JP4613708B2 - 回路基板及びインクジェットヘッド - Google Patents
回路基板及びインクジェットヘッド Download PDFInfo
- Publication number
- JP4613708B2 JP4613708B2 JP2005183413A JP2005183413A JP4613708B2 JP 4613708 B2 JP4613708 B2 JP 4613708B2 JP 2005183413 A JP2005183413 A JP 2005183413A JP 2005183413 A JP2005183413 A JP 2005183413A JP 4613708 B2 JP4613708 B2 JP 4613708B2
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- circuit board
- electrodes
- area
- rows
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14201—Structure of print heads with piezoelectric elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2002/14491—Electrical connection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09436—Pads or lands on permanent coating which covers the other conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09472—Recessed pad for surface mounting; Recessed electrode of component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09509—Blind vias, i.e. vias having one side closed
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09572—Solder filled plated through-hole in the final product
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Description
10y,10m 貫通孔
2a 回路基板
30y,30m 電極列
31y,31m 第2個別電極(電極列に含まれる複数の電極)
32y,32m 配線
33y,33m 電極接続部
4a 圧電アクチュエータプレート(アクチュエータ)
41y,41m 第1個別電極(電極群)
8 インクジェットヘッド
Claims (3)
- 基板の一面に複数並設された電極列と、
該電極列に含まれる複数の電極夫々に接続して前記一面に形成された配線と、
前記基板の前記複数の電極の夫々に対応する位置に形成された貫通孔と
を備え、
一の前記電極列に含まれる電極に接続された配線が、他の前記電極列に含まれる電極の間を、前記電極列の並設方向に通過して形成してある回路基板において、
前記貫通孔の面積は前記電極の面積より小さく、
外部の電極群に対向して接続すべく、前記基板の他面に形成され、前記電極の面積より大きい面積を有し、前記貫通孔を介して前記電極に接続する電極接続部
を備えることを特徴とする回路基板。 - 相隣る電極列に含まれる電極を、列方向の位置を異ならせて千鳥配置してあり、
前記電極接続部は、前記並設方向に長い形状であることを特徴とする請求項1に記載の回路基板。 - 複数のノズル孔夫々に対応した電極群を有し、前記ノズル孔夫々からインクを噴射させるためのアクチュエータと、
該アクチュエータに接続する回路基板と
を備えるインクジェットヘッドにおいて、
前記回路基板は請求項1又は2に記載の回路基板であり、
複数の前記電極接続部夫々を前記電極群に対向させて、前記電極接続部と前記電極群に含まれる電極とを接続してあることを特徴とするインクジェットヘッド。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005183413A JP4613708B2 (ja) | 2005-06-23 | 2005-06-23 | 回路基板及びインクジェットヘッド |
US11/472,523 US7931354B2 (en) | 2005-06-23 | 2006-06-22 | Circuit board for inkjet head |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005183413A JP4613708B2 (ja) | 2005-06-23 | 2005-06-23 | 回路基板及びインクジェットヘッド |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007001127A JP2007001127A (ja) | 2007-01-11 |
JP4613708B2 true JP4613708B2 (ja) | 2011-01-19 |
Family
ID=37566801
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005183413A Expired - Fee Related JP4613708B2 (ja) | 2005-06-23 | 2005-06-23 | 回路基板及びインクジェットヘッド |
Country Status (2)
Country | Link |
---|---|
US (1) | US7931354B2 (ja) |
JP (1) | JP4613708B2 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4877791B2 (ja) * | 2007-01-26 | 2012-02-15 | 日東電工株式会社 | 配線回路基板 |
JP4978357B2 (ja) * | 2007-07-19 | 2012-07-18 | ブラザー工業株式会社 | 配線ユニットの製造方法、及び液体吐出装置の製造方法 |
JP5119777B2 (ja) * | 2007-07-18 | 2013-01-16 | ブラザー工業株式会社 | 液体吐出装置 |
US8832018B2 (en) * | 2012-05-22 | 2014-09-09 | Sap Ag | Decision service manager |
US9729397B2 (en) | 2012-05-22 | 2017-08-08 | Sap Se | Decision service manager |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004114609A (ja) * | 2002-09-27 | 2004-04-15 | Brother Ind Ltd | フレキシブル配線基板の接続構造および接続方法 |
JP2004319692A (ja) * | 2003-04-15 | 2004-11-11 | Mitsubishi Electric Corp | 電子回路基板 |
JP2005161760A (ja) * | 2003-12-04 | 2005-06-23 | Brother Ind Ltd | インクジェット記録ヘッド |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3055146B2 (ja) | 1990-03-24 | 2000-06-26 | セイコーエプソン株式会社 | インクジェットヘッド |
JPH0575253A (ja) | 1991-08-27 | 1993-03-26 | Hitachi Constr Mach Co Ltd | レーザ光による回路パターンの形成方法及びスルーホール内の導体形成方法 |
JP3171219B2 (ja) | 1993-04-09 | 2001-05-28 | セイコーエプソン株式会社 | インクジェット記録ヘッド |
JP4288399B2 (ja) * | 2000-03-31 | 2009-07-01 | 富士フイルム株式会社 | マルチノズルインクジェットヘッド及びその製造方法 |
US6521996B1 (en) * | 2000-06-30 | 2003-02-18 | Intel Corporation | Ball limiting metallurgy for input/outputs and methods of fabrication |
US6258705B1 (en) * | 2000-08-21 | 2001-07-10 | Siliconeware Precision Industries Co., Ltd. | Method of forming circuit probing contact points on fine pitch peripheral bond pads on flip chip |
JP4656275B2 (ja) * | 2001-01-15 | 2011-03-23 | 日本電気株式会社 | 半導体装置の製造方法 |
AU2003256360A1 (en) * | 2002-06-25 | 2004-01-06 | Unitive International Limited | Methods of forming electronic structures including conductive shunt layers and related structures |
JP3874712B2 (ja) * | 2002-09-24 | 2007-01-31 | ブラザー工業株式会社 | インクジェットヘッド |
JP4552445B2 (ja) | 2004-01-29 | 2010-09-29 | ブラザー工業株式会社 | インクジェット記録装置および記録ヘッドユニットの製造方法 |
JP4281608B2 (ja) * | 2004-04-22 | 2009-06-17 | ブラザー工業株式会社 | 記録ヘッドの製造方法及び記録ヘッド |
JP4501752B2 (ja) * | 2005-03-30 | 2010-07-14 | ブラザー工業株式会社 | 基板接合構造の製造方法及びインクジェットヘッドの製造方法 |
-
2005
- 2005-06-23 JP JP2005183413A patent/JP4613708B2/ja not_active Expired - Fee Related
-
2006
- 2006-06-22 US US11/472,523 patent/US7931354B2/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004114609A (ja) * | 2002-09-27 | 2004-04-15 | Brother Ind Ltd | フレキシブル配線基板の接続構造および接続方法 |
JP2004319692A (ja) * | 2003-04-15 | 2004-11-11 | Mitsubishi Electric Corp | 電子回路基板 |
JP2005161760A (ja) * | 2003-12-04 | 2005-06-23 | Brother Ind Ltd | インクジェット記録ヘッド |
Also Published As
Publication number | Publication date |
---|---|
US7931354B2 (en) | 2011-04-26 |
JP2007001127A (ja) | 2007-01-11 |
US20060290742A1 (en) | 2006-12-28 |
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