JP4196875B2 - プリント基板及びそれを用いたインクジェットヘッド - Google Patents
プリント基板及びそれを用いたインクジェットヘッド Download PDFInfo
- Publication number
- JP4196875B2 JP4196875B2 JP2004130061A JP2004130061A JP4196875B2 JP 4196875 B2 JP4196875 B2 JP 4196875B2 JP 2004130061 A JP2004130061 A JP 2004130061A JP 2004130061 A JP2004130061 A JP 2004130061A JP 4196875 B2 JP4196875 B2 JP 4196875B2
- Authority
- JP
- Japan
- Prior art keywords
- conductive film
- pressure chamber
- ink
- wirings
- fpc
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14201—Structure of print heads with piezoelectric elements
- B41J2/14209—Structure of print heads with piezoelectric elements of finger type, chamber walls consisting integrally of piezoelectric material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/365—Assembling flexible printed circuits with other printed circuits by abutting, i.e. without alloying process
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14201—Structure of print heads with piezoelectric elements
- B41J2/14209—Structure of print heads with piezoelectric elements of finger type, chamber walls consisting integrally of piezoelectric material
- B41J2002/14217—Multi layer finger type piezoelectric element
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14201—Structure of print heads with piezoelectric elements
- B41J2/14209—Structure of print heads with piezoelectric elements of finger type, chamber walls consisting integrally of piezoelectric material
- B41J2002/14225—Finger type piezoelectric element on only one side of the chamber
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14201—Structure of print heads with piezoelectric elements
- B41J2002/14306—Flow passage between manifold and chamber
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2002/14459—Matrix arrangement of the pressure chambers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2002/14491—Electrical connection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0133—Elastomeric or compliant polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0367—Metallic bump or raised conductor not used as solder bump
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/091—Locally and permanently deformed areas including dielectric material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10977—Encapsulated connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Metallurgy (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
- Accessory Devices And Overall Control Thereof (AREA)
- Structure Of Printed Boards (AREA)
Description
21 アクチュエータユニット(圧電アクチュエータ)
35 個別電極(電極)
36 ランド部
41〜44 圧電シート(圧電素子)
46 ベースフィルム(フレキシブル層)
48a 端子部(導電膜)
48b 配線
49 ソルダレジスト(被覆膜)
50,50´,80,90,100 FPC(プリント基板)
51 凸部
52 凹部
Claims (2)
- 一方の面に複数の凸部が他方の面の前記凸部に対向する位置にそれぞれ凹部が形成された絶縁性のフレキシブル層と、
前記複数の凸部をそれぞれ覆うように前記一方の面上に形成された複数の導電膜と、
前記複数の導電膜にそれぞれ接続されて、前記フレキシブル層上において互いに離隔しつつ延在する複数の配線と、
前記複数の凸部の中心と重なる複数の孔を有し、前記一方の面上に形成され前記導電膜の周縁および前記複数の配線を被覆する被覆膜とを備えており、
前記導電膜が、前記一方の面に対して垂直な方向から見て、4隅に鋭角部を有し且つ前記配線の延在方向の両端部における中央部に鈍角部を有する多角形平面形状に形成されており、
前記複数の配線が、接続された前記導電膜とは別の前記導電膜を避けつつ当該別の導電膜を囲うように形成されていることを特徴とするプリント基板。 - 積層された複数の圧電素子と、最外層にある前記圧電素子の表面にインク吐出チャネル毎に形成された電極とを含む圧電アクチュエータと、
一方の面に凸部が他方の面の前記凸部に対向する位置に凹部が前記電極毎にそれぞれ形成された絶縁性のフレキシブル層と、複数の前記凸部をそれぞれ覆うように前記一方の面上に形成された複数の導電膜と、前記複数の導電膜にそれぞれ接続されて、前記フレキシブル層上において互いに離隔しつつ延在する複数の配線と、複数の前記凸部の中心と重なる複数の孔を有し、前記一方の面上に形成され前記導電膜の周縁および前記複数の配線を被覆する被覆膜とを含んでおり、前記導電膜が前記一方の面に対して垂直な方向から見て、4隅に鋭角部を有し且つ前記配線の延在方向の両端部における中央部に鈍角部を有する多角形平面形状に形成されており、前記複数の配線が接続された前記導電膜とは別の前記導電膜を避けつつ当該別の導電膜を囲うように形成されたプリント基板とを備えていることを特徴とするインクジェットヘッド。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004130061A JP4196875B2 (ja) | 2004-04-26 | 2004-04-26 | プリント基板及びそれを用いたインクジェットヘッド |
US11/113,459 US7703889B2 (en) | 2004-04-26 | 2005-04-25 | Printed wiring board and electric device using the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004130061A JP4196875B2 (ja) | 2004-04-26 | 2004-04-26 | プリント基板及びそれを用いたインクジェットヘッド |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005305977A JP2005305977A (ja) | 2005-11-04 |
JP4196875B2 true JP4196875B2 (ja) | 2008-12-17 |
Family
ID=35135964
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004130061A Expired - Fee Related JP4196875B2 (ja) | 2004-04-26 | 2004-04-26 | プリント基板及びそれを用いたインクジェットヘッド |
Country Status (2)
Country | Link |
---|---|
US (1) | US7703889B2 (ja) |
JP (1) | JP4196875B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11452208B2 (en) * | 2017-02-24 | 2022-09-20 | Hewlett Packard Enterprise Development Lp | Electronic devices packaged on wing boards |
Family Cites Families (31)
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JPH0194696A (ja) | 1987-10-06 | 1989-04-13 | Ibiden Co Ltd | プリント配線板 |
JP2509656B2 (ja) * | 1988-02-17 | 1996-06-26 | 住友電気工業株式会社 | フレキシブルプリント配線板の接続構造 |
US4885003A (en) * | 1988-07-25 | 1989-12-05 | Cordis Corporation | Double mesh balloon catheter device |
US5421832A (en) * | 1989-12-13 | 1995-06-06 | Lefebvre; Jean-Marie | Filter-catheter and method of manufacturing same |
US5197971A (en) * | 1990-03-02 | 1993-03-30 | Bonutti Peter M | Arthroscopic retractor and method of using the same |
JP2826172B2 (ja) | 1990-05-28 | 1998-11-18 | イビデン株式会社 | モータ |
US5193533A (en) * | 1990-07-09 | 1993-03-16 | Brigham And Women's Hospital | High-pressure jet ventilation catheter |
US5097101A (en) | 1991-02-05 | 1992-03-17 | Tektronix, Inc. | Method of forming a conductive contact bump on a flexible substrate and a flexible substrate |
JPH04354398A (ja) | 1991-05-31 | 1992-12-08 | Internatl Business Mach Corp <Ibm> | 配線基板及びその製造方法 |
US5255679A (en) * | 1992-06-02 | 1993-10-26 | Cardiac Pathways Corporation | Endocardial catheter for mapping and/or ablation with an expandable basket structure having means for providing selective reinforcement and pressure sensing mechanism for use therewith, and method |
US5471982A (en) * | 1992-09-29 | 1995-12-05 | Ep Technologies, Inc. | Cardiac mapping and ablation systems |
US5344439A (en) * | 1992-10-30 | 1994-09-06 | Medtronic, Inc. | Catheter with retractable anchor mechanism |
JP3642347B2 (ja) | 1994-12-09 | 2005-04-27 | 東洋紡績株式会社 | フレキシブル印刷配線板 |
JP3445678B2 (ja) | 1995-02-27 | 2003-09-08 | シャープ株式会社 | 多層フレキシブルプリント配線板及びその製造方法 |
US5681280A (en) * | 1995-05-02 | 1997-10-28 | Heart Rhythm Technologies, Inc. | Catheter control system |
US5957900A (en) * | 1996-07-10 | 1999-09-28 | Asahi Kogaku Kogyo Kabushiki Kaisha | Treatment accessory for endoscope |
US5749826A (en) * | 1996-11-06 | 1998-05-12 | Faulkner; James W. | Urinary incontinence control device |
JPH10200217A (ja) | 1997-01-07 | 1998-07-31 | Ibiden Co Ltd | プリント配線板製造用のフレキシブル基板 |
JPH10233564A (ja) * | 1997-02-19 | 1998-09-02 | Alps Electric Co Ltd | フレキシブル基板 |
EP0934092A4 (en) * | 1997-03-06 | 2008-03-26 | Boston Scient Scimed Inc | DEVICE AND METHOD FOR DISTAL PROTECTION |
JP4083241B2 (ja) * | 1997-04-23 | 2008-04-30 | アーテミス・メディカル・インコーポレイテッド | 分岐ステント及び遠位保護システム |
JP3607069B2 (ja) | 1998-02-03 | 2005-01-05 | イビデン株式会社 | プリント配線板の製造方法 |
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JP2000012991A (ja) | 1998-06-18 | 2000-01-14 | Nitto Denko Corp | 異なる厚さの導体層を有する回路基板形成部材およびそれを用いた回路基板 |
US6632197B2 (en) * | 1999-04-16 | 2003-10-14 | Thomas R. Lyon | Clear view cannula |
JP4347486B2 (ja) * | 2000-01-24 | 2009-10-21 | 辰雄 金重 | 留置カテーテル |
JP4362996B2 (ja) * | 2001-08-22 | 2009-11-11 | 富士ゼロックス株式会社 | 格子状配列構造の圧電/電歪アクチュエータ及びその製造方法 |
JP3922151B2 (ja) * | 2002-09-27 | 2007-05-30 | ブラザー工業株式会社 | フレキシブル配線基板の接続構造および接続方法 |
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-
2004
- 2004-04-26 JP JP2004130061A patent/JP4196875B2/ja not_active Expired - Fee Related
-
2005
- 2005-04-25 US US11/113,459 patent/US7703889B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US7703889B2 (en) | 2010-04-27 |
JP2005305977A (ja) | 2005-11-04 |
US20050237364A1 (en) | 2005-10-27 |
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