JP4748323B2 - 感放射線性樹脂組成物、層間絶縁膜およびマイクロレンズ、ならびにそれらの製造方法 - Google Patents

感放射線性樹脂組成物、層間絶縁膜およびマイクロレンズ、ならびにそれらの製造方法 Download PDF

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JP4748323B2
JP4748323B2 JP2007051870A JP2007051870A JP4748323B2 JP 4748323 B2 JP4748323 B2 JP 4748323B2 JP 2007051870 A JP2007051870 A JP 2007051870A JP 2007051870 A JP2007051870 A JP 2007051870A JP 4748323 B2 JP4748323 B2 JP 4748323B2
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weight
naphthoquinonediazide
sulfonic acid
acid ester
radiation
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JP2007051870A
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Japanese (ja)
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JP2008216491A (ja
Inventor
謙一 濱田
政暁 花村
孝浩 飯島
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JSR Corp
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JSR Corp
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Priority to JP2007051870A priority Critical patent/JP4748323B2/ja
Priority to KR1020080018915A priority patent/KR101355223B1/ko
Priority to TW097107118A priority patent/TWI430026B/zh
Priority to CN2008100821455A priority patent/CN101256360B/zh
Publication of JP2008216491A publication Critical patent/JP2008216491A/ja
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
    • C08F220/32—Esters containing oxygen in addition to the carboxy oxygen containing epoxy radicals
    • C08F220/325—Esters containing oxygen in addition to the carboxy oxygen containing epoxy radicals containing glycidyl radical, e.g. glycidyl (meth)acrylate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D201/00—Coating compositions based on unspecified macromolecular compounds
    • C09D201/02—Coating compositions based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • C09D201/06—Coating compositions based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups containing oxygen atoms
    • C09D201/08—Carboxyl groups
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G03F7/0397—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0755—Non-macromolecular compounds containing Si-O, Si-C or Si-N bonds

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  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Materials For Photolithography (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
JP2007051870A 2007-03-01 2007-03-01 感放射線性樹脂組成物、層間絶縁膜およびマイクロレンズ、ならびにそれらの製造方法 Active JP4748323B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2007051870A JP4748323B2 (ja) 2007-03-01 2007-03-01 感放射線性樹脂組成物、層間絶縁膜およびマイクロレンズ、ならびにそれらの製造方法
KR1020080018915A KR101355223B1 (ko) 2007-03-01 2008-02-29 감방사선성 수지 조성물, 층간 절연막 및 마이크로렌즈, 및이들의 제조 방법
TW097107118A TWI430026B (zh) 2007-03-01 2008-02-29 Sensitive linear resin composition, interlayer insulating film and microlens, and the like
CN2008100821455A CN101256360B (zh) 2007-03-01 2008-03-03 放射线敏感性树脂组合物、层间绝缘膜和微透镜、以及它们的制备方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007051870A JP4748323B2 (ja) 2007-03-01 2007-03-01 感放射線性樹脂組成物、層間絶縁膜およびマイクロレンズ、ならびにそれらの製造方法

Publications (2)

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JP2008216491A JP2008216491A (ja) 2008-09-18
JP4748323B2 true JP4748323B2 (ja) 2011-08-17

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JP2007051870A Active JP4748323B2 (ja) 2007-03-01 2007-03-01 感放射線性樹脂組成物、層間絶縁膜およびマイクロレンズ、ならびにそれらの製造方法

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JP (1) JP4748323B2 (ko)
KR (1) KR101355223B1 (ko)
CN (1) CN101256360B (ko)
TW (1) TWI430026B (ko)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101872123B (zh) * 2009-04-27 2013-07-24 Jsr株式会社 放射线敏感性树脂组合物、液晶显示用隔片或保护膜及其形成方法
KR101229960B1 (ko) * 2011-01-28 2013-02-06 한양대학교 산학협력단 광산발생제를 포함하는 테트라 폴리머 레지스트 및 이의 제조 방법
CN103703074B (zh) * 2012-06-01 2016-07-06 Lg化学株式会社 树脂组合物、使用该组合物形成的光学膜以及包括该光学膜的偏光板和液晶显示器
KR20200134225A (ko) * 2018-03-23 2020-12-01 니폰 제온 가부시키가이샤 비수계 이차 전지 전극용 바인더 조성물, 비수계 이차 전지 전극용 도전재 페이스트 조성물, 비수계 이차 전지 전극용 슬러리 조성물, 비수계 이차 전지용 전극 및 비수계 이차 전지
CN109467079B (zh) * 2018-11-19 2020-11-24 华南理工大学 一种有机功能化石墨烯材料及其制备方法和应用
TWI724765B (zh) * 2020-01-21 2021-04-11 達興材料股份有限公司 可雷射離型的組成物、其積層體和雷射離型方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06172676A (ja) * 1992-12-03 1994-06-21 Nippon Oil & Fats Co Ltd 紫外線硬化型防曇剤組成物
JPH07261391A (ja) * 1994-03-22 1995-10-13 Nippon Oil & Fats Co Ltd 光硬化性樹脂組成物
JP3543286B2 (ja) * 1996-03-08 2004-07-14 日本化薬株式会社 樹脂組成物、レジストインキ樹脂組成物及びこれらの硬化物
WO2000040632A1 (fr) * 1998-12-28 2000-07-13 Daicel Chemical Industries, Ltd. Composition de resine durcissable, copolymere modifie et composition de resine, et pate de verre photodurcissable pour developpement de type alcalin
JP2003043685A (ja) * 2001-08-03 2003-02-13 Showa Denko Kk 着色組成物及びカラーフィルター用感光性着色組成物
AU2002255353A1 (en) * 2001-05-15 2002-11-25 Showa Denko K. K. Photosensitive coloring compositon, color filter using the compositon and method of producing the same
TWI300795B (en) * 2001-08-21 2008-09-11 Mitsubishi Chem Corp Curable resin composition for die coating and process for producing color filter
JP4492393B2 (ja) * 2005-03-08 2010-06-30 チッソ株式会社 感光性組成物およびそれを用いた表示素子

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Publication number Publication date
CN101256360A (zh) 2008-09-03
KR101355223B1 (ko) 2014-01-24
JP2008216491A (ja) 2008-09-18
KR20080080453A (ko) 2008-09-04
TWI430026B (zh) 2014-03-11
TW200900857A (en) 2009-01-01
CN101256360B (zh) 2012-06-20

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