JP4642634B2 - 音響センサの製造方法 - Google Patents

音響センサの製造方法 Download PDF

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Publication number
JP4642634B2
JP4642634B2 JP2005316594A JP2005316594A JP4642634B2 JP 4642634 B2 JP4642634 B2 JP 4642634B2 JP 2005316594 A JP2005316594 A JP 2005316594A JP 2005316594 A JP2005316594 A JP 2005316594A JP 4642634 B2 JP4642634 B2 JP 4642634B2
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JP
Japan
Prior art keywords
circuit board
acoustic sensor
metal
manufacturing
metal cap
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2005316594A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007124500A5 (enrdf_load_stackoverflow
JP2007124500A (ja
Inventor
浩一 吉田
徹 山田
英樹 小島
勝浩 巻幡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP2005316594A priority Critical patent/JP4642634B2/ja
Publication of JP2007124500A publication Critical patent/JP2007124500A/ja
Publication of JP2007124500A5 publication Critical patent/JP2007124500A5/ja
Application granted granted Critical
Publication of JP4642634B2 publication Critical patent/JP4642634B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13062—Junction field-effect transistor [JFET]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)
JP2005316594A 2005-10-31 2005-10-31 音響センサの製造方法 Expired - Fee Related JP4642634B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005316594A JP4642634B2 (ja) 2005-10-31 2005-10-31 音響センサの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005316594A JP4642634B2 (ja) 2005-10-31 2005-10-31 音響センサの製造方法

Publications (3)

Publication Number Publication Date
JP2007124500A JP2007124500A (ja) 2007-05-17
JP2007124500A5 JP2007124500A5 (enrdf_load_stackoverflow) 2010-01-14
JP4642634B2 true JP4642634B2 (ja) 2011-03-02

Family

ID=38147807

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005316594A Expired - Fee Related JP4642634B2 (ja) 2005-10-31 2005-10-31 音響センサの製造方法

Country Status (1)

Country Link
JP (1) JP4642634B2 (enrdf_load_stackoverflow)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101008399B1 (ko) * 2007-09-03 2011-01-14 주식회사 비에스이 내벽을 금속성 혹은 전도성 물질로 감싼 세라믹 패키지를이용한 콘덴서 마이크로폰
CN101237719B (zh) * 2007-12-28 2012-05-23 深圳市豪恩电声科技有限公司 一种硅电容式麦克风及其制作方法
JP6650154B2 (ja) * 2016-03-28 2020-02-19 国立大学法人東北大学 圧力センサ
CN111422825B (zh) * 2020-06-11 2020-09-22 潍坊歌尔微电子有限公司 传感器的制造方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4129042A (en) * 1977-11-18 1978-12-12 Signetics Corporation Semiconductor transducer packaged assembly
JPH05259478A (ja) * 1992-03-12 1993-10-08 Fuji Electric Co Ltd 半導体圧力センサの製造方法
JP3374620B2 (ja) * 1995-10-25 2003-02-10 松下電工株式会社 半導体圧力センサ
JPH11287723A (ja) * 1998-04-01 1999-10-19 Yazaki Corp 半導体圧力センサ
JP2001054196A (ja) * 1999-08-11 2001-02-23 Kyocera Corp エレクトレットコンデンサマイクロホン
US7166910B2 (en) * 2000-11-28 2007-01-23 Knowles Electronics Llc Miniature silicon condenser microphone
JP2002359445A (ja) * 2001-03-22 2002-12-13 Matsushita Electric Ind Co Ltd レーザー加工用の誘電体基板およびその加工方法ならび半導体パッケージおよびその製作方法
US6781231B2 (en) * 2002-09-10 2004-08-24 Knowles Electronics Llc Microelectromechanical system package with environmental and interference shield
DE10303263B4 (de) * 2003-01-28 2012-01-05 Infineon Technologies Ag Mikrophonanordnung
JP2004254138A (ja) * 2003-02-20 2004-09-09 Sanyo Electric Co Ltd コンデンサマイクロホン
JP2005150652A (ja) * 2003-11-20 2005-06-09 Aoi Electronics Co Ltd 回路基板
JP4419563B2 (ja) * 2003-12-25 2010-02-24 パナソニック株式会社 エレクトレットコンデンサー
JP2005262353A (ja) * 2004-03-17 2005-09-29 Sony Corp 電子部品および電子部品の製造方法
SG131039A1 (en) * 2005-09-14 2007-04-26 Bse Co Ltd Condenser microphone and packaging method for the same

Also Published As

Publication number Publication date
JP2007124500A (ja) 2007-05-17

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