JP4750131B2 - ３軸磁気センサのための単一パッケージの設計 - Google Patents

３軸磁気センサのための単一パッケージの設計 Download PDF

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Publication number
JP4750131B2
JP4750131B2 JP2007548309A JP2007548309A JP4750131B2 JP 4750131 B2 JP4750131 B2 JP 4750131B2 JP 2007548309 A JP2007548309 A JP 2007548309A JP 2007548309 A JP2007548309 A JP 2007548309A JP 4750131 B2 JP4750131 B2 JP 4750131B2
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Japan
Prior art keywords
sensor
axis sensor
substrate
axis
groove
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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JP2007548309A
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English (en)
Japanese (ja)
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JP2008525800A (ja
JP2008525800A5 (enExample
Inventor
ボーリンガー，マイケル
ワン，ホン
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Honeywell International Inc
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Honeywell International Inc
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Publication of JP2008525800A publication Critical patent/JP2008525800A/ja
Publication of JP2008525800A5 publication Critical patent/JP2008525800A5/ja
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Expired - Lifetime legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00—Arrangements or instruments for measuring magnetic variables
    • G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
    • G01R33/04—Measuring direction or magnitude of magnetic fields or magnetic flux using the flux-gate principle
    • G01R33/05—Measuring direction or magnitude of magnetic fields or magnetic flux using the flux-gate principle in thin-film element
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00—Arrangements or instruments for measuring magnetic variables
    • G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
    • G01R33/025—Compensating stray fields
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C17/00—Compasses; Devices for ascertaining true or magnetic north for navigation or surveying purposes
    • G01C17/02—Magnetic compasses
    • G01C17/28—Electromagnetic compasses
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00—Arrangements or instruments for measuring magnetic variables
    • G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
    • G01R33/0206—Three-component magnetometers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Electromagnetism (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Measuring Magnetic Variables (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP2007548309A 2004-12-22 2005-12-15 ３軸磁気センサのための単一パッケージの設計 Expired - Lifetime JP4750131B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/022,495 2004-12-22
US11/022,495 US7271586B2 (en) 2003-12-04 2004-12-22 Single package design for 3-axis magnetic sensor
PCT/US2005/045372 WO2006068909A1 (en) 2004-12-22 2005-12-15 Single package design for 3-axis magnetic sensor

Publications (3)

Publication Number Publication Date
JP2008525800A JP2008525800A (ja) 2008-07-17
JP2008525800A5 JP2008525800A5 (enExample) 2008-09-04
JP4750131B2 true JP4750131B2 (ja) 2011-08-17

Family

ID=36096213

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007548309A Expired - Lifetime JP4750131B2 (ja) 2004-12-22 2005-12-15 ３軸磁気センサのための単一パッケージの設計

Country Status (6)

Country Link
US (1) US7271586B2 (enExample)
EP (1) EP1839064B1 (enExample)
JP (1) JP4750131B2 (enExample)
KR (1) KR101167490B1 (enExample)
CN (1) CN101120263B (enExample)
WO (1) WO2006068909A1 (enExample)

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EP1860451B1 (en) * 2005-03-17 2012-06-27 Yamaha Corporation 3-axis magnetic sensor and manufacturing method thereof
JP4904052B2 (ja) 2005-12-27 2012-03-28 アルプス電気株式会社 磁気方位検出装置
WO2008099822A1 (ja) 2007-02-14 2008-08-21 Alps Electric Co., Ltd. センサチップ、検出装置および検出装置の製造方法
US20090072823A1 (en) * 2007-09-17 2009-03-19 Honeywell International Inc. 3d integrated compass package
US7564237B2 (en) 2007-10-23 2009-07-21 Honeywell International Inc. Integrated 3-axis field sensor and fabrication methods
US7790502B2 (en) * 2007-12-10 2010-09-07 Honeywell International Inc. Method of manufacturing flexible semiconductor assemblies
KR100950676B1 (ko) * 2008-01-07 2010-03-31 에스티에스반도체통신 주식회사 3축 지자기 센서 및 그 제조 방법
JP5154275B2 (ja) * 2008-03-24 2013-02-27 アルプス電気株式会社 磁気センサパッケージ
US7994773B2 (en) 2008-07-11 2011-08-09 Data Security, Inc. Apparatus and method for in-field magnetic measurements
EP2343566A4 (en) * 2008-09-29 2014-04-16 Omron Tateisi Electronics Co MAGNETIC FIELD DETECTION ELEMENT AND SIGNAL TRANSMISSION ELEMENT
US8703543B2 (en) * 2009-07-14 2014-04-22 Honeywell International Inc. Vertical sensor assembly method
KR101107747B1 (ko) * 2009-07-30 2012-01-20 (주)파트론 플립 본딩 방식으로 실장된 플럭스게이트 소자를 갖는 전자 나침반 패키지 및 이의 제조 방법
KR101090990B1 (ko) * 2009-10-27 2011-12-13 주식회사 아모센스 지자기 센서 및 그의 제조방법
US20110147867A1 (en) * 2009-12-23 2011-06-23 Everspin Technologies, Inc. Method of vertically mounting an integrated circuit
US20110234218A1 (en) * 2010-03-24 2011-09-29 Matthieu Lagouge Integrated multi-axis hybrid magnetic field sensor
US20120105058A1 (en) * 2010-10-29 2012-05-03 Iakov Veniaminovitch Kopelevitch Magnetic field sensing
DE102011001422A1 (de) * 2011-03-21 2012-09-27 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Sensormodul und Verfahren zum Herstellen eines Sensormoduls
US8316552B1 (en) 2011-05-05 2012-11-27 Honeywell International Inc. Systems and methods for three-axis sensor chip packages
CN102214589B (zh) * 2011-05-31 2013-04-24 华亚平 垂直芯片电子封装方法
US8459112B2 (en) 2011-06-09 2013-06-11 Honeywell International Inc. Systems and methods for three dimensional sensors
US9360345B2 (en) 2011-10-10 2016-06-07 Honeywell International Inc. Extended smart position sensing range using electromagnetics
US8618795B1 (en) * 2012-06-29 2013-12-31 General Electric Company Sensor assembly for use in medical position and orientation tracking
US20140005527A1 (en) * 2012-06-29 2014-01-02 General Electric Company Method and system for dynamic referencing and registration used with surgical and interventional procedures
CN104755948B (zh) 2012-10-12 2018-04-10 美新公司 单晶三轴磁场传感器
ITTO20121067A1 (it) 2012-12-12 2014-06-13 St Microelectronics Srl Sensore magnetoresistivo integrato in una piastrina per il rilevamento di campi magnetici perpendicolari alla piastrina nonche' suo procedimento di fabbricazione
JP6373642B2 (ja) * 2013-08-05 2018-08-15 ローム株式会社 半導体装置
CN104375098B (zh) * 2013-08-15 2018-11-02 上海矽睿科技有限公司 磁传感装置及该装置的制备工艺
US10288697B2 (en) 2015-01-13 2019-05-14 Stmicroelectronics S.R.L. AMR-type integrated magnetoresistive sensor for detecting magnetic fields perpendicular to the chip
CN105607015A (zh) * 2016-01-19 2016-05-25 三峡大学 一种三维空间磁场测量系统
CN106405453A (zh) * 2016-11-15 2017-02-15 上海交通大学 一种三轴磁通门传感器
JP6932561B2 (ja) * 2017-06-15 2021-09-08 キヤノン電子株式会社 ３軸磁気検出装置および人工衛星
US11543465B2 (en) * 2019-04-05 2023-01-03 The Regents Of The University Of Michigan Encapsulation methods for fluid-communicating magnetoelastic sensors
JP7302330B2 (ja) * 2019-06-26 2023-07-04 Tdk株式会社 複合センサーモジュール

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61150382A (ja) * 1984-12-25 1986-07-09 Agency Of Ind Science & Technol 触覚センサと基板との接続方法
US5850624A (en) * 1995-10-18 1998-12-15 The Charles Machine Works, Inc. Electronic compass
JP2004006752A (ja) * 2002-03-27 2004-01-08 Yamaha Corp 磁気センサおよびその製造方法
JP2004151008A (ja) * 2002-10-31 2004-05-27 Ricoh Co Ltd Ｍｉセンサ、ｍｉセンサ用のｉｃチップおよびそのｍｉセンサを備えた電子装置
JP2004271481A (ja) * 2003-03-12 2004-09-30 Citizen Watch Co Ltd ３軸磁気センサー

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FR2697628B1 (fr) * 1992-10-29 1995-02-03 Sextant Avionique Capteur d'une grandeur physique orientée.
US7107666B2 (en) 1998-07-23 2006-09-19 Bh Electronics Method of manufacturing an ultra-miniature magnetic device
US20030070282A1 (en) 2000-04-27 2003-04-17 Bh Electronics, Inc. Ultra-miniature magnetic device
JP4711274B2 (ja) 2000-11-27 2011-06-29 アンリツ産機システム株式会社 組合せ計量装置
US6818985B1 (en) * 2001-12-22 2004-11-16 Skyworks Solutions, Inc. Embedded antenna and semiconductor die on a substrate in a laminate package
JP4177032B2 (ja) * 2002-06-04 2008-11-05 株式会社ワコー 三次元磁気センサおよびその製造方法
EP1892537B1 (en) * 2002-07-29 2011-05-25 Yamaha Corporation Three-axis magnetic sensor
US20040084211A1 (en) 2002-10-30 2004-05-06 Sensonix, Inc. Z-axis packaging for electronic device and method for making same
CN2598149Y (zh) * 2002-12-30 2004-01-07 胜开科技股份有限公司 光传感器封装改良构造
US7005850B2 (en) 2003-02-20 2006-02-28 Sensonix, Inc. Magnetic sensor system and method for installing magnetic sensors
US7126330B2 (en) * 2004-06-03 2006-10-24 Honeywell International, Inc. Integrated three-dimensional magnetic sensing device and method to fabricate an integrated three-dimensional magnetic sensing device
WO2006008799A1 (ja) * 2004-07-16 2006-01-26 C & N Inc 磁気センサ組立体、地磁気検出装置、素子組立体および携帯端末装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61150382A (ja) * 1984-12-25 1986-07-09 Agency Of Ind Science & Technol 触覚センサと基板との接続方法
US5850624A (en) * 1995-10-18 1998-12-15 The Charles Machine Works, Inc. Electronic compass
JP2004006752A (ja) * 2002-03-27 2004-01-08 Yamaha Corp 磁気センサおよびその製造方法
JP2004151008A (ja) * 2002-10-31 2004-05-27 Ricoh Co Ltd Ｍｉセンサ、ｍｉセンサ用のｉｃチップおよびそのｍｉセンサを備えた電子装置
JP2004271481A (ja) * 2003-03-12 2004-09-30 Citizen Watch Co Ltd ３軸磁気センサー

Also Published As

Publication number Publication date
KR20070093422A (ko) 2007-09-18
CN101120263A (zh) 2008-02-06
US7271586B2 (en) 2007-09-18
KR101167490B1 (ko) 2012-07-19
JP2008525800A (ja) 2008-07-17
EP1839064B1 (en) 2011-09-21
EP1839064A1 (en) 2007-10-03
CN101120263B (zh) 2012-06-13
WO2006068909A1 (en) 2006-06-29
US20050122101A1 (en) 2005-06-09

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