JP2006019741A5 - - Google Patents
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- Publication number
- JP2006019741A5 JP2006019741A5 JP2005191621A JP2005191621A JP2006019741A5 JP 2006019741 A5 JP2006019741 A5 JP 2006019741A5 JP 2005191621 A JP2005191621 A JP 2005191621A JP 2005191621 A JP2005191621 A JP 2005191621A JP 2006019741 A5 JP2006019741 A5 JP 2006019741A5
- Authority
- JP
- Japan
- Prior art keywords
- head
- limited area
- moving
- mask
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010030 laminating Methods 0.000 claims 3
- 238000000034 method Methods 0.000 claims 3
- 230000007423 decrease Effects 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005191621A JP4557821B2 (ja) | 2005-06-30 | 2005-06-30 | 微小粒子の配置装置および方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005191621A JP4557821B2 (ja) | 2005-06-30 | 2005-06-30 | 微小粒子の配置装置および方法 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004192364 Division | 2004-06-30 | 2004-06-30 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2006019741A JP2006019741A (ja) | 2006-01-19 |
| JP2006019741A5 true JP2006019741A5 (enExample) | 2007-07-26 |
| JP4557821B2 JP4557821B2 (ja) | 2010-10-06 |
Family
ID=35793645
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005191621A Expired - Lifetime JP4557821B2 (ja) | 2005-06-30 | 2005-06-30 | 微小粒子の配置装置および方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4557821B2 (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI408756B (zh) * | 2006-07-12 | 2013-09-11 | 愛立發股份有限公司 | Ball filling device and method |
| JP4797883B2 (ja) * | 2006-08-22 | 2011-10-19 | 株式会社デンソー | 部品の実装方法 |
| JP4828595B2 (ja) | 2007-12-19 | 2011-11-30 | 新光電気工業株式会社 | 導電性ボール除去方法及び導電性ボール除去装置 |
| JP5376827B2 (ja) * | 2008-04-30 | 2013-12-25 | アスリートFa株式会社 | ボール搭載装置およびボール搭載方法 |
| JP5141966B2 (ja) * | 2008-05-22 | 2013-02-13 | 澁谷工業株式会社 | 微小ボール配列装置 |
| JP4973633B2 (ja) * | 2008-09-24 | 2012-07-11 | 株式会社日立プラントテクノロジー | ハンダボール印刷装置 |
| JP2014165455A (ja) * | 2013-02-27 | 2014-09-08 | Shibuya Kogyo Co Ltd | 導電性ボールの搭載状態検査装置 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3271482B2 (ja) * | 1994-08-30 | 2002-04-02 | 松下電器産業株式会社 | 半田ボール搭載装置及び半田ボール搭載方法 |
| JP3606191B2 (ja) * | 2000-10-25 | 2005-01-05 | 松下電器産業株式会社 | 導電性ボールの整列装置および搭載装置 |
| JP3854859B2 (ja) * | 2001-12-11 | 2006-12-06 | 日立ビアメカニクス株式会社 | 導電性ボール搭載装置 |
| JP3635068B2 (ja) * | 2002-03-06 | 2005-03-30 | 株式会社日立製作所 | バンプ形成装置 |
| JP2004031585A (ja) * | 2002-06-25 | 2004-01-29 | Nippon Steel Corp | 導電性ボールの搭載装置 |
-
2005
- 2005-06-30 JP JP2005191621A patent/JP4557821B2/ja not_active Expired - Lifetime
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