JP4680797B2 - リードフレームおよびこのリードフレームを用いた光接続部品ならびにこの光接続部品の製造方法 - Google Patents

リードフレームおよびこのリードフレームを用いた光接続部品ならびにこの光接続部品の製造方法 Download PDF

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Publication number
JP4680797B2
JP4680797B2 JP2006052653A JP2006052653A JP4680797B2 JP 4680797 B2 JP4680797 B2 JP 4680797B2 JP 2006052653 A JP2006052653 A JP 2006052653A JP 2006052653 A JP2006052653 A JP 2006052653A JP 4680797 B2 JP4680797 B2 JP 4680797B2
Authority
JP
Japan
Prior art keywords
lead frame
lead
molded body
lead pattern
molded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2006052653A
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English (en)
Japanese (ja)
Other versions
JP2007232907A (ja
Inventor
渉 桜井
和人 斎藤
英夫 沼田
知章 田窪
英人 古山
浩史 濱崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Sumitomo Electric Industries Ltd
Original Assignee
Toshiba Corp
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Sumitomo Electric Industries Ltd filed Critical Toshiba Corp
Priority to JP2006052653A priority Critical patent/JP4680797B2/ja
Priority to TW096106743A priority patent/TWI375054B/zh
Priority to CNB2007100004905A priority patent/CN100561268C/zh
Priority to US11/711,862 priority patent/US7364369B2/en
Priority to KR1020070020197A priority patent/KR100975023B1/ko
Publication of JP2007232907A publication Critical patent/JP2007232907A/ja
Application granted granted Critical
Publication of JP4680797B2 publication Critical patent/JP4680797B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4202—Packages, e.g. shape, construction, internal or external details for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Mechanical Coupling Of Light Guides (AREA)
JP2006052653A 2006-02-28 2006-02-28 リードフレームおよびこのリードフレームを用いた光接続部品ならびにこの光接続部品の製造方法 Expired - Fee Related JP4680797B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2006052653A JP4680797B2 (ja) 2006-02-28 2006-02-28 リードフレームおよびこのリードフレームを用いた光接続部品ならびにこの光接続部品の製造方法
TW096106743A TWI375054B (en) 2006-02-28 2007-02-27 Lead frame, optical coupling part using lead frame, and manufacturing method of optical coupling part
CNB2007100004905A CN100561268C (zh) 2006-02-28 2007-02-28 引线框架、使用引线框架的光耦合部件、以及光耦合部件的制造方法
US11/711,862 US7364369B2 (en) 2006-02-28 2007-02-28 Lead frame, optical coupling part using lead frame, and manufacturing method of optical coupling part
KR1020070020197A KR100975023B1 (ko) 2006-02-28 2007-02-28 리드 프레임, 리드 프레임을 이용하는 광 접속 부품, 및 광접속 부품의 제조 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006052653A JP4680797B2 (ja) 2006-02-28 2006-02-28 リードフレームおよびこのリードフレームを用いた光接続部品ならびにこの光接続部品の製造方法

Publications (2)

Publication Number Publication Date
JP2007232907A JP2007232907A (ja) 2007-09-13
JP4680797B2 true JP4680797B2 (ja) 2011-05-11

Family

ID=38479016

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006052653A Expired - Fee Related JP4680797B2 (ja) 2006-02-28 2006-02-28 リードフレームおよびこのリードフレームを用いた光接続部品ならびにこの光接続部品の製造方法

Country Status (5)

Country Link
US (1) US7364369B2 (zh)
JP (1) JP4680797B2 (zh)
KR (1) KR100975023B1 (zh)
CN (1) CN100561268C (zh)
TW (1) TWI375054B (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4732198B2 (ja) * 2006-03-10 2011-07-27 住友電気工業株式会社 光接続部品の製造方法および光接続部品
JP4970908B2 (ja) 2006-11-20 2012-07-11 住友電気工業株式会社 光ファイバ位置決め部品の製造方法および光ファイバ位置決め部品
JP2009103758A (ja) 2007-10-19 2009-05-14 Toshiba Corp 光伝送路保持部材と光モジュール及びその実装方法
CN101458366B (zh) * 2007-12-13 2010-12-01 旭丽电子(广州)有限公司 光耦合器导线架料带
US8705906B2 (en) * 2009-04-23 2014-04-22 Korea Electronics Technology Institute Photoelectric conversion module
JP5956815B2 (ja) * 2012-04-20 2016-07-27 日本航空電子工業株式会社 光モジュール用基体及び光モジュール

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0954227A (ja) * 1995-08-11 1997-02-25 Nippon Telegr & Teleph Corp <Ntt> 光実装用成形基板及びその製造方法
JP2001337249A (ja) * 2000-05-24 2001-12-07 Matsushita Electric Works Ltd 光通信用レセプタクル
JP2004279439A (ja) * 2003-03-12 2004-10-07 Toshiba Corp 光半導体モジュール及びその製造方法
JP2007094153A (ja) * 2005-09-29 2007-04-12 Toshiba Corp 光伝送路保持部材及び光モジュール

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0593826A (ja) * 1991-10-01 1993-04-16 Sumitomo Electric Ind Ltd 光モジユールの製造方法
KR19980034352A (ko) * 1996-11-06 1998-08-05 김광호 반도체 칩 패키지용 리드 프레임
JP2001159724A (ja) 1999-12-02 2001-06-12 Seiko Epson Corp 光モジュール及びその製造方法並びに光伝達装置
US7101091B2 (en) * 2001-02-21 2006-09-05 Zarlink Semiconductor, Inc. Apparatus for coupling a fiber optic cable to an optoelectronic device, a system including the apparatus, and a method of forming the same
JP3795877B2 (ja) 2003-07-28 2006-07-12 株式会社東芝 光半導体モジュール及びその製造方法
JP3967318B2 (ja) 2003-12-26 2007-08-29 株式会社東芝 光伝送路保持部材
EP1548475B1 (en) 2003-12-26 2011-03-30 Kabushiki Kaisha Toshiba Optical semiconductor module and method of manufacturing the same
US7352935B2 (en) 2004-08-17 2008-04-01 Kabushiki Kaisha Toshiba Optoelectronic conversion header, LSI package with interface module, method of manufacturing optoelectronic conversion header, and optical interconnection system
JP2007003906A (ja) 2005-06-24 2007-01-11 Toshiba Corp 光伝送路保持部材と光モジュール
JP4788448B2 (ja) * 2006-04-05 2011-10-05 住友電気工業株式会社 光接続部品の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0954227A (ja) * 1995-08-11 1997-02-25 Nippon Telegr & Teleph Corp <Ntt> 光実装用成形基板及びその製造方法
JP2001337249A (ja) * 2000-05-24 2001-12-07 Matsushita Electric Works Ltd 光通信用レセプタクル
JP2004279439A (ja) * 2003-03-12 2004-10-07 Toshiba Corp 光半導体モジュール及びその製造方法
JP2007094153A (ja) * 2005-09-29 2007-04-12 Toshiba Corp 光伝送路保持部材及び光モジュール

Also Published As

Publication number Publication date
US7364369B2 (en) 2008-04-29
TW200801622A (en) 2008-01-01
TWI375054B (en) 2012-10-21
KR20070089637A (ko) 2007-08-31
KR100975023B1 (ko) 2010-08-11
US20070212001A1 (en) 2007-09-13
JP2007232907A (ja) 2007-09-13
CN100561268C (zh) 2009-11-18
CN101029954A (zh) 2007-09-05

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