JP4588621B2 - フレキシブルプリント配線板用積層体及び該積層体の銅合金層の形成に用いるＣｕ合金スパッタリングターゲット - Google Patents

フレキシブルプリント配線板用積層体及び該積層体の銅合金層の形成に用いるＣｕ合金スパッタリングターゲット Download PDF

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Publication number
JP4588621B2
JP4588621B2 JP2005353764A JP2005353764A JP4588621B2 JP 4588621 B2 JP4588621 B2 JP 4588621B2 JP 2005353764 A JP2005353764 A JP 2005353764A JP 2005353764 A JP2005353764 A JP 2005353764A JP 4588621 B2 JP4588621 B2 JP 4588621B2
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Prior art keywords
layer
copper
copper alloy
atomic
flexible printed
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JP2005353764A
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Japanese (ja)
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JP2007158182A (ja
JP2007158182A5 (enExample
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雅夫 水野
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Kobe Steel Ltd
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Kobe Steel Ltd
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JP2005353764A 2005-12-07 2005-12-07 フレキシブルプリント配線板用積層体及び該積層体の銅合金層の形成に用いるＣｕ合金スパッタリングターゲット Expired - Fee Related JP4588621B2 (ja)

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JP2005353764A JP4588621B2 (ja) 2005-12-07 2005-12-07 フレキシブルプリント配線板用積層体及び該積層体の銅合金層の形成に用いるＣｕ合金スパッタリングターゲット

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JP2005353764A JP4588621B2 (ja) 2005-12-07 2005-12-07 フレキシブルプリント配線板用積層体及び該積層体の銅合金層の形成に用いるＣｕ合金スパッタリングターゲット

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JP2007158182A JP2007158182A (ja) 2007-06-21
JP2007158182A5 JP2007158182A5 (enExample) 2009-10-22
JP4588621B2 true JP4588621B2 (ja) 2010-12-01

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JP2005353764A Expired - Fee Related JP4588621B2 (ja) 2005-12-07 2005-12-07 フレキシブルプリント配線板用積層体及び該積層体の銅合金層の形成に用いるＣｕ合金スパッタリングターゲット

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Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5211597B2 (ja) * 2007-09-13 2013-06-12 株式会社リコー 断熱構造を有するスタンパの製造方法
KR101172112B1 (ko) * 2008-11-14 2012-08-10 엘지이노텍 주식회사 터치 스크린 및 그 제조방법
JP2010283052A (ja) * 2009-06-03 2010-12-16 Sharp Corp 配線シート、裏面電極型太陽電池セル、配線シート付き太陽電池セルおよび太陽電池モジュール
US10304749B2 (en) * 2017-06-20 2019-05-28 Intel Corporation Method and apparatus for improved etch stop layer or hard mask layer of a memory device
JP2021056162A (ja) 2019-10-01 2021-04-08 日東電工株式会社 導電フィルムおよび温度センサフィルム

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6412596A (en) * 1987-07-06 1989-01-17 Furukawa Electric Co Ltd Manufacture of flexible printed substrate
JP2005271515A (ja) * 2004-03-26 2005-10-06 Toray Ind Inc 導体層付き樹脂フィルム

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