JP4542574B2 - 基板移送ユニット、及び基板移送方法、そして前記ユニットを有する基板処理装置、及び前記ユニットを利用した基板処理方法 - Google Patents

基板移送ユニット、及び基板移送方法、そして前記ユニットを有する基板処理装置、及び前記ユニットを利用した基板処理方法 Download PDF

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JP4542574B2
JP4542574B2 JP2007219938A JP2007219938A JP4542574B2 JP 4542574 B2 JP4542574 B2 JP 4542574B2 JP 2007219938 A JP2007219938 A JP 2007219938A JP 2007219938 A JP2007219938 A JP 2007219938A JP 4542574 B2 JP4542574 B2 JP 4542574B2
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substrate
blade
support
chamber
lower blade
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JP2008277725A (ja
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ドン ソク パク
サン ホ ソル
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PSK Inc
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PSK Inc
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Separation Using Semi-Permeable Membranes (AREA)
JP2007219938A 2007-05-02 2007-08-27 基板移送ユニット、及び基板移送方法、そして前記ユニットを有する基板処理装置、及び前記ユニットを利用した基板処理方法 Active JP4542574B2 (ja)

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Application Number Priority Date Filing Date Title
KR1020070042599A KR100803559B1 (ko) 2007-05-02 2007-05-02 기판 반송 유닛 및 방법, 그리고 상기 유닛을 가지는 기판처리 장치 및 상기 유닛을 이용한 기판 처리 방법

Publications (2)

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JP2008277725A JP2008277725A (ja) 2008-11-13
JP4542574B2 true JP4542574B2 (ja) 2010-09-15

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Country Status (5)

Country Link
JP (1) JP4542574B2 (zh)
KR (1) KR100803559B1 (zh)
CN (1) CN101299415B (zh)
SG (1) SG147356A1 (zh)
TW (1) TWI358782B (zh)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9117870B2 (en) * 2008-03-27 2015-08-25 Lam Research Corporation High throughput cleaner chamber
TWI465599B (zh) 2008-12-29 2014-12-21 K C Tech Co Ltd 原子層沉積裝置
WO2011007580A1 (ja) * 2009-07-17 2011-01-20 株式会社アルバック 基板処理方法
JP2011119468A (ja) * 2009-12-03 2011-06-16 Tokyo Electron Ltd 被処理体の搬送方法および被処理体処理装置
US8562272B2 (en) 2010-02-16 2013-10-22 Lam Research Corporation Substrate load and unload mechanisms for high throughput
US8893642B2 (en) 2010-03-24 2014-11-25 Lam Research Corporation Airflow management for low particulate count in a process tool
JP5518550B2 (ja) * 2010-04-12 2014-06-11 東京エレクトロン株式会社 被処理体処理装置
CN102530556B (zh) * 2010-12-20 2015-06-24 理想能源设备(上海)有限公司 基板传输装置、基板传输方法及基板传输系统
CN102820245B (zh) * 2012-08-16 2015-02-11 上海华力微电子有限公司 具有存片槽的薄膜工艺系统及其存取片方法
KR101744411B1 (ko) 2015-10-15 2017-06-20 두산중공업 주식회사 가스터빈의 냉각장치
KR101929872B1 (ko) * 2016-08-19 2019-03-15 피에스케이 주식회사 기판 처리 장치 및 기판 처리 방법
WO2018075262A1 (en) * 2016-10-18 2018-04-26 Mattson Technology, Inc. Systems and methods for workpiece processing
US11024531B2 (en) 2017-01-23 2021-06-01 Lam Research Corporation Optimized low energy / high productivity deposition system
JP6775432B2 (ja) * 2017-01-24 2020-10-28 Ｓｐｐテクノロジーズ株式会社 真空搬送モジュール及び基板処理装置
CN108754458B (zh) * 2018-05-23 2020-10-16 上海华力微电子有限公司 一种化学气相淀积机台及处理机台报警的方法
US10968052B2 (en) 2019-06-19 2021-04-06 Applied Materials, Inc. Long reach vacuum robot with dual wafer pockets

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000133690A (ja) * 1998-10-26 2000-05-12 Rorze Corp ウエハ搬送装置
JP2001135698A (ja) * 1999-06-03 2001-05-18 Applied Materials Inc 外部のステージング領域を有するロードロック
US20020061248A1 (en) * 2000-07-07 2002-05-23 Applied Materials, Inc. High productivity semiconductor wafer processing system
JP2002158272A (ja) * 2000-11-17 2002-05-31 Tatsumo Kk ダブルアーム基板搬送装置
JP2002184834A (ja) * 2000-12-15 2002-06-28 Yaskawa Electric Corp 基板搬送用ロボット
JP2003170384A (ja) * 2001-12-04 2003-06-17 Rorze Corp 平板状物の搬送用スカラ型ロボットおよび平板状物の処理システム
JP2003264215A (ja) * 2002-03-07 2003-09-19 Seiko Epson Corp 板状部材の搬送方法及び搬送装置
JP2004288719A (ja) * 2003-03-19 2004-10-14 Tokyo Electron Ltd 基板搬送装置及び基板処理装置
JP2004535072A (ja) * 2001-07-13 2004-11-18 ブルックス オートメーション インコーポレイテッド 独立多エンドエフェクタを備えた基板移送装置
JP2007005582A (ja) * 2005-06-24 2007-01-11 Asm Japan Kk 基板搬送装置及びそれを搭載した半導体基板製造装置
JP2008016815A (ja) * 2006-07-04 2008-01-24 Psk Inc 基板搬送装置及びこの基板搬送装置を用いた基板処理設備
JP2008135630A (ja) * 2006-11-29 2008-06-12 Jel:Kk 基板搬送装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2552090B2 (ja) * 1994-05-31 1996-11-06 九州日本電気株式会社 ウェーハ受渡し機構
US5838121A (en) * 1996-11-18 1998-11-17 Applied Materials, Inc. Dual blade robot
KR100527669B1 (ko) * 2003-12-19 2005-11-25 삼성전자주식회사 로봇 암 장치
KR100596466B1 (ko) * 2004-03-15 2006-07-05 주식회사 뉴파워 프라즈마 다중 배열된 진공 챔버를 갖는 플라즈마 반응 챔버를구비한 기판 처리 시스템

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000133690A (ja) * 1998-10-26 2000-05-12 Rorze Corp ウエハ搬送装置
JP2001135698A (ja) * 1999-06-03 2001-05-18 Applied Materials Inc 外部のステージング領域を有するロードロック
US20020061248A1 (en) * 2000-07-07 2002-05-23 Applied Materials, Inc. High productivity semiconductor wafer processing system
JP2002158272A (ja) * 2000-11-17 2002-05-31 Tatsumo Kk ダブルアーム基板搬送装置
JP2002184834A (ja) * 2000-12-15 2002-06-28 Yaskawa Electric Corp 基板搬送用ロボット
JP2004535072A (ja) * 2001-07-13 2004-11-18 ブルックス オートメーション インコーポレイテッド 独立多エンドエフェクタを備えた基板移送装置
JP2003170384A (ja) * 2001-12-04 2003-06-17 Rorze Corp 平板状物の搬送用スカラ型ロボットおよび平板状物の処理システム
JP2003264215A (ja) * 2002-03-07 2003-09-19 Seiko Epson Corp 板状部材の搬送方法及び搬送装置
JP2004288719A (ja) * 2003-03-19 2004-10-14 Tokyo Electron Ltd 基板搬送装置及び基板処理装置
JP2007005582A (ja) * 2005-06-24 2007-01-11 Asm Japan Kk 基板搬送装置及びそれを搭載した半導体基板製造装置
JP2008016815A (ja) * 2006-07-04 2008-01-24 Psk Inc 基板搬送装置及びこの基板搬送装置を用いた基板処理設備
JP2008135630A (ja) * 2006-11-29 2008-06-12 Jel:Kk 基板搬送装置

Also Published As

Publication number Publication date
KR100803559B1 (ko) 2008-02-15
TW200845275A (en) 2008-11-16
JP2008277725A (ja) 2008-11-13
TWI358782B (en) 2012-02-21
CN101299415A (zh) 2008-11-05
CN101299415B (zh) 2012-07-04
SG147356A1 (en) 2008-11-28

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