JP4566794B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP4566794B2
JP4566794B2 JP2005082337A JP2005082337A JP4566794B2 JP 4566794 B2 JP4566794 B2 JP 4566794B2 JP 2005082337 A JP2005082337 A JP 2005082337A JP 2005082337 A JP2005082337 A JP 2005082337A JP 4566794 B2 JP4566794 B2 JP 4566794B2
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Japan
Prior art keywords
substrate
antenna
chip
insulating film
film
Prior art date
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Expired - Fee Related
Application number
JP2005082337A
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English (en)
Japanese (ja)
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JP2005311331A (ja
JP2005311331A5 (enExample
Inventor
舜平 山崎
麻衣 秋葉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semiconductor Energy Laboratory Co Ltd
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Semiconductor Energy Laboratory Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Semiconductor Energy Laboratory Co Ltd filed Critical Semiconductor Energy Laboratory Co Ltd
Priority to JP2005082337A priority Critical patent/JP4566794B2/ja
Publication of JP2005311331A publication Critical patent/JP2005311331A/ja
Publication of JP2005311331A5 publication Critical patent/JP2005311331A5/ja
Application granted granted Critical
Publication of JP4566794B2 publication Critical patent/JP4566794B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Thin Film Transistor (AREA)
JP2005082337A 2004-03-26 2005-03-22 半導体装置 Expired - Fee Related JP4566794B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005082337A JP4566794B2 (ja) 2004-03-26 2005-03-22 半導体装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004090743 2004-03-26
JP2005082337A JP4566794B2 (ja) 2004-03-26 2005-03-22 半導体装置

Publications (3)

Publication Number Publication Date
JP2005311331A JP2005311331A (ja) 2005-11-04
JP2005311331A5 JP2005311331A5 (enExample) 2008-05-01
JP4566794B2 true JP4566794B2 (ja) 2010-10-20

Family

ID=35439679

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005082337A Expired - Fee Related JP4566794B2 (ja) 2004-03-26 2005-03-22 半導体装置

Country Status (1)

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JP (1) JP4566794B2 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4572343B2 (ja) * 2006-03-03 2010-11-04 セイコーエプソン株式会社 電子基板、半導体装置および電子機器
JP4908899B2 (ja) * 2006-04-07 2012-04-04 ラピスセミコンダクタ株式会社 半導体装置及びその製造方法
US7977170B2 (en) * 2006-10-03 2011-07-12 Eastman Kodak Company Flexible substrate with electronic devices and traces
KR101180831B1 (ko) 2006-11-14 2012-09-07 주식회사 엘지화학 Ｒｆⅰｄ 태그용 다이본딩 장치 및 방법
JP2008217776A (ja) * 2007-02-09 2008-09-18 Semiconductor Energy Lab Co Ltd 半導体装置
JP5403903B2 (ja) 2007-12-04 2014-01-29 ルネサスエレクトロニクス株式会社 半導体装置、その製造方法、および当該半導体装置を用いた信号送受信方法
JP5442950B2 (ja) 2008-01-29 2014-03-19 ルネサスエレクトロニクス株式会社 半導体装置、その製造方法、当該半導体装置を用いた信号送受信方法、およびテスタ装置
JP2011171327A (ja) * 2010-02-16 2011-09-01 Toshiba Corp 発光素子およびその製造方法、並びに発光装置
ITMI20111416A1 (it) 2011-07-28 2013-01-29 St Microelectronics Srl Circuito integrato dotato di almeno una antenna integrata
JP6390418B2 (ja) * 2014-12-24 2018-09-19 株式会社ソシオネクスト 半導体装置、半導体装置の製造方法、及び半導体装置の識別方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11135675A (ja) * 1997-10-30 1999-05-21 Kawasaki Steel Corp 半導体装置及びその製造方法
JP2000020665A (ja) * 1998-06-30 2000-01-21 Toshiba Corp 半導体装置
JP2000311226A (ja) * 1998-07-28 2000-11-07 Toshiba Corp 無線ｉｃカード及びその製造方法並びに無線ｉｃカード読取り書込みシステム
JP4168597B2 (ja) * 2001-03-13 2008-10-22 三菱マテリアル株式会社 トランスポンダ用アンテナ

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JP2005311331A (ja) 2005-11-04

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