JP4729661B2 - ヒロックが無いアルミニウム層及びその形成方法 - Google Patents

ヒロックが無いアルミニウム層及びその形成方法 Download PDF

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Publication number
JP4729661B2
JP4729661B2 JP2004193115A JP2004193115A JP4729661B2 JP 4729661 B2 JP4729661 B2 JP 4729661B2 JP 2004193115 A JP2004193115 A JP 2004193115A JP 2004193115 A JP2004193115 A JP 2004193115A JP 4729661 B2 JP4729661 B2 JP 4729661B2
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Japan
Prior art keywords
layer
barrier
pure
thickness
hillocks
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2004193115A
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English (en)
Japanese (ja)
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JP2005033198A5 (enExample
JP2005033198A (ja
Inventor
クン−ハオ，チャン
シィ−ミン，イェー
ジュイ−タン，イン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Innolux Corp
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Chimei Innolux Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from TW92119085A external-priority patent/TWI232541B/zh
Priority claimed from TW93103832A external-priority patent/TWI246874B/zh
Application filed by Chimei Innolux Corp filed Critical Chimei Innolux Corp
Publication of JP2005033198A publication Critical patent/JP2005033198A/ja
Publication of JP2005033198A5 publication Critical patent/JP2005033198A5/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B32B15/016—Layered products comprising a layer of metal all layers being exclusively metallic all layers being formed of aluminium or aluminium alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
    • H10D30/6737—Thin-film transistors [TFT] characterised by the electrodes characterised by the electrode materials
    • H10D30/6739—Conductor-insulator-semiconductor electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/441—Interconnections, e.g. scanning lines
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12736—Al-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12736—Al-base component
    • Y10T428/12764—Next to Al-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
    • Y10T428/264—Up to 3 mils
    • Y10T428/265—1 mil or less

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Thin Film Transistor (AREA)
JP2004193115A 2003-07-11 2004-06-30 ヒロックが無いアルミニウム層及びその形成方法 Expired - Fee Related JP4729661B2 (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
TW92119085A TWI232541B (en) 2003-07-11 2003-07-11 Aluminum hillock-free metal layer, electronic part, and thin flat transistor and its manufacturing method
TW92119085 2003-07-11
TW93103832 2004-02-17
TW93103832A TWI246874B (en) 2004-02-17 2004-02-17 Hillock-free aluminum metal layer and method of forming the same

Publications (3)

Publication Number Publication Date
JP2005033198A JP2005033198A (ja) 2005-02-03
JP2005033198A5 JP2005033198A5 (enExample) 2007-08-02
JP4729661B2 true JP4729661B2 (ja) 2011-07-20

Family

ID=33566914

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004193115A Expired - Fee Related JP4729661B2 (ja) 2003-07-11 2004-06-30 ヒロックが無いアルミニウム層及びその形成方法

Country Status (3)

Country Link
US (2) US7235310B2 (enExample)
JP (1) JP4729661B2 (enExample)
KR (1) KR101070761B1 (enExample)

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US7843632B2 (en) * 2006-08-16 2010-11-30 Cymer, Inc. EUV optics
JP4729661B2 (ja) * 2003-07-11 2011-07-20 奇美電子股▲ふん▼有限公司 ヒロックが無いアルミニウム層及びその形成方法
JP2005062802A (ja) * 2003-07-28 2005-03-10 Advanced Display Inc 薄膜トランジスタアレイ基板の製法
TWI255363B (en) * 2005-02-04 2006-05-21 Quanta Display Inc Liquid crystal display
KR101555707B1 (ko) * 2005-04-18 2015-09-25 가부시키가이샤 니콘 노광 장치 및 노광 방법, 그리고 디바이스 제조 방법
US8526137B2 (en) 2010-04-16 2013-09-03 International Business Machines Corporation Head comprising a crystalline alumina layer
CN101887893B (zh) * 2010-06-10 2012-01-11 深超光电（深圳）有限公司 一种薄膜晶体管阵列基板及其制造方法
TWI471946B (zh) * 2010-11-17 2015-02-01 群創光電股份有限公司 薄膜電晶體
CN102477531B (zh) * 2010-11-26 2015-03-25 鸿富锦精密工业（深圳）有限公司 被覆件及其制造方法
KR101224282B1 (ko) 2011-03-04 2013-01-21 주식회사 엘지화학 전도성 구조체 및 이의 제조방법
US9087839B2 (en) 2013-03-29 2015-07-21 International Business Machines Corporation Semiconductor structures with metal lines
CN103779358A (zh) * 2014-01-27 2014-05-07 京东方科技集团股份有限公司 一种阵列基板及其制作方法、显示装置
WO2015174678A1 (ko) * 2014-05-12 2015-11-19 주식회사 엘지화학 전도성 구조체 및 이의 제조방법
CN105077163A (zh) * 2015-07-19 2015-11-25 中盐榆林盐化有限公司 一种富硒盐及其制备方法
JP2017092330A (ja) * 2015-11-13 2017-05-25 株式会社神戸製鋼所 デバイス用配線膜
CN107464830A (zh) * 2017-07-18 2017-12-12 武汉华星光电半导体显示技术有限公司 阵列基板及制作方法、显示面板
KR102502646B1 (ko) * 2018-06-27 2023-02-24 삼성디스플레이 주식회사 표시패널 및 그 제조방법

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US4206472A (en) * 1977-12-27 1980-06-03 International Business Machines Corporation Thin film structures and method for fabricating same
JPS6380550A (ja) * 1986-09-24 1988-04-11 Nikon Corp 半導体装置の配線前駆体
US5580800A (en) * 1993-03-22 1996-12-03 Semiconductor Energy Laboratory Co., Ltd. Method of patterning aluminum containing group IIIb Element
US5518805A (en) * 1994-04-28 1996-05-21 Xerox Corporation Hillock-free multilayer metal lines for high performance thin film structures
US5625233A (en) * 1995-01-13 1997-04-29 Ibm Corporation Thin film multi-layer oxygen diffusion barrier consisting of refractory metal, refractory metal aluminide, and aluminum oxide
KR0186206B1 (ko) * 1995-11-21 1999-05-01 구자홍 액정표시소자 및 그의 제조방법
JPH10199827A (ja) * 1996-12-28 1998-07-31 Casio Comput Co Ltd 配線構造及びそれを用いた表示装置
TW574394B (en) * 1997-07-15 2004-02-01 Micron Technology Inc Method of using hydrogen and oxygen gas in sputter deposition of aluminum-containing films and aluminum-containing films derived therefrom
JP3916334B2 (ja) 1999-01-13 2007-05-16 シャープ株式会社 薄膜トランジスタ
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Also Published As

Publication number Publication date
US20070224730A1 (en) 2007-09-27
US20050008834A1 (en) 2005-01-13
JP2005033198A (ja) 2005-02-03
US7235310B2 (en) 2007-06-26
KR20050009159A (ko) 2005-01-24
US7944056B2 (en) 2011-05-17
KR101070761B1 (ko) 2011-10-31

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