JP4612625B2 - 低温硬化用の促進剤系 - Google Patents
低温硬化用の促進剤系 Download PDFInfo
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- JP4612625B2 JP4612625B2 JP2006505549A JP2006505549A JP4612625B2 JP 4612625 B2 JP4612625 B2 JP 4612625B2 JP 2006505549 A JP2006505549 A JP 2006505549A JP 2006505549 A JP2006505549 A JP 2006505549A JP 4612625 B2 JP4612625 B2 JP 4612625B2
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- LQXDOYVXAAMJAM-UHFFFAOYSA-N 1-(1h-imidazol-2-ylmethyl)naphthalen-2-ol Chemical compound OC1=CC=C2C=CC=CC2=C1CC1=NC=CN1 LQXDOYVXAAMJAM-UHFFFAOYSA-N 0.000 claims description 3
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- 125000000524 functional group Chemical group 0.000 claims description 2
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- 239000000539 dimer Substances 0.000 description 2
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- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
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- 239000000047 product Substances 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
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- OUPZKGBUJRBPGC-UHFFFAOYSA-N 1,3,5-tris(oxiran-2-ylmethyl)-1,3,5-triazinane-2,4,6-trione Chemical compound O=C1N(CC2OC2)C(=O)N(CC2OC2)C(=O)N1CC1CO1 OUPZKGBUJRBPGC-UHFFFAOYSA-N 0.000 description 1
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- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 1
- POTQBGGWSWSMCX-UHFFFAOYSA-N 3-[2-(3-aminopropoxy)ethoxy]propan-1-amine Chemical compound NCCCOCCOCCCN POTQBGGWSWSMCX-UHFFFAOYSA-N 0.000 description 1
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- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical group C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 1
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- KQSABULTKYLFEV-UHFFFAOYSA-N naphthalene-1,5-diamine Chemical compound C1=CC=C2C(N)=CC=CC2=C1N KQSABULTKYLFEV-UHFFFAOYSA-N 0.000 description 1
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- VHNQIURBCCNWDN-UHFFFAOYSA-N pyridine-2,6-diamine Chemical compound NC1=CC=CC(N)=N1 VHNQIURBCCNWDN-UHFFFAOYSA-N 0.000 description 1
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- 239000011265 semifinished product Substances 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- UFDHBDMSHIXOKF-UHFFFAOYSA-N tetrahydrophthalic acid Natural products OC(=O)C1=C(C(O)=O)CCCC1 UFDHBDMSHIXOKF-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4014—Nitrogen containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3442—Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
- C08K5/3445—Five-membered rings
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
- Reinforced Plastic Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Description
しかし、慣用されるイミダゾール類、たとえばイミダゾール、1−メチルイミダゾール、2−メチルイミダゾール、2−エチル−4−メチルイミダゾールまたは2−フェニルイミダゾール類は、それらをプレプレグ配合物に用いた場合、多くのエポキシ樹脂配合物において室温でのプレプレグの貯蔵安定性(略して保存時間)が不適切となる。
R1、R2およびR3は、それぞれ互いに独立して、H;C1−17アルキル;
C1−4アルキル基により置換されていてもよいC3−12シクロアルキル;
C1−4アルキル基により置換されていてもよいC4−20シクロアルキル−アルキル;
1〜3個のC1−4アルキル基により置換されていてもよいC6−10アリール;
1〜3個のC1−4アルキル基により置換されていてもよいC7−15フェニルアルキル;
C3−17アルケニル;C3−12アルキニル;または芳香族もしくは脂肪族C3−12アシルであり;
R4、R5、R6、R7、R8およびR9は、それぞれ互いに独立して、H;C1−12アルキル;
C1−4アルキル基により置換されていてもよいC3−12シクロアルキル;
C1−4アルキル基により置換されていてもよいC4−20シクロアルキル−アルキル;
1〜3個のC1−4アルキル基により置換されていてもよいC6−10アリール;
1〜3個のC1−4アルキル基により置換されていてもよいC7−15フェニルアルキル;
C3−17アルケニル;C3−12アルキニル;C1−12アルコキシ;またはOHである];
および
成分B)としての室温で液体であるフェノール類を含み、成分A)と成分B)の重量比が10:90〜80:20、好ましくは20:80〜70:30、より好ましくは25:75〜50:50である組成物を提供する。
本発明はさらに、
a)エポキシド含量が0.1〜11、好ましくは0.1〜2.2エポキシド当量/kgであるエポキシ樹脂、
b)成分A)としての前記一般式(I)の1−イミダゾリルメチル置換2−ナフトール化合物、および成分B)としての、室温(RT=15〜35℃)で液体であるフェノール類、たとえばn−ペンチル−、n−ヘキシル−、n−ヘプチル−、n−オクチル−、n−ノニル−、n−デシルフェノール、特にO,O’−ジアリル−ビスフェノールAを含む組成物;成分A)と成分B)の重量比(重量%)は10:90〜80:20、好ましくは20:80〜70:30、より好ましくは25:75〜50:50である、
c)エポキシ樹脂のための硬化剤、および場合により
d)エポキシ樹脂技術において慣用される添加剤
を含む、硬化性エポキシ樹脂組成物を提供する。
適切な例には下記のものが含まれる:脂環式ポリオール、たとえば2,2−ビス(4’−ヒドロキシシクロヘキシル)プロパンのジグリシジルまたはポリグリシジルエーテル、多価フェノール、たとえばレソルシノール、ビス(4’−ヒドロキシフェニル)メタン(ビスフェノールF)、2,2−ビス(4’−ヒドロキシフェニル)プロパン(ビスフェノールA)、2,2−ビス(4’−ヒドロキシ−3’,5’−ジブロモフェニル)プロパン、1,1,2,2−テトラキス(4’−ヒドロキシフェニル)エタン、またはフェノール類とホルムアルデヒドの縮合物、たとえばフェノールノボラック樹脂およびクレゾールノボラック樹脂のジグリシジルまたはポリグリシジルエーテル;さらに前記のポリアルコールおよびポリフェノールのジ−またはポリ(β−メチルグリシジル)エーテル;多塩基性カルボン酸、たとえばフタル酸、テレフタル酸、テトラヒドロフタル酸およびヘキサヒドロフタル酸のポリグリシジルエステルおよびポリ(β−メチルグリシジル)エステル;アミノフェノール類のグリシジル誘導体、たとえばトリグリシジル−p−アミノフェノール;アミン、アミドおよび複素環式窒素塩基のN−グリシジル誘導体、たとえばN,N−ジリグリシジルアニリン、N,N−ジリグリシジルトルエン、N,N,N’,N’−テトラグリシジル−ビス(4−アミノフェニル)メタン、イソシアヌル酸トリグリシジル、N,N−ジリグリシジル−N,N’−エチレン尿素、N,N’−ジリグリシジル−5,5−ジメチルヒダントイン、N,N’−ジリグリシジル−5−イソプロピルヒダントイン、N,N’−ジリグリシジル−5,5−ジメチル−6−イソプロピル−5,6−ジヒドロウラシル;多官能性エポキシ樹脂、たとえば2,6−ジ置換4−エポキシプロピルフェニルグリシジルエーテルおよびその付加物:EP−A 205 409およびEP−A 204 659に記載;それぞれ2個のグリシジルオキシ基および2,3−エポキシプロピル基で置換されたビスフェノール類、たとえば2,2−ビス(3’−エポキシプロピル−4’−エポキシプロピルフェニル)プロパン:GB828364に記載;テトラメチロール置換されたシクロヘキサノール、シクロヘキサノン、シクロペンタノールおよびシクロペンタノンのグリシジル誘導体、たとえばUS4,549,008に記載;グリシジルオキシ置換ベンゾフェノン;ならびにグリシジルオキシジケトン類、たとえばUS4,649,181に記載の化合物。
適切なエポキシ樹脂には、好ましくはたとえばビスフェノールAまたはFのグリシジルエーテル、グリシジルエステル、芳香族複素環式化合物のN−グリシジルおよびN,O−グリシジル誘導体、ならびに脂環式グリシジル化合物が含まれる。それらは、好ましくは0.1〜2.2エポキシド当量/kgの官能価をもつ。
a)ナフトール成分およびフェノール成分を含む組成物の調製
フェノール成分を容器に装入し、次いでナフトール成分を添加する。使用量は下記の表1から分かる。混合物を160℃で4時間撹拌する。これにより、粘稠ないし高粘度の濃赤色ないし黒色の液体、または固体が得られる。
2) ジアリルビスフェノールA(Vantlco AGから);
3) ng=測定しなかった。nm=60℃で測定できなかった。粘度はRheometrix RD2によりプレート/プレート設定で測定された。
前記の実験セクションa)からの生成物を60〜80℃の温度でアミン系硬化剤(この場合はJeffamine(登録商標)D−230)に溶解する。これにより濃褐色の透明な溶液が得られる。室温に冷却した後、この溶液を計算量のエポキシ樹脂と混合する。詳細については下記の表2を参照されたい。
Claims (8)
- 成分A)としての1−イミダゾリルメチル−2−ナフトール;
および
成分B)としての室温で液体であるフェノール類を含み、成分A)と成分B)の重量比が30:70〜70:30である組成物。 - 成分B)として、1,4−n−ペンチル−、−n−ヘキシル−、−n−ヘプチル−、−n−オクチル−、−n−ノニル−、−n−デシルフェノール、またはO,O’−ジアリル−ビスフェノールAを使用することを特徴とする、請求項1に記載の組成物。
- 成分A)と成分B)の重量比が30:70〜50:50であることを特徴とする、請求項1に記載の組成物。
- エポキシ樹脂組成物中における促進剤としての、請求項1に記載の組成物の使用。
- a)エポキシド含量が0.1〜11エポキシド当量/kgであるエポキシ樹脂、
b)成分a)〜d)の全組成物を基準として5〜40重量部の、請求項1に記載の組成物、
c)エポキシド基当たり硬化剤の官能基が0.5〜1.5個あるように計算された、エポキシ樹脂のための硬化剤、および場合により
d)有機および無機の充填剤、顔料、離型剤、ならびに粘度調節用添加剤から選択されるエポキシ樹脂技術において慣用される添加剤
を含む、硬化性組成物。 - 硬化剤がジアミンおよびポリアミンから選択されるアミンであることを特徴とする、請求項5に記載の組成物。
- 硬化剤がポリオキシプロピレンジアミンであることを特徴とする、請求項4に記載の組成物。
- エポキシ樹脂が、芳香族もしくは複素環式化合物のグリシジルエーテル、グリシジルエステル、N−グリシジルもしくはN,O−グリシジル誘導体、または脂環式グリシジル化合物であることを特徴とする、請求項5に記載の組成物。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH6972003 | 2003-04-16 | ||
PCT/EP2004/050503 WO2004092244A2 (en) | 2003-04-16 | 2004-04-13 | Accelerator systems for low-temperature curing of epoxy resin compositions |
Publications (2)
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JP2006523746A JP2006523746A (ja) | 2006-10-19 |
JP4612625B2 true JP4612625B2 (ja) | 2011-01-12 |
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JP2006505549A Expired - Lifetime JP4612625B2 (ja) | 2003-04-16 | 2004-04-13 | 低温硬化用の促進剤系 |
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Country | Link |
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US (1) | US7858713B2 (ja) |
EP (1) | EP1613680B1 (ja) |
JP (1) | JP4612625B2 (ja) |
KR (1) | KR101096611B1 (ja) |
CN (1) | CN100575384C (ja) |
AT (1) | ATE346877T1 (ja) |
DE (1) | DE602004003485T2 (ja) |
ES (1) | ES2274446T3 (ja) |
TW (1) | TWI336337B (ja) |
WO (1) | WO2004092244A2 (ja) |
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ITMI20091980A1 (it) * | 2009-11-12 | 2011-05-13 | Imast S C A R L | Polimeri rinforzati con fibre, composizioni polimeriche a base epossidica e loro impiego |
JP5936340B2 (ja) * | 2011-12-13 | 2016-06-22 | 日本合成化学工業株式会社 | エポキシ樹脂用硬化剤 |
JP2017082052A (ja) * | 2015-10-26 | 2017-05-18 | 住友ベークライト株式会社 | エポキシ樹脂組成物、及びこれを用いた半導体装置 |
WO2018119250A1 (en) * | 2016-12-21 | 2018-06-28 | Huntsman Advanced Materials Licensing (Switzerland) Gmbh | Latent curing accelerators |
KR102605531B1 (ko) * | 2021-11-02 | 2023-11-22 | (재)울산테크노파크 | 에폭시접착제 조성물 및 그 제조방법 |
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US3356645A (en) | 1964-04-20 | 1967-12-05 | Shell Oil Co | Process for curing epoxy resins with a salt of an imidazole and compositions thereof |
US4105667A (en) | 1970-07-17 | 1978-08-08 | Minnesota Mining And Manufacturing Company | Imidazole type curing agents |
CH621810A5 (ja) * | 1976-06-17 | 1981-02-27 | Ciba Geigy Ag | |
JPS562315A (en) * | 1979-06-22 | 1981-01-12 | Shigeo Kiyono | Cure accelerating liquid composition containing amine |
CA1206687A (en) * | 1982-02-08 | 1986-06-24 | Celanese Corporation | Polyol/imidazole curing agents for epoxy resins |
GB8304581D0 (en) | 1983-02-18 | 1983-03-23 | Secr Defence | Curing agents for epoxy resins |
US4549008A (en) | 1983-08-23 | 1985-10-22 | Ciba-Geigy Corporation | Novel tetraglycidyl ethers |
DE3479810D1 (en) * | 1983-08-24 | 1989-10-26 | Ciba Geigy Ag | Method of producing prepregs and composite materials reinforced therewith |
EP0157740B1 (de) | 1984-04-04 | 1990-06-27 | Ciba-Geigy Ag | Glycidyloxydiketone |
EP0197892B1 (de) * | 1985-04-02 | 1989-10-18 | Ciba-Geigy Ag | Härtbare Gemische |
DE3682537D1 (de) | 1985-06-06 | 1992-01-02 | Ciba Geigy Ag | Polyepoxide und deren verwendung. |
US4652398A (en) * | 1985-09-12 | 1987-03-24 | Stauffer Chemical Company | Rapid curing, thermally stable adhesive composition comprising epoxy resin, polyimide, reactive solvent, and crosslinker |
JPS6361016A (ja) * | 1986-08-29 | 1988-03-17 | New Japan Chem Co Ltd | エポキシ樹脂硬化剤組成物 |
US5001212A (en) | 1988-06-28 | 1991-03-19 | Skw Trostberg Aktiengesellschaft | Additive for heat-hardenable epoxide resin masses |
FI91062C (fi) * | 1988-12-28 | 1994-05-10 | Eisai Co Ltd | Menetelmä lääkeaineena käyttökelpoisten naftaleenijohdannaisten valmistamiseksi |
DE69133280T2 (de) * | 1990-05-21 | 2004-05-06 | Dow Global Technologies, Inc., Midland | Latente Katalysatoren, Härtungsinhibierte Epoxyharzzusammensetzungen und daraus hergestellte Laminate |
US5912308A (en) * | 1994-11-30 | 1999-06-15 | Alliedsignal Inc. | Multifunctional cyanate ester and epoxy blends |
US5591811A (en) * | 1995-09-12 | 1997-01-07 | Ciba-Geigy Corporation | 1-imidazolylmethyl-2-naphthols as catalysts for curing epoxy resins |
US6245835B1 (en) * | 1996-02-29 | 2001-06-12 | The Dow Chemical Company | Polymeric amines and reactive epoxy polymer compositions |
JP2000007891A (ja) * | 1998-04-22 | 2000-01-11 | Asahi Chiba Kk | 新規液状エポキシ樹脂組成物、その硬化物並びに半導体封止装置 |
US6617399B2 (en) * | 1999-12-17 | 2003-09-09 | Henkel Loctite Corporation | Thermosetting resin compositions comprising epoxy resins, adhesion promoters, curatives based on the combination of nitrogen compounds and transition metal complexes, and polysulfide tougheners |
JP2003026766A (ja) * | 2001-07-13 | 2003-01-29 | New Japan Chem Co Ltd | エポキシ系反応性希釈剤及び該希釈剤を含む液状エポキシ樹脂組成物 |
-
2004
- 2004-04-13 EP EP04727014A patent/EP1613680B1/en not_active Expired - Lifetime
- 2004-04-13 CN CN200480010048A patent/CN100575384C/zh not_active Expired - Lifetime
- 2004-04-13 US US10/552,908 patent/US7858713B2/en not_active Expired - Lifetime
- 2004-04-13 KR KR1020057019660A patent/KR101096611B1/ko active IP Right Grant
- 2004-04-13 ES ES04727014T patent/ES2274446T3/es not_active Expired - Lifetime
- 2004-04-13 WO PCT/EP2004/050503 patent/WO2004092244A2/en active IP Right Grant
- 2004-04-13 JP JP2006505549A patent/JP4612625B2/ja not_active Expired - Lifetime
- 2004-04-13 DE DE602004003485T patent/DE602004003485T2/de not_active Expired - Lifetime
- 2004-04-13 AT AT04727014T patent/ATE346877T1/de active
- 2004-04-14 TW TW093110340A patent/TWI336337B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
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WO2004092244A2 (en) | 2004-10-28 |
WO2004092244A3 (en) | 2004-12-23 |
US20070100114A1 (en) | 2007-05-03 |
CN1774461A (zh) | 2006-05-17 |
TWI336337B (en) | 2011-01-21 |
EP1613680B1 (en) | 2006-11-29 |
DE602004003485D1 (de) | 2007-01-11 |
US7858713B2 (en) | 2010-12-28 |
KR101096611B1 (ko) | 2011-12-21 |
KR20050121266A (ko) | 2005-12-26 |
JP2006523746A (ja) | 2006-10-19 |
ATE346877T1 (de) | 2006-12-15 |
DE602004003485T2 (de) | 2007-09-20 |
TW200504110A (en) | 2005-02-01 |
WO2004092244A9 (en) | 2005-11-10 |
ES2274446T3 (es) | 2007-05-16 |
CN100575384C (zh) | 2009-12-30 |
EP1613680A2 (en) | 2006-01-11 |
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