JP4737032B2 - コネクタ一体型センサ - Google Patents

コネクタ一体型センサ Download PDF

Info

Publication number
JP4737032B2
JP4737032B2 JP2006291284A JP2006291284A JP4737032B2 JP 4737032 B2 JP4737032 B2 JP 4737032B2 JP 2006291284 A JP2006291284 A JP 2006291284A JP 2006291284 A JP2006291284 A JP 2006291284A JP 4737032 B2 JP4737032 B2 JP 4737032B2
Authority
JP
Japan
Prior art keywords
elastic support
terminal
housing
terminals
connector
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2006291284A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008108615A (ja
Inventor
英毅 中林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Priority to JP2006291284A priority Critical patent/JP4737032B2/ja
Priority to DE102007000813.0A priority patent/DE102007000813B4/de
Publication of JP2008108615A publication Critical patent/JP2008108615A/ja
Application granted granted Critical
Publication of JP4737032B2 publication Critical patent/JP4737032B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66—Structural association with built-in electrical component
    • H01R13/665—Structural association with built-in electrical component with built-in electronic circuit
    • H01R13/6683—Structural association with built-in electrical component with built-in electronic circuit with built-in sensor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46—Bases; Cases
    • H01R13/52—Dustproof, splashproof, drip-proof, waterproof, or flameproof cases
    • H01R13/5219—Sealing means between coupling parts, e.g. interfacial seal

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Measuring Fluid Pressure (AREA)
JP2006291284A 2006-10-26 2006-10-26 コネクタ一体型センサ Expired - Fee Related JP4737032B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2006291284A JP4737032B2 (ja) 2006-10-26 2006-10-26 コネクタ一体型センサ
DE102007000813.0A DE102007000813B4 (de) 2006-10-26 2007-10-02 Mit einem Verbinder integrierter Sensor und Verfahren zum Herstellen von diesem

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006291284A JP4737032B2 (ja) 2006-10-26 2006-10-26 コネクタ一体型センサ

Publications (2)

Publication Number Publication Date
JP2008108615A JP2008108615A (ja) 2008-05-08
JP4737032B2 true JP4737032B2 (ja) 2011-07-27

Family

ID=39265032

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006291284A Expired - Fee Related JP4737032B2 (ja) 2006-10-26 2006-10-26 コネクタ一体型センサ

Country Status (2)

Country Link
JP (1) JP4737032B2 (de)
DE (1) DE102007000813B4 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013161607A (ja) * 2012-02-03 2013-08-19 Murakami Corp 給電用コネクタ

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008041035A1 (de) * 2008-08-06 2010-02-11 Robert Bosch Gmbh Elektronischer Sensor oder Sensorgerät, insbesondere Beschleunigungssensor, mit einem in ein Sensorgehäuse eingebauten Chipmodul
GB2508311B (en) * 2009-07-29 2014-07-09 Otter Controls Ltd Power Connector System
JP5494091B2 (ja) * 2010-03-24 2014-05-14 株式会社デンソー 液面検出装置の製造方法
JP5623920B2 (ja) * 2011-01-14 2014-11-12 日立オートモティブシステムズ株式会社 二重成型品、二重成型品の製造方法、および電池モジュール
JP2012226902A (ja) * 2011-04-18 2012-11-15 Iriso Electronics Co Ltd 導電部材へのチップ部品接続構造
JP2016091992A (ja) * 2014-10-30 2016-05-23 株式会社テージーケー ターミナルユニット、モータアクチュエータ及びターミナルホルダー
KR102376845B1 (ko) * 2017-05-15 2022-03-21 엘지이노텍 주식회사 커넥터 및 컨버터
JP6993310B2 (ja) 2018-09-18 2022-01-13 矢崎総業株式会社 コネクタ

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001160461A (ja) * 1999-12-03 2001-06-12 Mikuni Corp コネクタ付き電子機器
JP2004286644A (ja) * 2003-03-24 2004-10-14 Denso Corp 圧力センサ

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS609080A (ja) * 1983-06-28 1985-01-18 住友電気工業株式会社 ダイオ−ド内蔵コネクタの製造方法
US4699445A (en) 1986-07-28 1987-10-13 Amp Incorporated Electrical terminal assembly for thermistors
JP3671563B2 (ja) 1996-12-09 2005-07-13 株式会社デンソー モールドｉｃをケースに固定した構造の半導体装置
JP2002042979A (ja) * 2000-07-21 2002-02-08 Sumitomo Wiring Syst Ltd コネクタ及びその製造方法
US20020089064A1 (en) 2001-01-08 2002-07-11 Jiahn-Chang Wu Flexible lead surface-mount semiconductor package
DE10220761A1 (de) 2001-05-23 2002-12-19 Continental Teves Ag & Co Ohg Elektronischer Sensor mit elektronischen Sensorbauelementen und Verfahren zu dessen Herstellung
JP2003070131A (ja) * 2001-08-28 2003-03-07 Sumitomo Wiring Syst Ltd ジャンクションボックスおよび該ジャンクションボックスのケース成形方法
JP2003264043A (ja) * 2002-03-07 2003-09-19 Auto Network Gijutsu Kenkyusho:Kk 電子素子内蔵コネクタ端子及びコネクタ端子への電子素子内蔵方法
DE10319470A1 (de) 2003-04-29 2004-11-25 W. C. Heraeus Gmbh & Co. Kg Metall-Kunststoff-Verbundbauteil und Verfahren zu dessen Herstellung
JP2004356494A (ja) 2003-05-30 2004-12-16 Hitachi Ltd 電子装置および圧力検出装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001160461A (ja) * 1999-12-03 2001-06-12 Mikuni Corp コネクタ付き電子機器
JP2004286644A (ja) * 2003-03-24 2004-10-14 Denso Corp 圧力センサ

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013161607A (ja) * 2012-02-03 2013-08-19 Murakami Corp 給電用コネクタ
US9397439B2 (en) 2012-02-03 2016-07-19 Murakami Corporation Power feed connector

Also Published As

Publication number Publication date
JP2008108615A (ja) 2008-05-08
DE102007000813B4 (de) 2018-05-09
DE102007000813A1 (de) 2008-05-08

Similar Documents

Publication Publication Date Title
JP4737032B2 (ja) コネクタ一体型センサ
JP4548066B2 (ja) 圧力センサ
JP6032224B2 (ja) 電気コネクタおよびその製造方法
JP4830391B2 (ja) センサ装置の製造方法及びセンサ装置
KR101539803B1 (ko) 제어 장치 하우징
US7216546B2 (en) Pressure sensor having integrated temperature sensor
KR20150083029A (ko) 유체 매질의 온도 및 압력을 검출하기 위한 센서
US20120176866A1 (en) Ultrasonic sensor
JP2012507001A (ja) 温度センサ、その製造方法及び取り付け方法
JP2010071724A (ja) 樹脂モールド半導体センサ及び製造方法
WO2009087767A1 (ja) 圧力センサ及びその製造方法
US11175166B2 (en) Flow meter
US10651609B2 (en) Method of manufacturing physical quantity sensor device and physical quantity sensor device
KR101133886B1 (ko) 온도센서 조립체
JP2014211391A (ja) 圧力検出装置
JP5728437B2 (ja) 物理量測定装置及び物理量測定装置の製造方法
JP2010232207A (ja) 基板固定構造および物理量センサ
US8102654B2 (en) Fixation structure for connector of in-vehicle controller
JP2009133637A (ja) 回転検出装置及び回転検出装置の生産方法
JP6237490B2 (ja) 圧力センサおよびその製造方法
US11293825B2 (en) Pressure sensor with improved sealing
JP6879104B2 (ja) 物理量センサ
JP5720450B2 (ja) 圧力センサおよび圧力センサの取り付け構造
CN216899394U (zh) 一种同腔体充油式双芯片压力传感器
JP6111766B2 (ja) 圧力センサの実装構造および実装方法

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20081209

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20101206

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20101214

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110118

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20110405

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20110418

R151 Written notification of patent or utility model registration

Ref document number: 4737032

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R151

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140513

Year of fee payment: 3

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees