JP4679519B2 - 磁気シールドパネル - Google Patents
磁気シールドパネル Download PDFInfo
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- JP4679519B2 JP4679519B2 JP2006526014A JP2006526014A JP4679519B2 JP 4679519 B2 JP4679519 B2 JP 4679519B2 JP 2006526014 A JP2006526014 A JP 2006526014A JP 2006526014 A JP2006526014 A JP 2006526014A JP 4679519 B2 JP4679519 B2 JP 4679519B2
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- magnetic shield
- plate
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- shield panel
- panel
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- Expired - Fee Related
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- 229910000831 Steel Inorganic materials 0.000 claims description 12
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- 239000000696 magnetic material Substances 0.000 claims description 10
- 238000005452 bending Methods 0.000 claims description 8
- 238000009413 insulation Methods 0.000 claims description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- 229910001220 stainless steel Inorganic materials 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 239000010935 stainless steel Substances 0.000 claims description 5
- 229910001335 Galvanized steel Inorganic materials 0.000 claims description 3
- 239000008397 galvanized steel Substances 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- FJMNNXLGOUYVHO-UHFFFAOYSA-N aluminum zinc Chemical compound [Al].[Zn] FJMNNXLGOUYVHO-UHFFFAOYSA-N 0.000 claims 1
- 239000011819 refractory material Substances 0.000 claims 1
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- 230000005389 magnetism Effects 0.000 description 4
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- 239000011889 copper foil Substances 0.000 description 3
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- 230000000149 penetrating effect Effects 0.000 description 3
- 239000011435 rock Substances 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 229920000178 Acrylic resin Polymers 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- 208000019901 Anxiety disease Diseases 0.000 description 2
- 244000043261 Hevea brasiliensis Species 0.000 description 2
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- 238000010276 construction Methods 0.000 description 2
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- 230000000694 effects Effects 0.000 description 2
- 239000006260 foam Substances 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 230000014759 maintenance of location Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229920003052 natural elastomer Polymers 0.000 description 2
- 229920001194 natural rubber Polymers 0.000 description 2
- 230000035699 permeability Effects 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 229920003051 synthetic elastomer Polymers 0.000 description 2
- 239000005061 synthetic rubber Substances 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
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- 229920001971 elastomer Polymers 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000002241 glass-ceramic Substances 0.000 description 1
- 239000005337 ground glass Substances 0.000 description 1
- 229910052602 gypsum Inorganic materials 0.000 description 1
- 239000010440 gypsum Substances 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 239000005300 metallic glass Substances 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910000889 permalloy Inorganic materials 0.000 description 1
- 239000011120 plywood Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
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- 239000000843 powder Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
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Images
Classifications
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- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04B—GENERAL BUILDING CONSTRUCTIONS; WALLS, e.g. PARTITIONS; ROOFS; FLOORS; CEILINGS; INSULATION OR OTHER PROTECTION OF BUILDINGS
- E04B1/00—Constructions in general; Structures which are not restricted either to walls, e.g. partitions, or floors or ceilings or roofs
- E04B1/62—Insulation or other protection; Elements or use of specified material therefor
- E04B1/92—Protection against other undesired influences or dangers
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04B—GENERAL BUILDING CONSTRUCTIONS; WALLS, e.g. PARTITIONS; ROOFS; FLOORS; CEILINGS; INSULATION OR OTHER PROTECTION OF BUILDINGS
- E04B2/00—Walls, e.g. partitions, for buildings; Wall construction with regard to insulation; Connections specially adapted to walls
- E04B2/74—Removable non-load-bearing partitions; Partitions with a free upper edge
- E04B2/7407—Removable non-load-bearing partitions; Partitions with a free upper edge assembled using frames with infill panels or coverings only; made-up of panels and a support structure incorporating posts
- E04B2/7448—Removable non-load-bearing partitions; Partitions with a free upper edge assembled using frames with infill panels or coverings only; made-up of panels and a support structure incorporating posts with separate framed panels without intermediary posts, extending from floor to ceiling
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04B—GENERAL BUILDING CONSTRUCTIONS; WALLS, e.g. PARTITIONS; ROOFS; FLOORS; CEILINGS; INSULATION OR OTHER PROTECTION OF BUILDINGS
- E04B2/00—Walls, e.g. partitions, for buildings; Wall construction with regard to insulation; Connections specially adapted to walls
- E04B2/74—Removable non-load-bearing partitions; Partitions with a free upper edge
- E04B2/7407—Removable non-load-bearing partitions; Partitions with a free upper edge assembled using frames with infill panels or coverings only; made-up of panels and a support structure incorporating posts
- E04B2/7453—Removable non-load-bearing partitions; Partitions with a free upper edge assembled using frames with infill panels or coverings only; made-up of panels and a support structure incorporating posts with panels and support posts, extending from floor to ceiling
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04B—GENERAL BUILDING CONSTRUCTIONS; WALLS, e.g. PARTITIONS; ROOFS; FLOORS; CEILINGS; INSULATION OR OTHER PROTECTION OF BUILDINGS
- E04B2/00—Walls, e.g. partitions, for buildings; Wall construction with regard to insulation; Connections specially adapted to walls
- E04B2/74—Removable non-load-bearing partitions; Partitions with a free upper edge
- E04B2/82—Removable non-load-bearing partitions; Partitions with a free upper edge characterised by the manner in which edges are connected to the building; Means therefor; Special details of easily-removable partitions as far as related to the connection with other parts of the building
- E04B2/821—Connections between two opposed surfaces (i.e. floor and ceiling) by means of a device offering a restraining force acting in the plane of the partition
- E04B2/824—Connections between two opposed surfaces (i.e. floor and ceiling) by means of a device offering a restraining force acting in the plane of the partition restrained elastically at one surface and inelastically at the opposing surface
-
- E—FIXED CONSTRUCTIONS
- E06—DOORS, WINDOWS, SHUTTERS, OR ROLLER BLINDS IN GENERAL; LADDERS
- E06B—FIXED OR MOVABLE CLOSURES FOR OPENINGS IN BUILDINGS, VEHICLES, FENCES OR LIKE ENCLOSURES IN GENERAL, e.g. DOORS, WINDOWS, BLINDS, GATES
- E06B5/00—Doors, windows, or like closures for special purposes; Border constructions therefor
- E06B5/10—Doors, windows, or like closures for special purposes; Border constructions therefor for protection against air-raid or other war-like action; for other protective purposes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04B—GENERAL BUILDING CONSTRUCTIONS; WALLS, e.g. PARTITIONS; ROOFS; FLOORS; CEILINGS; INSULATION OR OTHER PROTECTION OF BUILDINGS
- E04B1/00—Constructions in general; Structures which are not restricted either to walls, e.g. partitions, or floors or ceilings or roofs
- E04B1/62—Insulation or other protection; Elements or use of specified material therefor
- E04B1/92—Protection against other undesired influences or dangers
- E04B2001/925—Protection against harmful electro-magnetic or radio-active radiations, e.g. X-rays
Landscapes
- Engineering & Computer Science (AREA)
- Architecture (AREA)
- Civil Engineering (AREA)
- Structural Engineering (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Building Environments (AREA)
Description
(Sm・μs)/Sa>1 ・・・(1)
尚、Smは磁気シールド部材2の横断面の面積、μsは磁気シールド部材2の磁性材料の比透磁率、及びSaは隣接する磁気シールド部材2間の空間の横断面積を示す。
Claims (11)
- 磁性材料で形成される2つ以上の磁気シールド部材と、前記磁気シールド部材が取り付けられる金属板と、前記磁気シールド部材を保持する断熱部材と、を有する磁気シールドパネルにおいて、
前記断熱部材は、前記2つ以上の磁気シールド部材間に充填され、前記磁気シールド部材の撓みを防止すべく前記磁気シールド部材を保持するように構成され、前記断熱部材は複数の直方体形状を有し、前記複数の断熱部材は、各々の断熱部材の間の継ぎ目が一直線上に配置されないように配置される、磁気シールドパネル。 - 他の磁気シールドパネルと接続されるための中空の柱部材が設けられ、前記中空の柱部材は内部に磁気シールド部材を有する、請求項1に記載の磁気シールドパネル。
- 前記断熱部材は耐火性材料で形成される、請求項1又は2に記載の磁気シールドパネル。
- 2つ以上の前記金属板を用いて成る、請求項1〜3のいずれか1項に記載の磁気シールドパネル。
- 前記磁気シールド部材は略Z字の形状に形成される、請求項1〜4のいずれか1項に記載の磁気シールドパネル。
- 前記金属板は鉄、鋼、銅、アルミニウム、ステンレス鋼、亜鉛鍍金鋼、アルミニウム−亜鉛鍍金鋼を含むグループから選択された材料で形成される、請求項1〜5のいずれか1項に記載の磁気シールドパネル。
- 磁性材料で形成される2つ以上の磁気シールド部材と、前記磁気シールド部材が取り付けられる半透明の板材と、前記磁気シールド部材を保持する半透明の断熱部材と、を有する磁気シールドパネルにおいて、
前記半透明の断熱部材は、前記2つ以上の磁気シールド部材間に充填され、前記磁気シールド部材の撓みを防止すべく前記磁気シールド部材を保持するように構成され、
前記断熱部材は複数の直方体形状を有し、前記複数の断熱部材は、各々の断熱部材の間の継ぎ目が一直線上に配置されないように配置される、磁気シールドパネル。 - 他の磁気シールドパネルと接続されるための中空の柱部材が設けられ、前記中空の柱部材は内部に磁気シールド部材を有する、請求項7に記載の磁気シールドパネル。
- 電導性材料で形成される電波シールド材をさらに有し、前記電波シールド材は、前記半透明の板材に取り付けられた金属メッシュである、請求項7又は8に記載の磁気シールドパネル。
- 2つ以上の前記半透明の板材を用いて成る、請求項7〜9のいずれか1項に記載の磁気シールドパネル。
- 前記磁気シールド部材は略Z字の形状に形成される、請求項7〜10のいずれか1項に記載の磁気シールドパネル。
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003321808 | 2003-09-12 | ||
JP2003434917 | 2003-12-26 | ||
JP2004037428 | 2004-02-13 | ||
JP2004037427 | 2004-02-13 | ||
JP2004184019 | 2004-06-22 | ||
PCT/JP2004/013598 WO2005026462A1 (en) | 2003-09-12 | 2004-09-10 | Magnetic shield panel |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007505241A JP2007505241A (ja) | 2007-03-08 |
JP4679519B2 true JP4679519B2 (ja) | 2011-04-27 |
Family
ID=34317735
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006526014A Expired - Fee Related JP4679519B2 (ja) | 2003-09-12 | 2004-09-10 | 磁気シールドパネル |
Country Status (7)
Country | Link |
---|---|
US (1) | US7589285B2 (ja) |
EP (1) | EP1678388A1 (ja) |
JP (1) | JP4679519B2 (ja) |
KR (1) | KR100688363B1 (ja) |
MY (1) | MY148713A (ja) |
TW (2) | TWI287065B (ja) |
WO (1) | WO2005026462A1 (ja) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4605778B2 (ja) * | 2005-06-13 | 2011-01-05 | 鹿島建設株式会社 | 磁気シールド簾体及びその連結構造 |
JP5025428B2 (ja) * | 2007-11-06 | 2012-09-12 | 新日鉄エンジニアリング株式会社 | 磁気シールドパネルの連結構造及び方法 |
US11238329B2 (en) * | 2007-12-24 | 2022-02-01 | Dynamics Inc. | Payment cards and devices with gift card, global integration, and magnetic stripe reader communication functionality |
US8868939B2 (en) | 2008-09-26 | 2014-10-21 | Qualcomm Incorporated | Portable power supply device with outlet connector |
US8401469B2 (en) * | 2008-09-26 | 2013-03-19 | Hewlett-Packard Development Company, L.P. | Shield for use with a computing device that receives an inductive signal transmission |
US8850045B2 (en) | 2008-09-26 | 2014-09-30 | Qualcomm Incorporated | System and method for linking and sharing resources amongst devices |
US8688037B2 (en) | 2008-09-26 | 2014-04-01 | Hewlett-Packard Development Company, L.P. | Magnetic latching mechanism for use in mating a mobile computing device to an accessory device |
US8385822B2 (en) | 2008-09-26 | 2013-02-26 | Hewlett-Packard Development Company, L.P. | Orientation and presence detection for use in configuring operations of computing devices in docked environments |
JP5404272B2 (ja) * | 2009-09-13 | 2014-01-29 | 鹿島建設株式会社 | 磁気シールド工法及び構造 |
US9514131B1 (en) * | 2010-05-30 | 2016-12-06 | Crisi Medical Systems, Inc. | Medication container encoding, verification, and identification |
US10492991B2 (en) | 2010-05-30 | 2019-12-03 | Crisi Medical Systems, Inc. | Medication container encoding, verification, and identification |
JP2013197235A (ja) * | 2012-03-19 | 2013-09-30 | Ohtama Co Ltd | 磁気シールド装置及び磁気シールド装置の製造方法 |
KR101502092B1 (ko) * | 2014-07-09 | 2015-03-12 | 엘아이지넥스원 주식회사 | 방호패널 |
US10104816B2 (en) * | 2016-02-05 | 2018-10-16 | Taiwan Semiconductor Manufacturing Co., Ltd. | Board, semiconductor fabrication plant (FAB) and fabrication facility |
CN106922097A (zh) * | 2017-05-08 | 2017-07-04 | 天津中新安德科技有限公司 | 一种新型钻井装置电气设备自动化控制柜 |
KR102567771B1 (ko) * | 2019-01-15 | 2023-08-18 | 주식회사 히타치하이테크 | 전자계 차폐판, 그 제조 방법, 전자계 차폐 구조 및 반도체 제조 환경 |
US11729958B1 (en) * | 2022-07-22 | 2023-08-15 | Microsoft Technology Licensing, Llc | Electromagnetic interference and/or radio frequency attenuating infrastructure insulation |
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JP2002164686A (ja) * | 2000-11-27 | 2002-06-07 | Kajima Corp | すだれ型磁気シールド方法及び装置 |
WO2003059030A1 (en) * | 2002-01-08 | 2003-07-17 | 4-D Neuroimaging Oy | Wall element for magnetically shielded room and magnetically shielded room |
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-
2004
- 2004-09-10 EP EP04773242A patent/EP1678388A1/en not_active Withdrawn
- 2004-09-10 TW TW093127419A patent/TWI287065B/zh not_active IP Right Cessation
- 2004-09-10 WO PCT/JP2004/013598 patent/WO2005026462A1/en active IP Right Grant
- 2004-09-10 MY MYPI20043690A patent/MY148713A/en unknown
- 2004-09-10 US US10/571,310 patent/US7589285B2/en not_active Expired - Fee Related
- 2004-09-10 KR KR1020067004949A patent/KR100688363B1/ko not_active IP Right Cessation
- 2004-09-10 JP JP2006526014A patent/JP4679519B2/ja not_active Expired - Fee Related
- 2004-09-10 TW TW095127497A patent/TWI287066B/zh not_active IP Right Cessation
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2002164686A (ja) * | 2000-11-27 | 2002-06-07 | Kajima Corp | すだれ型磁気シールド方法及び装置 |
WO2003059030A1 (en) * | 2002-01-08 | 2003-07-17 | 4-D Neuroimaging Oy | Wall element for magnetically shielded room and magnetically shielded room |
Also Published As
Publication number | Publication date |
---|---|
US7589285B2 (en) | 2009-09-15 |
TW200513578A (en) | 2005-04-16 |
EP1678388A1 (en) | 2006-07-12 |
US20070029110A1 (en) | 2007-02-08 |
JP2007505241A (ja) | 2007-03-08 |
KR100688363B1 (ko) | 2007-03-02 |
KR20060039028A (ko) | 2006-05-04 |
MY148713A (en) | 2013-05-31 |
TWI287066B (en) | 2007-09-21 |
TW200643275A (en) | 2006-12-16 |
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