JP4589160B2 - 電子部品の実装装置及び実装方法 - Google Patents

電子部品の実装装置及び実装方法 Download PDF

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Publication number
JP4589160B2
JP4589160B2 JP2005091975A JP2005091975A JP4589160B2 JP 4589160 B2 JP4589160 B2 JP 4589160B2 JP 2005091975 A JP2005091975 A JP 2005091975A JP 2005091975 A JP2005091975 A JP 2005091975A JP 4589160 B2 JP4589160 B2 JP 4589160B2
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Japan
Prior art keywords
mounting
substrate
electronic component
information
column
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Expired - Fee Related
Application number
JP2005091975A
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English (en)
Japanese (ja)
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JP2006278468A (ja
JP2006278468A5 (enrdf_load_stackoverflow
Inventor
勇 河合
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Mechatronics Corp
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Shibaura Mechatronics Corp
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Publication date
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Priority to JP2005091975A priority Critical patent/JP4589160B2/ja
Publication of JP2006278468A publication Critical patent/JP2006278468A/ja
Publication of JP2006278468A5 publication Critical patent/JP2006278468A5/ja
Application granted granted Critical
Publication of JP4589160B2 publication Critical patent/JP4589160B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Wire Bonding (AREA)
JP2005091975A 2005-03-28 2005-03-28 電子部品の実装装置及び実装方法 Expired - Fee Related JP4589160B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005091975A JP4589160B2 (ja) 2005-03-28 2005-03-28 電子部品の実装装置及び実装方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005091975A JP4589160B2 (ja) 2005-03-28 2005-03-28 電子部品の実装装置及び実装方法

Publications (3)

Publication Number Publication Date
JP2006278468A JP2006278468A (ja) 2006-10-12
JP2006278468A5 JP2006278468A5 (enrdf_load_stackoverflow) 2010-08-05
JP4589160B2 true JP4589160B2 (ja) 2010-12-01

Family

ID=37212951

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005091975A Expired - Fee Related JP4589160B2 (ja) 2005-03-28 2005-03-28 電子部品の実装装置及び実装方法

Country Status (1)

Country Link
JP (1) JP4589160B2 (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4958655B2 (ja) * 2007-06-27 2012-06-20 新光電気工業株式会社 電子部品実装装置および電子装置の製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3822923B2 (ja) * 1995-06-27 2006-09-20 キヤノンマシナリー株式会社 ピックアップ装置及びチップ位置決め方法
JP2002190003A (ja) * 2000-12-21 2002-07-05 Hitachi Ltd Ｉｃモジュールの製造方法
JP3565201B2 (ja) * 2001-11-20 2004-09-15 松下電器産業株式会社 チップの実装方法
JP3818146B2 (ja) * 2001-12-18 2006-09-06 松下電器産業株式会社 電子部品搭載装置および電子部品搭載方法
JP2004291435A (ja) * 2003-03-27 2004-10-21 Seiko Epson Corp 有機ｅｌアレイ露光ヘッドチップ及びそれを用いた有機ｅｌアレイ露光ヘッド

Also Published As

Publication number Publication date
JP2006278468A (ja) 2006-10-12

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