JP4684584B2 - マスク及びその製造方法、並びに、露光方法 - Google Patents

マスク及びその製造方法、並びに、露光方法 Download PDF

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Publication number
JP4684584B2
JP4684584B2 JP2004203098A JP2004203098A JP4684584B2 JP 4684584 B2 JP4684584 B2 JP 4684584B2 JP 2004203098 A JP2004203098 A JP 2004203098A JP 2004203098 A JP2004203098 A JP 2004203098A JP 4684584 B2 JP4684584 B2 JP 4684584B2
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JP
Japan
Prior art keywords
pattern
contact hole
hole pattern
arrangement
mask
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2004203098A
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English (en)
Japanese (ja)
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JP2005055878A5 (enExample
JP2005055878A (ja
Inventor
賢治 山添
謙治 斉藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2004203098A priority Critical patent/JP4684584B2/ja
Priority to US10/896,538 priority patent/US7399558B2/en
Publication of JP2005055878A publication Critical patent/JP2005055878A/ja
Publication of JP2005055878A5 publication Critical patent/JP2005055878A5/ja
Application granted granted Critical
Publication of JP4684584B2 publication Critical patent/JP4684584B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/36—Masks having proximity correction features; Preparation thereof, e.g. optical proximity correction [OPC] design processes

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
JP2004203098A 2003-07-23 2004-07-09 マスク及びその製造方法、並びに、露光方法 Expired - Fee Related JP4684584B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2004203098A JP4684584B2 (ja) 2003-07-23 2004-07-09 マスク及びその製造方法、並びに、露光方法
US10/896,538 US7399558B2 (en) 2003-07-23 2004-07-22 Mask and manufacturing method thereof and exposure method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003278046 2003-07-23
JP2004203098A JP4684584B2 (ja) 2003-07-23 2004-07-09 マスク及びその製造方法、並びに、露光方法

Publications (3)

Publication Number Publication Date
JP2005055878A JP2005055878A (ja) 2005-03-03
JP2005055878A5 JP2005055878A5 (enExample) 2010-07-29
JP4684584B2 true JP4684584B2 (ja) 2011-05-18

Family

ID=34137905

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004203098A Expired - Fee Related JP4684584B2 (ja) 2003-07-23 2004-07-09 マスク及びその製造方法、並びに、露光方法

Country Status (2)

Country Link
US (1) US7399558B2 (enExample)
JP (1) JP4684584B2 (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7251807B2 (en) * 2005-02-24 2007-07-31 Synopsys, Inc. Method and apparatus for identifying a manufacturing problem area in a layout using a process-sensitivity model
US7475382B2 (en) * 2005-02-24 2009-01-06 Synopsys, Inc. Method and apparatus for determining an improved assist feature configuration in a mask layout
JP4612849B2 (ja) * 2005-03-01 2011-01-12 キヤノン株式会社 露光方法、露光装置及びデバイス製造方法
JP4499616B2 (ja) * 2005-05-31 2010-07-07 富士通マイクロエレクトロニクス株式会社 露光用マスクとその製造方法、及び半導体装置の製造方法
JP4750525B2 (ja) 2005-10-14 2011-08-17 キヤノン株式会社 露光方法及びデバイス製造方法
JP4352068B2 (ja) 2006-09-08 2009-10-28 株式会社東芝 露光方法及び半導体装置の製造方法
JP4814044B2 (ja) * 2006-10-05 2011-11-09 ルネサスエレクトロニクス株式会社 パターン設計方法
JP5571289B2 (ja) * 2008-02-08 2014-08-13 ピーエスフォー ルクスコ エスエイアールエル 露光用マスク及びパターン形成方法
JP4635085B2 (ja) * 2008-03-03 2011-02-16 株式会社東芝 半導体装置の製造方法
JP2010074026A (ja) * 2008-09-22 2010-04-02 Toshiba Corp 露光方法、及び半導体装置
JP5354803B2 (ja) * 2010-06-28 2013-11-27 株式会社ブイ・テクノロジー 露光装置
JP2012053286A (ja) 2010-09-01 2012-03-15 Renesas Electronics Corp フォトマスクと、それを用いた半導体装置の製造装置および方法と、フォトマスクのパターン配置方法
US20130095431A1 (en) * 2011-10-17 2013-04-18 Shenzhen China Star Optoelectronics Technology Co., Ltd. Fabricating method for controlling hole-wall angle of contact hole in lcd device
TWI632400B (zh) * 2011-11-16 2018-08-11 成洛勳 線光源發生裝置及其柱狀透鏡板系統
JP6581759B2 (ja) * 2014-07-17 2019-09-25 Hoya株式会社 フォトマスク、フォトマスクの製造方法、フォトマスクブランク及び表示装置の製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0315845A (ja) * 1989-06-14 1991-01-24 Hitachi Ltd マスク及びマスク作製方法
JPH118179A (ja) * 1997-06-17 1999-01-12 Hitachi Ltd パタン形成方法
JP3119217B2 (ja) * 1997-10-31 2000-12-18 日本電気株式会社 フォトマスクおよびフォトマスクを使用した露光方法
JP2001110719A (ja) * 1999-10-14 2001-04-20 Hitachi Ltd 露光方法
JP3768794B2 (ja) * 2000-10-13 2006-04-19 株式会社ルネサステクノロジ 半導体集積回路装置の製造方法
JP3870093B2 (ja) * 2002-01-08 2007-01-17 キヤノン株式会社 露光方法及び装置
EP1450206B1 (en) * 2003-02-21 2016-04-20 Canon Kabushiki Kaisha Mask and its manufacturing method, exposure, and semiconductor device fabrication method

Also Published As

Publication number Publication date
US20050037267A1 (en) 2005-02-17
JP2005055878A (ja) 2005-03-03
US7399558B2 (en) 2008-07-15

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