JP4647820B2 - 荷電粒子線描画装置、および、デバイスの製造方法 - Google Patents

荷電粒子線描画装置、および、デバイスの製造方法 Download PDF

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Publication number
JP4647820B2
JP4647820B2 JP2001124758A JP2001124758A JP4647820B2 JP 4647820 B2 JP4647820 B2 JP 4647820B2 JP 2001124758 A JP2001124758 A JP 2001124758A JP 2001124758 A JP2001124758 A JP 2001124758A JP 4647820 B2 JP4647820 B2 JP 4647820B2
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Japan
Prior art keywords
charged particle
array
electron
particle beam
lens array
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Expired - Fee Related
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JP2001124758A
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English (en)
Japanese (ja)
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JP2002319532A5 (enExample
JP2002319532A (ja
Inventor
真人 村木
康成 早田
伸一 橋本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Advantest Corp
Hitachi Ltd
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Canon Inc
Advantest Corp
Hitachi Ltd
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Application filed by Canon Inc, Advantest Corp, Hitachi Ltd filed Critical Canon Inc
Priority to JP2001124758A priority Critical patent/JP4647820B2/ja
Priority to US10/125,439 priority patent/US6903353B2/en
Priority to DE60233994T priority patent/DE60233994D1/de
Priority to TW091108248A priority patent/TW559883B/zh
Priority to EP02252818A priority patent/EP1253619B1/en
Priority to KR10-2002-0021943A priority patent/KR100495651B1/ko
Publication of JP2002319532A publication Critical patent/JP2002319532A/ja
Publication of JP2002319532A5 publication Critical patent/JP2002319532A5/ja
Application granted granted Critical
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • H01J37/3174—Particle-beam lithography, e.g. electron beam lithography
    • H01J37/3177—Multi-beam, e.g. fly's eye, comb probe
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
    • H01J37/045—Beam blanking or chopping, i.e. arrangements for momentarily interrupting exposure to the discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/04—Means for controlling the discharge
    • H01J2237/043—Beam blanking
    • H01J2237/0435—Multi-aperture
    • H01J2237/0437—Semiconductor substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/30—Electron or ion beam tubes for processing objects
    • H01J2237/317—Processing objects on a microscale
    • H01J2237/3175—Lithography
    • H01J2237/31774—Multi-beam

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • Analytical Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electron Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
JP2001124758A 2001-04-23 2001-04-23 荷電粒子線描画装置、および、デバイスの製造方法 Expired - Fee Related JP4647820B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2001124758A JP4647820B2 (ja) 2001-04-23 2001-04-23 荷電粒子線描画装置、および、デバイスの製造方法
US10/125,439 US6903353B2 (en) 2001-04-23 2002-04-19 Charged particle beam exposure apparatus, device manufacturing method, and charged particle beam applied apparatus
TW091108248A TW559883B (en) 2001-04-23 2002-04-22 Charged particle beam exposure apparatus, device manufacturing method, and charged particle beam applied apparatus
EP02252818A EP1253619B1 (en) 2001-04-23 2002-04-22 Charged particle beam exposure apparatus and device manufacturing method using same
DE60233994T DE60233994D1 (de) 2001-04-23 2002-04-22 Ladungsträgerteilchenstrahl-Belichtungsgerät und dessen Anwendungverfahren zur Herstellung von Vorrichtungen
KR10-2002-0021943A KR100495651B1 (ko) 2001-04-23 2002-04-22 하전입자선노광장치와 디바이스의 제조방법 및하전입자선응용장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001124758A JP4647820B2 (ja) 2001-04-23 2001-04-23 荷電粒子線描画装置、および、デバイスの製造方法

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JP2002319532A JP2002319532A (ja) 2002-10-31
JP2002319532A5 JP2002319532A5 (enExample) 2008-06-05
JP4647820B2 true JP4647820B2 (ja) 2011-03-09

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Country Link
US (1) US6903353B2 (enExample)
EP (1) EP1253619B1 (enExample)
JP (1) JP4647820B2 (enExample)
KR (1) KR100495651B1 (enExample)
DE (1) DE60233994D1 (enExample)
TW (1) TW559883B (enExample)

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EP1253619A2 (en) 2002-10-30
US6903353B2 (en) 2005-06-07
KR20020082769A (ko) 2002-10-31
JP2002319532A (ja) 2002-10-31
TW559883B (en) 2003-11-01
US20020160311A1 (en) 2002-10-31
KR100495651B1 (ko) 2005-06-16

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