JP4547817B2 - プリント配線板のランド部、部品実装されたプリント配線板、プリント配線板の製造方法、及び、プリント配線板実装方法 - Google Patents

プリント配線板のランド部、部品実装されたプリント配線板、プリント配線板の製造方法、及び、プリント配線板実装方法 Download PDF

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Publication number
JP4547817B2
JP4547817B2 JP2001063366A JP2001063366A JP4547817B2 JP 4547817 B2 JP4547817 B2 JP 4547817B2 JP 2001063366 A JP2001063366 A JP 2001063366A JP 2001063366 A JP2001063366 A JP 2001063366A JP 4547817 B2 JP4547817 B2 JP 4547817B2
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JP
Japan
Prior art keywords
wiring board
printed wiring
land portion
land
solder mask
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2001063366A
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English (en)
Japanese (ja)
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JP2001332851A5 (enExample
JP2001332851A (ja
Inventor
和浩 伊藤
守 永田
正男 榧場
良彦 三宅
秀幸 荒金
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP2001063366A priority Critical patent/JP4547817B2/ja
Publication of JP2001332851A publication Critical patent/JP2001332851A/ja
Priority to KR1020037011257A priority patent/KR100887894B1/ko
Priority to PCT/JP2002/000495 priority patent/WO2002071819A1/ja
Priority to EP02711221A priority patent/EP1367875A4/en
Priority to US10/471,075 priority patent/US20040078964A1/en
Priority to CNB028053664A priority patent/CN100423621C/zh
Priority to TW091104136A priority patent/TW540263B/zh
Publication of JP2001332851A5 publication Critical patent/JP2001332851A5/ja
Application granted granted Critical
Publication of JP4547817B2 publication Critical patent/JP4547817B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2001063366A 2000-03-15 2001-03-07 プリント配線板のランド部、部品実装されたプリント配線板、プリント配線板の製造方法、及び、プリント配線板実装方法 Expired - Lifetime JP4547817B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2001063366A JP4547817B2 (ja) 2000-03-15 2001-03-07 プリント配線板のランド部、部品実装されたプリント配線板、プリント配線板の製造方法、及び、プリント配線板実装方法
KR1020037011257A KR100887894B1 (ko) 2001-03-07 2002-01-24 프린트 배선판의 랜드부, 프린트 배선판의 제조 방법, 및프린트 배선판 실장 방법
PCT/JP2002/000495 WO2002071819A1 (en) 2001-03-07 2002-01-24 Land portion of printed wiring board, method for manufacturing printed wiring board, and printed wiring board mounting method
EP02711221A EP1367875A4 (en) 2001-03-07 2002-01-24 "CONTACT PANEL PART OF A PCB, METHOD FOR PRODUCING A PCB AND PCB PAD MOUNTING METHOD"
US10/471,075 US20040078964A1 (en) 2001-03-07 2002-01-24 Land portion of printed wiring board, method for manufacturing printed wiring board, and printed wiring board mounting method
CNB028053664A CN100423621C (zh) 2001-03-07 2002-01-24 印制布线板的连接盘部分、印制布线板的制造方法和印制布线板的元件安装方法
TW091104136A TW540263B (en) 2001-03-07 2002-03-06 Land portion of printed wiring board, method for manufacturing printed wiring board, and printed wiring board mounting method

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000071563 2000-03-15
JP2000-71563 2000-03-15
JP2001063366A JP4547817B2 (ja) 2000-03-15 2001-03-07 プリント配線板のランド部、部品実装されたプリント配線板、プリント配線板の製造方法、及び、プリント配線板実装方法

Publications (3)

Publication Number Publication Date
JP2001332851A JP2001332851A (ja) 2001-11-30
JP2001332851A5 JP2001332851A5 (enExample) 2008-03-27
JP4547817B2 true JP4547817B2 (ja) 2010-09-22

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001063366A Expired - Lifetime JP4547817B2 (ja) 2000-03-15 2001-03-07 プリント配線板のランド部、部品実装されたプリント配線板、プリント配線板の製造方法、及び、プリント配線板実装方法

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JP (1) JP4547817B2 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040078964A1 (en) * 2001-03-07 2004-04-29 Kazuhiro Itou Land portion of printed wiring board, method for manufacturing printed wiring board, and printed wiring board mounting method
JP4328485B2 (ja) * 2002-01-18 2009-09-09 日本電気株式会社 回路基板及び電子機器
JP4554873B2 (ja) 2002-04-22 2010-09-29 日本電気株式会社 配線板、電子機器および電子部品の実装方法並びに製造方法
JP2004111544A (ja) * 2002-09-17 2004-04-08 Ngk Spark Plug Co Ltd 多層配線基板
JPWO2005074338A1 (ja) 2004-01-29 2007-07-26 日本電気株式会社 回路基板
JP2006126463A (ja) * 2004-10-28 2006-05-18 Fuji Photo Film Co Ltd 露光方法および装置
JP4580839B2 (ja) * 2005-08-05 2010-11-17 プライムアースＥｖエナジー株式会社 プリント配線板
JP5011745B2 (ja) * 2006-02-17 2012-08-29 日本電気株式会社 多層プリント基板製造方法
JP2009200411A (ja) * 2008-02-25 2009-09-03 Mitsubishi Electric Corp はんだ接合部、プリント配線板およびはんだの接合方法
JP5118238B2 (ja) 2011-06-27 2013-01-16 ファナック株式会社 耐食性と歩留まりを向上させたプリント基板

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0383393A (ja) * 1989-08-28 1991-04-09 Matsushita Electric Ind Co Ltd プリント配線板
JPH057072A (ja) * 1991-06-27 1993-01-14 Matsushita Electric Ind Co Ltd プリント配線板
JPH08181424A (ja) * 1994-12-26 1996-07-12 Sony Corp プリント基板及びその半田付け方法
JPH10126026A (ja) * 1996-10-16 1998-05-15 Ibiden Co Ltd 電子部品搭載用基板及びその製造方法
JPH10145032A (ja) * 1996-11-11 1998-05-29 Kokusai Electric Co Ltd 電子部品実装用印刷回路板
JP4718091B2 (ja) * 2000-03-15 2011-07-06 パナソニック株式会社 接合構造体
JP2002111189A (ja) * 2000-09-28 2002-04-12 Aisin Seiki Co Ltd 回路基板
JP2002185120A (ja) * 2000-12-19 2002-06-28 Toshiba Corp 部品実装基板およびその製造方法
JP2002190664A (ja) * 2000-12-21 2002-07-05 Mitsubishi Electric Corp プリント配線板およびこれを用いた半導体装置

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Publication number Publication date
JP2001332851A (ja) 2001-11-30

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