductor substrate manufacturing method, semiconductor pressure sensor and manufacturing method thereof |
US6683358B1 (en) * | 1997-11-11 | 2004-01-27 | Asahi Kasei Kabushiki Kaisha | Silicon integrated accelerometer |
JP4238437B2 (ja) * | 1999-01-25 | 2009-03-18 | 株式会社デンソー | 半導体力学量センサとその製造方法 |
US20010051014A1 (en) | 2000-03-24 | 2001-12-13 | Behrang Behin | Optical switch employing biased rotatable combdrive devices and methods |
JP2005106679A (ja) * | 2003-09-30 | 2005-04-21 | Nitta Ind Corp | 多軸センサユニットおよびこれを利用した多軸センサ |
US7183137B2 (en) * | 2003-12-01 | 2007-02-27 | Taiwan Semiconductor Manufacturing Company | Method for dicing semiconductor wafers |
WO2005116621A2 (en) * | 2004-05-25 | 2005-12-08 | The Government Of The United States Of America, As Represented By The Secretary Of The Navy Naval Research Laboratory | Microelectro-mechanical chemical sensor |
JP4749790B2 (ja) * | 2004-08-20 | 2011-08-17 | 佐々木 実 | マイクロミラーデバイスとその製造方法、マイクロミラーデバイスの角度計測方法、およびマイクロミラーデバイス応用装置 |
US6988412B1 (en) * | 2004-11-30 | 2006-01-24 | Endevco Corporation | Piezoresistive strain concentrator |
JP2006171182A (ja) * | 2004-12-14 | 2006-06-29 | Olympus Corp | 光偏向器 |
JP2006220574A (ja) * | 2005-02-14 | 2006-08-24 | Hitachi Ltd | 回転体力学量測定装置および回転体力学量計測システム |
JP2007322466A (ja) * | 2006-05-30 | 2007-12-13 | Canon Inc | 光偏向器、及びそれを用いた光学機器 |
JP4775165B2 (ja) * | 2006-08-07 | 2011-09-21 | セイコーエプソン株式会社 | アクチュエータ |
-
2007
- 2007-01-15 KR KR1020070004415A patent/KR100868758B1/ko not_active IP Right Cessation
- 2007-09-20 US US11/858,183 patent/US7642576B2/en not_active Expired - Fee Related
- 2007-12-25 JP JP2007333157A patent/JP4773421B2/ja not_active Expired - Fee Related
-
2008
- 2008-01-10 EP EP08150158A patent/EP1944596B1/en not_active Expired - Fee Related
- 2008-01-10 DE DE602008001728T patent/DE602008001728D1/de active Active
Also Published As
Publication number | Publication date |
---|---|
EP1944596B1 (en) | 2010-07-14 |
EP1944596A1 (en) | 2008-07-16 |
US20080168670A1 (en) | 2008-07-17 |
KR100868758B1 (ko) | 2008-11-13 |
US7642576B2 (en) | 2010-01-05 |
DE602008001728D1 (de) | 2010-08-26 |
JP2008168423A (ja) | 2008-07-24 |
KR20080067181A (ko) | 2008-07-18 |
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