JP4663679B2 - 光硬化性樹脂組成物、ドライフィルム、硬化物、及びプリント配線板 - Google Patents

光硬化性樹脂組成物、ドライフィルム、硬化物、及びプリント配線板 Download PDF

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JP4663679B2
JP4663679B2 JP2007123829A JP2007123829A JP4663679B2 JP 4663679 B2 JP4663679 B2 JP 4663679B2 JP 2007123829 A JP2007123829 A JP 2007123829A JP 2007123829 A JP2007123829 A JP 2007123829A JP 4663679 B2 JP4663679 B2 JP 4663679B2
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resin composition
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JP2008281653A (ja
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陽子 柴▲崎▼
聖夫 有馬
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Taiyo Holdings Co Ltd
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Taiyo Holdings Co Ltd
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Priority to JP2007123829A priority Critical patent/JP4663679B2/ja
Priority to KR1020080042339A priority patent/KR101022073B1/ko
Priority to TW097116838A priority patent/TWI400565B/zh
Priority to CN2008100818560A priority patent/CN101303527B/zh
Priority to CN201110180880.1A priority patent/CN102393603B/zh
Publication of JP2008281653A publication Critical patent/JP2008281653A/ja
Priority to KR1020100135400A priority patent/KR101120300B1/ko
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C251/00—Compounds containing nitrogen atoms doubly-bound to a carbon skeleton
    • C07C251/32—Oximes
    • C07C251/62—Oximes having oxygen atoms of oxyimino groups esterified
    • C07C251/64—Oximes having oxygen atoms of oxyimino groups esterified by carboxylic acids
    • C07C251/66—Oximes having oxygen atoms of oxyimino groups esterified by carboxylic acids with the esterifying carboxyl groups bound to hydrogen atoms, to acyclic carbon atoms or to carbon atoms of rings other than six-membered aromatic rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C08F290/062—Polyethers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/08—Epoxidised polymerised polyenes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/105—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having substances, e.g. indicators, for forming visible images

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  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Inorganic Chemistry (AREA)
  • Materials For Photolithography (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
JP2007123829A 2007-05-08 2007-05-08 光硬化性樹脂組成物、ドライフィルム、硬化物、及びプリント配線板 Active JP4663679B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2007123829A JP4663679B2 (ja) 2007-05-08 2007-05-08 光硬化性樹脂組成物、ドライフィルム、硬化物、及びプリント配線板
KR1020080042339A KR101022073B1 (ko) 2007-05-08 2008-05-07 광경화성 수지 조성물, 드라이 필름, 경화물, 및 인쇄배선판
TW097116838A TWI400565B (zh) 2007-05-08 2008-05-07 A photohardenable resin composition, a dry film, a hardened product, and a printed wiring board
CN2008100818560A CN101303527B (zh) 2007-05-08 2008-05-08 光固化性树脂组合物、干膜、固化物以及印刷电路板
CN201110180880.1A CN102393603B (zh) 2007-05-08 2008-05-08 光固化性树脂组合物、干膜、固化物以及印刷电路板
KR1020100135400A KR101120300B1 (ko) 2007-05-08 2010-12-27 광경화성 수지 조성물, 드라이 필름, 경화물, 및 인쇄 배선판

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007123829A JP4663679B2 (ja) 2007-05-08 2007-05-08 光硬化性樹脂組成物、ドライフィルム、硬化物、及びプリント配線板

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JP2008281653A JP2008281653A (ja) 2008-11-20
JP4663679B2 true JP4663679B2 (ja) 2011-04-06

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Country Status (4)

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JP (1) JP4663679B2 (ko)
KR (2) KR101022073B1 (ko)
CN (2) CN101303527B (ko)
TW (1) TWI400565B (ko)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009239181A (ja) * 2008-03-28 2009-10-15 Taiyo Ink Mfg Ltd プリント配線板用樹脂組成物、ドライフィルムおよびプリント配線板
JP5317809B2 (ja) * 2009-04-20 2013-10-16 富士フイルム株式会社 着色硬化性組成物、着色パターンの形成方法、カラーフィルタ、および液晶表示装置
JP5475350B2 (ja) * 2009-07-02 2014-04-16 太陽ホールディングス株式会社 光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板
JP5559999B2 (ja) * 2009-07-21 2014-07-23 太陽ホールディングス株式会社 光硬化性樹脂組成物
JP5620656B2 (ja) * 2009-08-19 2014-11-05 太陽ホールディングス株式会社 光硬化性樹脂組成物
JP5672698B2 (ja) * 2009-12-28 2015-02-18 セイコーエプソン株式会社 記録方法
CN103140800B (zh) * 2010-09-29 2015-11-25 株式会社钟化 新颖感光性树脂组合物制作套组及其利用
JP6084353B2 (ja) * 2010-12-28 2017-02-22 太陽インキ製造株式会社 光硬化性樹脂組成物の製造方法、ドライフィルムの製造方法、硬化物の製造方法およびプリント配線板の製造方法
WO2012141153A1 (ja) * 2011-04-13 2012-10-18 太陽インキ製造株式会社 光硬化性樹脂組成物、ドライフィルム、硬化物及びプリント配線板
JP6001922B2 (ja) * 2011-05-27 2016-10-05 太陽インキ製造株式会社 熱硬化性樹脂組成物、それを用いたドライフィルムおよびプリント配線板
JP5315441B1 (ja) * 2012-03-30 2013-10-16 太陽インキ製造株式会社 光硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
JP6185742B2 (ja) * 2013-04-19 2017-08-23 デクセリアルズ株式会社 異方性導電フィルム、接続方法、及び接合体
CN104427742B (zh) * 2013-08-28 2017-08-22 鹏鼎控股(深圳)股份有限公司 覆盖膜及电路板
CN104950574A (zh) * 2014-03-31 2015-09-30 太阳油墨（苏州）有限公司 光固化性热固化性树脂组合物、干膜、固化物及印刷电路板
JP2016027384A (ja) * 2014-06-25 2016-02-18 Jsr株式会社 ベゼル形成用感光性組成物、ベゼル及び表示装置
JP6704224B2 (ja) * 2015-04-15 2020-06-03 太陽インキ製造株式会社 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
CN106444282A (zh) * 2015-08-13 2017-02-22 常州强力先端电子材料有限公司 一种含肟酯类光引发剂的感光性树脂组合物及其应用
CN106569389B (zh) * 2015-10-12 2021-07-16 东友精细化工有限公司 自发光感光树脂组合物、滤色器和包括滤色器的显示设备
KR20220127879A (ko) * 2020-02-20 2022-09-20 후지필름 가부시키가이샤 착색 조성물, 막, 컬러 필터, 고체 촬상 소자 및 화상 표시 장치
WO2023233894A1 (ja) * 2022-05-30 2023-12-07 コニカミノルタ株式会社 活性線硬化型インクジェットレジストインク、硬化膜形成方法、硬化膜、プリント配線基板、および電子機器

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JP2006010793A (ja) * 2004-06-23 2006-01-12 Jsr Corp 着色層形成用感放射線性組成物およびカラーフィルタ
JP2006195425A (ja) * 2004-12-15 2006-07-27 Jsr Corp 着色層形成用感放射線性組成物、カラーフィルタおよびカラー液晶表示パネル
JP2006337421A (ja) * 2005-05-31 2006-12-14 Toyo Ink Mfg Co Ltd 感光性着色組成物およびカラーフィルタ
JP2007017458A (ja) * 2005-07-05 2007-01-25 Taiyo Ink Mfg Ltd 着色感光性樹脂組成物及びその硬化物
JP2007025358A (ja) * 2005-07-19 2007-02-01 Fujifilm Holdings Corp カラーフィルタ及びその製造方法
JP2007100074A (ja) * 2005-09-06 2007-04-19 Taiyo Ink Mfg Ltd 樹脂組成物及びその硬化物並びにそれを用いて得られるプリント配線板
JP2007108275A (ja) * 2005-10-12 2007-04-26 Toppan Printing Co Ltd 感光性赤色着色組成物、それを用いたカラーフィルタ基板、および半透過型液晶表示装置

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DE69620723T2 (de) 1995-12-22 2002-12-05 Mitsubishi Chem Corp Fotopolymerisierbare Zusammensetzung für einen Farbfilter, Farbfilter und Flüssigkristallanzeigevorrichtung
EP1395615B1 (en) * 2001-06-11 2009-10-21 Basf Se Oxime ester photoinitiators having a combined structure
JP3912405B2 (ja) * 2003-11-11 2007-05-09 三菱化学株式会社 硬化性組成物、硬化物、カラーフィルタ及び液晶表示装置
US7759043B2 (en) * 2004-08-18 2010-07-20 Ciba Specialty Chemicals Corp. Oxime ester photoinitiators
TW200728379A (en) * 2005-09-06 2007-08-01 Taiyo Ink Mfg Co Ltd Resin composition, cured product of the same, and printed circuit board made of the same

Patent Citations (7)

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Publication number Priority date Publication date Assignee Title
JP2006010793A (ja) * 2004-06-23 2006-01-12 Jsr Corp 着色層形成用感放射線性組成物およびカラーフィルタ
JP2006195425A (ja) * 2004-12-15 2006-07-27 Jsr Corp 着色層形成用感放射線性組成物、カラーフィルタおよびカラー液晶表示パネル
JP2006337421A (ja) * 2005-05-31 2006-12-14 Toyo Ink Mfg Co Ltd 感光性着色組成物およびカラーフィルタ
JP2007017458A (ja) * 2005-07-05 2007-01-25 Taiyo Ink Mfg Ltd 着色感光性樹脂組成物及びその硬化物
JP2007025358A (ja) * 2005-07-19 2007-02-01 Fujifilm Holdings Corp カラーフィルタ及びその製造方法
JP2007100074A (ja) * 2005-09-06 2007-04-19 Taiyo Ink Mfg Ltd 樹脂組成物及びその硬化物並びにそれを用いて得られるプリント配線板
JP2007108275A (ja) * 2005-10-12 2007-04-26 Toppan Printing Co Ltd 感光性赤色着色組成物、それを用いたカラーフィルタ基板、および半透過型液晶表示装置

Also Published As

Publication number Publication date
CN102393603B (zh) 2014-11-05
CN102393603A (zh) 2012-03-28
TW200910006A (en) 2009-03-01
KR101022073B1 (ko) 2011-03-17
KR101120300B1 (ko) 2012-03-06
TWI400565B (zh) 2013-07-01
CN101303527B (zh) 2013-02-13
KR20080099181A (ko) 2008-11-12
CN101303527A (zh) 2008-11-12
JP2008281653A (ja) 2008-11-20
KR20110013342A (ko) 2011-02-09

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