JP4736007B2 - 半導体ウエハの放射率決定方法およびその装置 - Google Patents

半導体ウエハの放射率決定方法およびその装置 Download PDF

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Publication number
JP4736007B2
JP4736007B2 JP2000091502A JP2000091502A JP4736007B2 JP 4736007 B2 JP4736007 B2 JP 4736007B2 JP 2000091502 A JP2000091502 A JP 2000091502A JP 2000091502 A JP2000091502 A JP 2000091502A JP 4736007 B2 JP4736007 B2 JP 4736007B2
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Prior art keywords
wafer
radiation
heating chamber
determining
intensity
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JP2000091502A
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Japanese (ja)
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JP2000323544A5 (enExample
JP2000323544A (ja
Inventor
ポール ヘッブ ジェフレイ
シャジ アリ
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アクセリス テクノロジーズ インコーポレーテッド
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D43/00—Lids or covers for rigid or semi-rigid containers
    • B65D43/02—Removable lids or covers
    • B65D43/0202—Removable lids or covers without integral tamper element
    • B65D43/0204—Removable lids or covers without integral tamper element secured by snapping over beads or projections
    • B65D43/021—Removable lids or covers without integral tamper element secured by snapping over beads or projections only on the inside, or a part turned to the inside, of the mouth
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/50—Containers, packaging elements or packages, specially adapted for particular articles or materials for living organisms, articles or materials sensitive to changes of environment or atmospheric conditions, e.g. land animals, birds, fish, water plants, non-aquatic plants, flower bulbs, cut flowers or foliage
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/0003—Radiation pyrometry, e.g. infrared or optical thermometry for sensing the radiant heat transfer of samples, e.g. emittance meter
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Mechanical Engineering (AREA)
  • Evolutionary Biology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Zoology (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Marine Sciences & Fisheries (AREA)
  • General Health & Medical Sciences (AREA)
  • Radiation Pyrometers (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2000091502A 1999-03-29 2000-03-29 半導体ウエハの放射率決定方法およびその装置 Expired - Fee Related JP4736007B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/280,308 US6183127B1 (en) 1999-03-29 1999-03-29 System and method for the real time determination of the in situ emissivity of a workpiece during processing
US280308 1999-03-29

Publications (3)

Publication Number Publication Date
JP2000323544A JP2000323544A (ja) 2000-11-24
JP2000323544A5 JP2000323544A5 (enExample) 2007-05-17
JP4736007B2 true JP4736007B2 (ja) 2011-07-27

Family

ID=23072533

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000091502A Expired - Fee Related JP4736007B2 (ja) 1999-03-29 2000-03-29 半導体ウエハの放射率決定方法およびその装置

Country Status (8)

Country Link
US (2) US6183127B1 (enExample)
EP (1) EP1041619B1 (enExample)
JP (1) JP4736007B2 (enExample)
KR (1) KR100483903B1 (enExample)
CN (1) CN1311226C (enExample)
DE (1) DE60040253D1 (enExample)
SG (2) SG101933A1 (enExample)
TW (1) TW452910B (enExample)

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JP2006005148A (ja) * 2004-06-17 2006-01-05 Sharp Corp 半導体薄膜の製造方法および製造装置
US7205231B2 (en) * 2004-10-29 2007-04-17 Axcelis Technologies, Inc. Method for in-situ uniformity optimization in a rapid thermal processing system
US7275861B2 (en) * 2005-01-31 2007-10-02 Veeco Instruments Inc. Calibration wafer and method of calibrating in situ temperatures
WO2008058397A1 (en) * 2006-11-15 2008-05-22 Mattson Technology Canada, Inc. Systems and methods for supporting a workpiece during heat-treating
US8222574B2 (en) * 2007-01-15 2012-07-17 Applied Materials, Inc. Temperature measurement and control of wafer support in thermal processing chamber
JP4263761B1 (ja) * 2008-01-17 2009-05-13 トヨタ自動車株式会社 減圧式加熱装置とその加熱方法および電子製品の製造方法
JP5718809B2 (ja) 2008-05-16 2015-05-13 マトソン テクノロジー、インコーポレイテッド 加工品の破壊を防止する方法および装置
US8111978B2 (en) * 2008-07-11 2012-02-07 Applied Materials, Inc. Rapid thermal processing chamber with shower head
WO2012009636A1 (en) * 2010-07-15 2012-01-19 Despatch Industries Limited Partnership Firing furnace configuration for thermal processing system
DE102011116243B4 (de) * 2011-10-17 2014-04-17 Centrotherm Photovoltaics Ag Vorrichtung zum Bestimmen der Temperatur eines Substrats
TWI628730B (zh) * 2011-11-10 2018-07-01 應用材料股份有限公司 透過雷射繞射測量3d半導體結構之溫度的設備及方法
CN103898449B (zh) * 2012-12-27 2017-06-06 北京北方微电子基地设备工艺研究中心有限责任公司 用于调节托盘温度的腔室及半导体加工设备
CN104726837B (zh) * 2013-12-18 2018-05-25 北京北方华创微电子装备有限公司 反应腔室及等离子体加工设备
JP6164097B2 (ja) * 2014-01-20 2017-07-19 ウシオ電機株式会社 熱処理装置
JP6295674B2 (ja) * 2014-01-20 2018-03-20 ウシオ電機株式会社 熱処理装置およびランプ制御方法
CN114927395B (zh) * 2022-04-24 2023-05-19 电子科技大学 一种实时控制NEA GaN电子源反射率的方法

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Also Published As

Publication number Publication date
JP2000323544A (ja) 2000-11-24
SG101933A1 (en) 2004-02-27
EP1041619A2 (en) 2000-10-04
CN1272556A (zh) 2000-11-08
KR20000071502A (ko) 2000-11-25
US6375348B1 (en) 2002-04-23
EP1041619A3 (en) 2003-01-15
DE60040253D1 (de) 2008-10-30
EP1041619B1 (en) 2008-09-17
KR100483903B1 (ko) 2005-04-15
SG109461A1 (en) 2005-03-30
CN1311226C (zh) 2007-04-18
TW452910B (en) 2001-09-01
US6183127B1 (en) 2001-02-06

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