JP4557821B2 - 微小粒子の配置装置および方法 - Google Patents

微小粒子の配置装置および方法 Download PDF

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Publication number
JP4557821B2
JP4557821B2 JP2005191621A JP2005191621A JP4557821B2 JP 4557821 B2 JP4557821 B2 JP 4557821B2 JP 2005191621 A JP2005191621 A JP 2005191621A JP 2005191621 A JP2005191621 A JP 2005191621A JP 4557821 B2 JP4557821 B2 JP 4557821B2
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head
inner circle
fine particles
mask
moving
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JP2005191621A
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Japanese (ja)
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JP2006019741A5 (enExample
JP2006019741A (ja
Inventor
徹 根橋
茂明 川上
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Athlete FA Corp
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Athlete FA Corp
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Priority to JP2005191621A priority Critical patent/JP4557821B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
JP2005191621A 2005-06-30 2005-06-30 微小粒子の配置装置および方法 Expired - Lifetime JP4557821B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005191621A JP4557821B2 (ja) 2005-06-30 2005-06-30 微小粒子の配置装置および方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005191621A JP4557821B2 (ja) 2005-06-30 2005-06-30 微小粒子の配置装置および方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2004192364 Division 2004-06-30 2004-06-30

Publications (3)

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JP2006019741A JP2006019741A (ja) 2006-01-19
JP2006019741A5 JP2006019741A5 (enExample) 2007-07-26
JP4557821B2 true JP4557821B2 (ja) 2010-10-06

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JP2005191621A Expired - Lifetime JP4557821B2 (ja) 2005-06-30 2005-06-30 微小粒子の配置装置および方法

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JP (1) JP4557821B2 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI408756B (zh) * 2006-07-12 2013-09-11 愛立發股份有限公司 Ball filling device and method
JP4797883B2 (ja) * 2006-08-22 2011-10-19 株式会社デンソー 部品の実装方法
JP4828595B2 (ja) 2007-12-19 2011-11-30 新光電気工業株式会社 導電性ボール除去方法及び導電性ボール除去装置
JP5376827B2 (ja) * 2008-04-30 2013-12-25 アスリートＦａ株式会社 ボール搭載装置およびボール搭載方法
JP5141966B2 (ja) * 2008-05-22 2013-02-13 澁谷工業株式会社 微小ボール配列装置
JP4973633B2 (ja) * 2008-09-24 2012-07-11 株式会社日立プラントテクノロジー ハンダボール印刷装置
JP2014165455A (ja) * 2013-02-27 2014-09-08 Shibuya Kogyo Co Ltd 導電性ボールの搭載状態検査装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3271482B2 (ja) * 1994-08-30 2002-04-02 松下電器産業株式会社 半田ボール搭載装置及び半田ボール搭載方法
JP3606191B2 (ja) * 2000-10-25 2005-01-05 松下電器産業株式会社 導電性ボールの整列装置および搭載装置
JP3854859B2 (ja) * 2001-12-11 2006-12-06 日立ビアメカニクス株式会社 導電性ボール搭載装置
JP3635068B2 (ja) * 2002-03-06 2005-03-30 株式会社日立製作所 バンプ形成装置
JP2004031585A (ja) * 2002-06-25 2004-01-29 Nippon Steel Corp 導電性ボールの搭載装置

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JP2006019741A (ja) 2006-01-19

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