JP4660494B2 - 研磨カートリッジ - Google Patents

研磨カートリッジ Download PDF

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Publication number
JP4660494B2
JP4660494B2 JP2007035224A JP2007035224A JP4660494B2 JP 4660494 B2 JP4660494 B2 JP 4660494B2 JP 2007035224 A JP2007035224 A JP 2007035224A JP 2007035224 A JP2007035224 A JP 2007035224A JP 4660494 B2 JP4660494 B2 JP 4660494B2
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JP
Japan
Prior art keywords
polishing
substrate
tape
roller
unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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JP2007035224A
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English (en)
Japanese (ja)
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JP2007118187A (ja
JP2007118187A5 (enrdf_load_stackoverflow
Inventor
淳次 国沢
憲雄 木村
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Ebara Corp
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Ebara Corp
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Priority to JP2007035224A priority Critical patent/JP4660494B2/ja
Publication of JP2007118187A publication Critical patent/JP2007118187A/ja
Publication of JP2007118187A5 publication Critical patent/JP2007118187A5/ja
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Publication of JP4660494B2 publication Critical patent/JP4660494B2/ja
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  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2007035224A 2007-02-15 2007-02-15 研磨カートリッジ Expired - Lifetime JP4660494B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007035224A JP4660494B2 (ja) 2007-02-15 2007-02-15 研磨カートリッジ

Applications Claiming Priority (1)

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JP2007035224A JP4660494B2 (ja) 2007-02-15 2007-02-15 研磨カートリッジ

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2001001832A Division JP4156200B2 (ja) 2001-01-09 2001-01-09 研磨装置及び研磨方法

Publications (3)

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JP2007118187A JP2007118187A (ja) 2007-05-17
JP2007118187A5 JP2007118187A5 (enrdf_load_stackoverflow) 2008-01-24
JP4660494B2 true JP4660494B2 (ja) 2011-03-30

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ID=38142568

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007035224A Expired - Lifetime JP4660494B2 (ja) 2007-02-15 2007-02-15 研磨カートリッジ

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JP (1) JP4660494B2 (enrdf_load_stackoverflow)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4938540B2 (ja) * 2007-04-26 2012-05-23 昭和電工株式会社 アルミニウム管の製造方法
TW200908124A (en) * 2007-05-21 2009-02-16 Applied Materials Inc Methods and apparatus for using a bevel polishing head with an efficient tape routing arrangement
US8795032B2 (en) 2008-06-04 2014-08-05 Ebara Corporation Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method
JP5744382B2 (ja) * 2008-07-24 2015-07-08 株式会社荏原製作所 基板処理装置および基板処理方法
KR101830238B1 (ko) 2011-08-17 2018-03-29 세메스 주식회사 기판처리장치
KR101311082B1 (ko) * 2011-10-31 2013-10-15 주식회사 테크웰시스템 이형 필름 공급 유닛 및 이를 갖는 전자 부품 몰딩 장치
JP6009234B2 (ja) * 2012-06-11 2016-10-19 株式会社ディスコ 加工装置
JP2014167996A (ja) * 2013-02-28 2014-09-11 Ebara Corp 研磨装置および研磨方法
WO2022187259A1 (en) 2021-03-05 2022-09-09 Applied Materials, Inc. Roller for location-specific wafer polishing

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5274196A (en) * 1975-12-17 1977-06-21 Rando Sangiyou Kk Universal pat for use in sander
DE2609199A1 (de) * 1976-03-05 1977-09-08 Zuckermann Kg Maschf Maschine zum schleifen von kantenbereichen von formteilen
JP2857816B2 (ja) * 1992-05-29 1999-02-17 株式会社サンシン ウエハー材縁端面研磨装置
JP3240771B2 (ja) * 1993-09-10 2001-12-25 トヨタ自動車株式会社 ラッピング装置
JPH07193030A (ja) * 1993-12-25 1995-07-28 Kyushu Komatsu Denshi Kk 半導体ウェハの製造方法
JPH081494A (ja) * 1994-06-27 1996-01-09 Sanshin:Kk ウエハー材縁端部研磨装置
JP3399180B2 (ja) * 1995-08-24 2003-04-21 信越半導体株式会社 ウェーハ面取り部仕上げ加工方法および加工装置
JPH09186234A (ja) * 1995-12-27 1997-07-15 Sony Corp 半導体装置の製造方法およびその製造装置
JPH11320350A (ja) * 1998-05-12 1999-11-24 Toyota Motor Corp 複合加工方法および複合加工装置
JP2000040684A (ja) * 1998-07-23 2000-02-08 Ebara Corp 洗浄装置
JP2000176386A (ja) * 1998-12-16 2000-06-27 Ebara Corp 基板洗浄装置
JP3853130B2 (ja) * 1999-02-18 2006-12-06 株式会社荏原製作所 基板洗浄装置

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Publication number Publication date
JP2007118187A (ja) 2007-05-17

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