JP4574302B2 - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法 Download PDF

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Publication number
JP4574302B2
JP4574302B2 JP2004267800A JP2004267800A JP4574302B2 JP 4574302 B2 JP4574302 B2 JP 4574302B2 JP 2004267800 A JP2004267800 A JP 2004267800A JP 2004267800 A JP2004267800 A JP 2004267800A JP 4574302 B2 JP4574302 B2 JP 4574302B2
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JP
Japan
Prior art keywords
probe
wafer
cleaning
semiconductor device
manufacturing
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2004267800A
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English (en)
Japanese (ja)
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JP2006086244A (ja
JP2006086244A5 (enExample
Inventor
淳逸 小川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renesas Electronics Corp
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Renesas Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Electronics Corp filed Critical Renesas Electronics Corp
Priority to JP2004267800A priority Critical patent/JP4574302B2/ja
Publication of JP2006086244A publication Critical patent/JP2006086244A/ja
Publication of JP2006086244A5 publication Critical patent/JP2006086244A5/ja
Application granted granted Critical
Publication of JP4574302B2 publication Critical patent/JP4574302B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2004267800A 2004-09-15 2004-09-15 半導体装置の製造方法 Expired - Fee Related JP4574302B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004267800A JP4574302B2 (ja) 2004-09-15 2004-09-15 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004267800A JP4574302B2 (ja) 2004-09-15 2004-09-15 半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2006086244A JP2006086244A (ja) 2006-03-30
JP2006086244A5 JP2006086244A5 (enExample) 2007-10-25
JP4574302B2 true JP4574302B2 (ja) 2010-11-04

Family

ID=36164508

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004267800A Expired - Fee Related JP4574302B2 (ja) 2004-09-15 2004-09-15 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JP4574302B2 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009115720A (ja) * 2007-11-08 2009-05-28 Japan Electronic Materials Corp プローブのクリーニング方法およびプローブのクリーニング装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5840836A (ja) * 1981-09-03 1983-03-09 Seiko Epson Corp 半導体装置の製造方法
JPH0442944A (ja) * 1990-06-06 1992-02-13 Matsushita Electron Corp 半導体装置
JP2004228314A (ja) * 2003-01-22 2004-08-12 Renesas Technology Corp パッドを有する半導体装置

Also Published As

Publication number Publication date
JP2006086244A (ja) 2006-03-30

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