JP4649172B2 - 半導体パッケージ用ステムの製造方法 - Google Patents

半導体パッケージ用ステムの製造方法 Download PDF

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Publication number
JP4649172B2
JP4649172B2 JP2004324763A JP2004324763A JP4649172B2 JP 4649172 B2 JP4649172 B2 JP 4649172B2 JP 2004324763 A JP2004324763 A JP 2004324763A JP 2004324763 A JP2004324763 A JP 2004324763A JP 4649172 B2 JP4649172 B2 JP 4649172B2
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clad material
iron
layer
eyelet
stem
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Expired - Fee Related
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JP2004324763A
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Japanese (ja)
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JP2006135219A5 (enExample
JP2006135219A (ja
Inventor
卓也 黒澤
康之 木村
吉彦 中村
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Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
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Priority to JP2004324763A priority Critical patent/JP4649172B2/ja
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Publication of JP2006135219A5 publication Critical patent/JP2006135219A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Semiconductor Lasers (AREA)
JP2004324763A 2004-11-09 2004-11-09 半導体パッケージ用ステムの製造方法 Expired - Fee Related JP4649172B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004324763A JP4649172B2 (ja) 2004-11-09 2004-11-09 半導体パッケージ用ステムの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004324763A JP4649172B2 (ja) 2004-11-09 2004-11-09 半導体パッケージ用ステムの製造方法

Publications (3)

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JP2006135219A JP2006135219A (ja) 2006-05-25
JP2006135219A5 JP2006135219A5 (enExample) 2007-10-04
JP4649172B2 true JP4649172B2 (ja) 2011-03-09

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ID=36728473

Family Applications (1)

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JP2004324763A Expired - Fee Related JP4649172B2 (ja) 2004-11-09 2004-11-09 半導体パッケージ用ステムの製造方法

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JP (1) JP4649172B2 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5540412B2 (ja) * 2010-07-27 2014-07-02 新光電気工業株式会社 半導体パッケージ用ステムおよび半導体パッケージ用ステムの製造方法
DE102012102305B4 (de) * 2012-03-19 2025-07-31 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Laserdiodenvorrichtung
US8867582B2 (en) 2012-04-04 2014-10-21 Osram Opto Semiconductors Gmbh Laser diode assembly
DE102012102306B4 (de) * 2012-03-19 2021-05-12 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Laserdiodenvorrichtung
US8737445B2 (en) 2012-04-04 2014-05-27 Osram Opto Semiconductors Gmbh Laser diode assembly
US9008138B2 (en) 2012-04-12 2015-04-14 Osram Opto Semiconductors Gmbh Laser diode device
DE102012103160A1 (de) 2012-04-12 2013-10-17 Osram Opto Semiconductors Gmbh Laserdiodenvorrichtung
JP7014645B2 (ja) 2018-03-06 2022-02-01 シャープ株式会社 半導体発光装置
KR102642626B1 (ko) * 2023-02-24 2024-03-04 (주) 시에스텍 에칭클래드 공법이 적용된 이종접합슬리브 제조방법

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2880048B2 (ja) * 1993-02-05 1999-04-05 新光電気工業株式会社 半導体パッケージ用ステムの製造方法
JPH11186649A (ja) * 1997-12-18 1999-07-09 Sharp Corp 半導体レーザユニットおよびその製造方法
JP2001135745A (ja) * 1999-11-05 2001-05-18 Shinko Electric Ind Co Ltd 半導体パッケージ用ステム、半導体パッケージ用アイレット、及び半導体パッケージ用アイレットの製造方法
JP2004006824A (ja) * 2002-04-17 2004-01-08 Nichia Chem Ind Ltd 光半導体用パッケージ及びその製造方法
JP2003332666A (ja) * 2002-05-10 2003-11-21 Shinko Electric Ind Co Ltd 光半導体装置
JP3989350B2 (ja) * 2002-09-30 2007-10-10 新光電気工業株式会社 ガラス端子
JP2005019973A (ja) * 2003-05-30 2005-01-20 Shinko Electric Ind Co Ltd 光半導体素子用ステムの製造方法
JP3930869B2 (ja) * 2004-05-10 2007-06-13 後藤精工株式会社 半導体パッケージ用アイレットの製造方法及びその製造用プレス金型

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