JP4676232B2 - パターン形成方法 - Google Patents

パターン形成方法 Download PDF

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Publication number
JP4676232B2
JP4676232B2 JP2005110921A JP2005110921A JP4676232B2 JP 4676232 B2 JP4676232 B2 JP 4676232B2 JP 2005110921 A JP2005110921 A JP 2005110921A JP 2005110921 A JP2005110921 A JP 2005110921A JP 4676232 B2 JP4676232 B2 JP 4676232B2
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Japan
Prior art keywords
thermal transfer
epoxy resin
acrylate
meth
transfer layer
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Expired - Lifetime
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JP2005110921A
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English (en)
Japanese (ja)
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JP2006294741A (ja
JP2006294741A5 (enrdf_load_stackoverflow
Inventor
勝弘 吉田
忠雄 瀬戸
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ゼネラルテクノロジー株式会社
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Priority to JP2005110921A priority Critical patent/JP4676232B2/ja
Publication of JP2006294741A publication Critical patent/JP2006294741A/ja
Publication of JP2006294741A5 publication Critical patent/JP2006294741A5/ja
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Publication of JP4676232B2 publication Critical patent/JP4676232B2/ja
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  • Thermal Transfer Or Thermal Recording In General (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
JP2005110921A 2005-04-07 2005-04-07 パターン形成方法 Expired - Lifetime JP4676232B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005110921A JP4676232B2 (ja) 2005-04-07 2005-04-07 パターン形成方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005110921A JP4676232B2 (ja) 2005-04-07 2005-04-07 パターン形成方法

Publications (3)

Publication Number Publication Date
JP2006294741A JP2006294741A (ja) 2006-10-26
JP2006294741A5 JP2006294741A5 (enrdf_load_stackoverflow) 2008-05-22
JP4676232B2 true JP4676232B2 (ja) 2011-04-27

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ID=37415010

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JP2005110921A Expired - Lifetime JP4676232B2 (ja) 2005-04-07 2005-04-07 パターン形成方法

Country Status (1)

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JP (1) JP4676232B2 (enrdf_load_stackoverflow)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006059464A1 (de) * 2006-12-14 2008-06-19 Henkel Kgaa Polyurethan-Kaschierklebstoff
JP2010205955A (ja) * 2009-03-04 2010-09-16 Micro Coatec Kk 熱伝導性電子回路基板およびそれを用いた電子機器ならびにその製造方法
JP2015065384A (ja) * 2013-09-26 2015-04-09 東洋アルミニウム株式会社 回路基板の製造方法
CN105291621A (zh) * 2015-11-30 2016-02-03 北京雅点聚美广告策划有限公司 一种金属板材表面图案的形成方法
WO2024004652A1 (ja) * 2022-06-28 2024-01-04 東レ株式会社 バンプ付き構造物の製造方法およびバンプパターンを有する基板

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04148585A (ja) * 1990-10-12 1992-05-21 Oki Electric Ind Co Ltd 回路パターンの形成方法
JPH04292993A (ja) * 1991-03-22 1992-10-16 Toppan Printing Co Ltd レジストパターン形成用転写記録媒体
JPH06237064A (ja) * 1993-02-12 1994-08-23 Mitsubishi Rayon Co Ltd プリント配線板の製造方法
JPH1093222A (ja) * 1996-09-11 1998-04-10 Goou Kagaku Kogyo Kk プリント配線板の製造方法
JP2005010205A (ja) * 2003-06-16 2005-01-13 Mitsui Chemicals Inc 感光性組成物及びそれを用いたプリント配線基板の製造方法

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JP2006294741A (ja) 2006-10-26

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