JP4647061B2 - 半導体デバイス内のスクライブストリートシール及び製造方法 - Google Patents

半導体デバイス内のスクライブストリートシール及び製造方法 Download PDF

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Publication number
JP4647061B2
JP4647061B2 JP2000149751A JP2000149751A JP4647061B2 JP 4647061 B2 JP4647061 B2 JP 4647061B2 JP 2000149751 A JP2000149751 A JP 2000149751A JP 2000149751 A JP2000149751 A JP 2000149751A JP 4647061 B2 JP4647061 B2 JP 4647061B2
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integrated circuit
circuit chip
layer
metal
composite structure
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JP2001023937A (ja
JP2001023937A5 (enExample
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エイ ウェスト ジェフリー
エム ギーレスピー ポール
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テキサス インスツルメンツ インコーポレイテツド
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/585—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries comprising conductive layers or plates or strips or rods or rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/562—Protection against mechanical damage
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP2000149751A 1999-05-20 2000-05-22 半導体デバイス内のスクライブストリートシール及び製造方法 Expired - Lifetime JP4647061B2 (ja)

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US13513899P 1999-05-20 1999-05-20
US60/135138 1999-05-20

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JP2001023937A JP2001023937A (ja) 2001-01-26
JP2001023937A5 JP2001023937A5 (enExample) 2007-07-05
JP4647061B2 true JP4647061B2 (ja) 2011-03-09

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US (2) US6521975B1 (enExample)
JP (1) JP4647061B2 (enExample)
KR (1) KR20010014950A (enExample)

Cited By (2)

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US9589911B1 (en) 2015-08-27 2017-03-07 Globalfoundries Inc. Integrated circuit structure with metal crack stop and methods of forming same
US9589912B1 (en) 2015-08-27 2017-03-07 Globalfoundries Inc. Integrated circuit structure with crack stop and method of forming same

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US9589911B1 (en) 2015-08-27 2017-03-07 Globalfoundries Inc. Integrated circuit structure with metal crack stop and methods of forming same
US9589912B1 (en) 2015-08-27 2017-03-07 Globalfoundries Inc. Integrated circuit structure with crack stop and method of forming same

Also Published As

Publication number Publication date
JP2001023937A (ja) 2001-01-26
US6521975B1 (en) 2003-02-18
KR20010014950A (ko) 2001-02-26
US20030122220A1 (en) 2003-07-03
US6841455B2 (en) 2005-01-11

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