JP4556455B2 - 含浸用樹脂組成物 - Google Patents
含浸用樹脂組成物 Download PDFInfo
- Publication number
- JP4556455B2 JP4556455B2 JP2004074675A JP2004074675A JP4556455B2 JP 4556455 B2 JP4556455 B2 JP 4556455B2 JP 2004074675 A JP2004074675 A JP 2004074675A JP 2004074675 A JP2004074675 A JP 2004074675A JP 4556455 B2 JP4556455 B2 JP 4556455B2
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- JP
- Japan
- Prior art keywords
- resin
- epoxy
- resin composition
- impregnation
- content
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- 239000011342 resin composition Substances 0.000 title claims description 22
- 229920005989 resin Polymers 0.000 claims description 48
- 239000011347 resin Substances 0.000 claims description 48
- 238000005470 impregnation Methods 0.000 claims description 17
- 239000003822 epoxy resin Substances 0.000 claims description 14
- 229920000647 polyepoxide Polymers 0.000 claims description 14
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 claims description 10
- 239000004593 Epoxy Substances 0.000 claims description 6
- 229920000728 polyester Polymers 0.000 claims description 5
- 229920001225 polyester resin Polymers 0.000 claims description 5
- 239000004645 polyester resin Substances 0.000 claims description 5
- 239000002253 acid Substances 0.000 claims description 4
- 229920003986 novolac Polymers 0.000 claims description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 5
- 230000007774 longterm Effects 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 239000003054 catalyst Substances 0.000 description 4
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 150000008065 acid anhydrides Chemical class 0.000 description 3
- 239000009719 polyimide resin Substances 0.000 description 3
- 230000000593 degrading effect Effects 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000004843 novolac epoxy resin Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
Images
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- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Insulation, Fastening Of Motor, Generator Windings (AREA)
Description
Claims (4)
- ポリエステル樹脂とエポキシ樹脂とを含有する混合樹脂に、ノボラック型エポキシを基本骨格に有するエポキシアクリレートを添加して成ることを特徴とする含浸用樹脂組成物。
- 前記混合樹脂の含有率が25〜75wt%であり、前記エポキシアクリレートの含有率が75〜25wt%であることを特徴とする請求項1に記載の含浸用樹脂組成物。
- 前記混合樹脂の含有率が75wt%であり、前記エポキシアクリレートの含有率が25wt%であることを特徴とする請求項1に記載の含浸用樹脂組成物。
- 前記混合樹脂は酸価が40のイソフタル酸系ポリエステルとエポキシ等量が190のエピビス系エポキシ樹脂とから成ることを特徴とする請求項1〜3いずれか1項に記載の含浸用樹脂組成物。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004074675A JP4556455B2 (ja) | 2004-03-16 | 2004-03-16 | 含浸用樹脂組成物 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004074675A JP4556455B2 (ja) | 2004-03-16 | 2004-03-16 | 含浸用樹脂組成物 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005263855A JP2005263855A (ja) | 2005-09-29 |
JP4556455B2 true JP4556455B2 (ja) | 2010-10-06 |
Family
ID=35088738
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004074675A Expired - Lifetime JP4556455B2 (ja) | 2004-03-16 | 2004-03-16 | 含浸用樹脂組成物 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4556455B2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103093889A (zh) * | 2013-02-05 | 2013-05-08 | 宁波市鄞州锐坚化工科技有限公司 | 一种电缆芯 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6279161B1 (ja) * | 2016-03-31 | 2018-02-14 | 三菱電機株式会社 | 硬化性組成物およびその硬化物ならびに回転機 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01261430A (ja) * | 1988-04-13 | 1989-10-18 | Dainippon Ink & Chem Inc | 積層板の製造方法 |
JPH07179732A (ja) * | 1993-12-22 | 1995-07-18 | Meidensha Corp | 含浸用樹脂組成物 |
JPH07233242A (ja) * | 1994-02-24 | 1995-09-05 | Sekisui Chem Co Ltd | 型内被覆成形用被覆組成物 |
JPH07242797A (ja) * | 1994-03-03 | 1995-09-19 | Sekisui Chem Co Ltd | 型内被覆成形用被覆組成物 |
-
2004
- 2004-03-16 JP JP2004074675A patent/JP4556455B2/ja not_active Expired - Lifetime
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01261430A (ja) * | 1988-04-13 | 1989-10-18 | Dainippon Ink & Chem Inc | 積層板の製造方法 |
JPH07179732A (ja) * | 1993-12-22 | 1995-07-18 | Meidensha Corp | 含浸用樹脂組成物 |
JPH07233242A (ja) * | 1994-02-24 | 1995-09-05 | Sekisui Chem Co Ltd | 型内被覆成形用被覆組成物 |
JPH07242797A (ja) * | 1994-03-03 | 1995-09-19 | Sekisui Chem Co Ltd | 型内被覆成形用被覆組成物 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103093889A (zh) * | 2013-02-05 | 2013-05-08 | 宁波市鄞州锐坚化工科技有限公司 | 一种电缆芯 |
CN103093889B (zh) * | 2013-02-05 | 2015-02-11 | 宁波市鄞州锐坚化工科技有限公司 | 一种电缆芯 |
Also Published As
Publication number | Publication date |
---|---|
JP2005263855A (ja) | 2005-09-29 |
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