JP4542574B2 - Substrate transfer unit, substrate transfer method, substrate processing apparatus having the unit, and substrate processing method using the unit - Google Patents

Substrate transfer unit, substrate transfer method, substrate processing apparatus having the unit, and substrate processing method using the unit Download PDF

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JP4542574B2
JP4542574B2 JP2007219938A JP2007219938A JP4542574B2 JP 4542574 B2 JP4542574 B2 JP 4542574B2 JP 2007219938 A JP2007219938 A JP 2007219938A JP 2007219938 A JP2007219938 A JP 2007219938A JP 4542574 B2 JP4542574 B2 JP 4542574B2
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substrate
blade
member
placed
support
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JP2008277725A (en
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サン ホ ソル
ドン ソク パク
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ピーエスケー・インコーポレーテッド
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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742Mechanical parts of transfer devices

Description

The present invention relates to an apparatus and a method used for manufacturing a semiconductor substrate, and more particularly, a unit for transferring a substrate, a substrate transfer method, a substrate processing apparatus having the unit, and a substrate processing method using the unit. About.

Recently, cluster-type devices are often used as devices for manufacturing semiconductor elements. The cluster type apparatus has a structure in which a load lock chamber and a process chamber are arranged around a transfer chamber. In general, wafers are placed in a load lock chamber so as to be spaced apart from each other in the vertical direction. In one process chamber, two chucks on which the substrate is placed are provided, and these chucks are arranged side by side.

The transfer chamber is provided with a transfer unit for transferring wafers between the load lock chamber and the process chamber and between one process chamber and the other process chamber. Since the transfer unit has only one blade on which the wafer is located, only one wafer is transferred at a time. In order to place a wafer on each of the two chucks provided in the process chamber, the transfer unit must transfer the wafer between the load lock chamber and the process chamber twice. Therefore, it takes a long time to transfer the substrate.

On the other hand, it is possible to provide two robots that are independently driven by the transfer chamber. However, in this case, since two robots must be provided, the area occupied by the transfer chamber increases. Also, since two robots cannot flow into the same load lock chamber at the same time, the other robots must wait until one robot removes the wafer from the load lock chamber.

Further, a general transfer unit has only one support part on which a wafer is placed on a blade. The blade takes out the wafer having been completed from the process chamber, puts it into the load lock chamber, takes out another wafer in the load lock chamber, and transfers it to the process chamber. Accordingly, after a process is performed on a wafer in the process chamber, a long time is required for transferring the wafer until the process is performed on the next wafer, so that the throughput of the process chamber is greatly reduced.

The present invention has been made to solve the above-mentioned problems, and its object is to provide a substrate transfer unit and a substrate processing apparatus having a new structure capable of efficiently transferring a substrate, and a substrate transfer (return) using the same. A method and a substrate processing method are provided.

The present invention Another object is to provide a substrate transfer unit having a novel structure that can shorten the time required for substrate transfer, and a substrate processing apparatus and a substrate transfer utilizing this (return) method and a substrate processing method There is.

  The objects of the present invention are not limited thereto, and other objects not mentioned in the present invention will be clearly understood by those skilled in the art from the following description.

To achieve the above object, according to an embodiment of the present invention, the present invention provides a unit for transferring a substrate. The substrate transfer unit includes a blade member on which a substrate is placed, an arm member that is coupled to the blade member and moves the blade member, and a driving member that provides a driving force to the blade member or the arm member. The blade member includes a lower blade and an upper blade that is positioned on an upper portion of the lower blade and can change a relative position to the lower blade. In the present embodiment, each of the lower blade and the upper blade includes a first support portion on which the first substrate is placed, and a second support on which a second substrate different from the first substrate is placed. And a connecting portion that connects the first support portion and the second support portion. The first support part extends from one end of the connection part, and the second support part extends from the other end of the connection part in a direction opposite to the direction in which the first support part extends from the connection part. And a rotating shaft that connects the upper blade and the arm member are coupled to the connecting portion.

In a preferred embodiment of the present invention, the upper portion the blade and the lower blade, and a state in which the upper blade is folded is located on the vertical upper portion of the lower blade are predetermined angle rotation in the opposite direction to each other from the folded state It can be provided so that it can be repositioned between unfolded states. The driving member includes a blade driving machine that rotates the blade member independently of the arm member, and a vertical driving machine that raises and lowers the arm member and the blade member. The blade driving machine rotates the lower blade. And an upper blade driver that rotates the upper blade independently of the lower blade.

  In a preferred embodiment of the present invention, the lower blade driver includes a rotating shaft extending through the opening provided in the upper wall of the arm member from the lower portion of the connecting portion of the lower blade member and extending into the arm member, In a preferred embodiment of the present invention, the upper blade driver is inserted into the through-hole provided in the connecting portion of the lower blade member from the lower portion of the connecting portion of the upper blade member and the rotating shaft of the lower blade driver. A rotation axis can be included that extends into the arm member.

According to a reference example of the present invention, this reference example provides a unit for transferring a substrate. The substrate transfer unit includes an upper blade having at least two support portions on which the substrate is placed, and a lower blade disposed below the upper blade with at least two support portions on which the substrate is placed. The upper blade and the lower blade are moved by the same arm member, and the upper blade and the lower blade are provided so that they can be switched between a folded state that is a vertically opposed position and a spread state that is spread to a predetermined angle. .

In a preferred embodiment of the reference example of the present invention, the upper blade and the lower blade have the same shape, and each of the upper blade and the lower blade is connected to a rod member so as to be rotatable. The support part may be provided so as to extend from both ends of the connection part in the length direction of the connection part.

According to another embodiment of the present invention, the present invention provides an apparatus for processing a substrate. The substrate processing apparatus, the transfer chamber, at least one process chamber is arranged on one side of the transfer chamber, a substrate to be separated from each other in the vertical direction are arranged on another side of the transfer chamber is stationary location A load lock chamber is provided in the transfer chamber and includes a transfer unit for transferring the substrate between the load lock chamber and the process chamber. The transfer unit includes a blade member on which the substrate is placed, an arm member coupled to the blade member and moving the blade member, a blade member, and a driving member that provides a driving force to the arm member. The blade member includes a lower blade and an upper blade positioned on top of the lower blade, and the relative positions of the lower blade and the upper blade are provided to be variable. Further, each of the lower blade and the upper blade includes a first support portion on which the substrate is placed, a second support portion on which the substrate is placed, and a connecting portion that connects the first support portion and the second support portion. The first support part extends from one end of the connection part, and the second support part extends from the other end of the connection part in a direction opposite to the direction in which the first support part extends from the connection part, The rotating shaft that connects the arm member is coupled to the connecting portion of the lower blade, and the rotating shaft that connects the upper blade and the arm member is coupled to the connecting portion of the upper blade.

In a preferred embodiment of the present invention, the process chamber may include a housing provided with an inlet / outlet through which a substrate is inserted / extracted, and a support member disposed side by side in the housing and on which the substrate is placed. The process chamber includes a housing provided with an inlet / outlet through which a substrate enters and exits, a support member in which the substrate is placed, and the substrate processing apparatus includes a plurality of process chambers, At least two of the chambers can be arranged side by side. The upper blade and the lower blade may be provided so that they can be switched from a folded state that is a position facing each other up and down, and from a folded state to a spread state that is rotated by a predetermined angle in a direction opposite to each other. can Ru.

In another embodiment of the present invention, the present invention provides a method for transferring a substrate. The substrate transfer method includes a first support plate on which a substrate is placed so as to be separated from each other in the vertical direction using a transfer unit, and a second support plate on which the substrate is placed side by side in the lateral direction. The two units are transferred at the same time, and the transfer unit is in a folded state, which is a vertically opposed position, and in a spread state rotated from the folded state by a predetermined angle in a direction opposite to each other. An upper blade and a lower blade that can be converted are provided, and the substrate is placed on and taken out from the first support plate in a folded state, and the substrate is placed on and taken out from the second support plate in an unfolded state.

In the present embodiment, each of the upper blade and the lower blade further includes a first support portion and a second support portion in which the substrates are respectively disposed at both ends, and any one of the first support portion and the second support portion. In a state where the substrate to be put into the second support plate is placed on one support portion, the substrate on which the other support portion is placed on the second support plate can be taken out. Also, in a preferred embodiment of the present invention, the substrate placed on one support portion is used as the second support plate while the substrate taken out from the second support plate is placed on the other support portion. Can be detained.

In another embodiment of the present invention, the present invention provides a method for processing a substrate. The substrate processing method, the transfer chamber is provided at least one process chamber is arranged on one side of the transfer chamber, load lock chambers are arranged in another side of the transfer chamber, and a transfer chamber, a load lock chamber The substrate is processed using a substrate processing apparatus including a transfer unit that transfers the substrate to and from the process chamber. The load lock chamber is placed so that the substrates are spaced apart from each other so as to face each other. The substrate is placed in the process chamber so that the substrates are arranged side by side, and the transfer unit is set at a predetermined angle in the opposite direction from the folded state and the folded state facing each other up and down. It has rotated unfolded upper blade and a lower blade which can be converted to a state, transfer unit, loaded in a folded state Or taken out or the substrate is placed click chamber, or remove or the substrate is placed process chamber in a state of spread. Each of the upper blade and the lower blade includes a first support portion and a second support portion in which substrates are respectively disposed at both ends, and the transfer unit supports any one of the first support portion and the second support portion. In a state where the substrate on which the process is performed in the process chamber is held in the part, the substrate on which the process has been performed can be taken out from the process chamber using the other one support part.

According to the present invention, since the substrate transfer unit that can be switched between the folded state and the expanded state is used, the wafer transfer efficiency can be greatly improved and the area occupied by the substrate transfer unit can be reduced.

  Further, according to the present invention, since each blade has two support portions and a wafer is taken out from the process chamber, a wafer placed on another support portion can be immediately put into the process chamber. The throughput of the chamber can be improved.

  Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to FIGS. The embodiments of the present invention can be modified in various forms, and the scope of the present invention should not be construed as being limited by the embodiments described in detail below. This embodiment is provided to more fully explain the present invention to those skilled in the art.

  Accordingly, the shape of the elements in the drawings is exaggerated to more clearly emphasize the description. In addition, in the drawing, the drawing line of the invisible wafer among the two wafers that overlap each other in the plan view is indicated by a dotted line, and the lower blade that cannot be seen among the two blades that overlap each other vertically. The leader line is represented by a dotted line.

  In a preferred embodiment of the present invention, a substrate processing apparatus having a cluster type structure will be described as an example. However, the technical idea of the present invention is not limited to this, and the transfer unit of the present invention can be applied to apparatuses having various structures.

In the preferred embodiment of the present invention, a wafer for manufacturing semiconductor chips will be described as an example of an object to be moved by the transfer unit. However, the object transferred by the transfer unit of the present invention is not limited to a wafer. For example, the object may be various types having the same plate shape as a glass substrate or the like.

  FIG. 1 is a plan view schematically showing a substrate processing apparatus according to an embodiment of the present invention. Referring to FIG. 1, the substrate processing apparatus 1 includes an equipment front end module 10 and a process equipment 20.

  The equipment front end module 10 is mounted in front of the process equipment 20 and transfers the wafer W between the container 16 receiving the wafer W and the process equipment 20. The equipment front end module 10 includes a plurality of load ports 12 and a frame 14. The frame 14 is located between the load port 12 and the process equipment 20. The container 16 for receiving the wafer W is placed on the load port 12 by a transfer means (not shown) such as an overhead transfer, an overhead conveyor, or an automatic guided vehicle. Is done. The container 16 may be a closed container such as a front open unified pod. In the frame 14, a frame robot 18 for transferring the wafer W between the container 16 placed in the load port 12 and the process equipment 20 is installed. A door opener (not shown) that automatically opens and closes the door of the container 16 can be installed in the frame 14. Also, the frame 14 is provided with a fan filter unit (not shown) for supplying clean air into the frame 14 so that the clean air flows from the upper part to the lower part in the frame 14. There is.

The process equipment 20 includes a loadlock chamber 22, a transfer chamber 24, and a process chamber 26. The transfer chamber 24 has a substantially polygonal shape when viewed from above. On the side surface of the transfer chamber 24, the load lock chamber 22 or the process chamber 26 is located.

The load lock chamber 22 is located on the side of the transfer chamber 24 adjacent to the equipment front end module 10, and the process chamber 26 is located on the other side. One or a plurality of load lock chambers 22 are provided. According to one example, two load lock chambers 22 are provided. One of the two load lock chambers 22 temporarily holds the wafer W flowing into the process equipment 20 for the progress of the process, and the other one completes the process and the process equipment 20 Wafer W flowing out from the substrate can be temporarily stopped. Alternatively, one or a plurality of load lock chambers 22 may be provided, and a wafer may be loaded and unloaded in each load lock chamber 22.

  In the load lock chamber 22, the wafers are placed so as to be spaced apart from each other and opposed to each other. The load lock chamber may be provided with a plurality of slots 22a that support portions of the peripheral area of the wafer.

The inside of the transfer chamber 24 and the process chamber 26 is maintained in a vacuum, and the inside of the load lock chamber 22 is converted into a vacuum and atmospheric pressure. The load lock chamber 22 prevents external contaminants from flowing into the transfer chamber 24 and the process chamber 26. A gate valve (not shown) is installed between the load lock chamber 22 and the transfer chamber 24 and between the load lock chamber 22 and the equipment front end module 10. When the wafer W moves between the equipment front end module 10 and the load lock chamber 22, the gate valve provided between the load lock chamber 22 and the transfer chamber 24 is closed, and the load lock chamber 22 and the transfer chamber are closed. When the wafer W moves to and from 24, the gate valve provided between the load lock chamber 22 and the equipment front end module 10 is closed.

  The process chamber 26 performs a predetermined process on the wafer W. For example, the process chamber 26 includes a process using plasma, such as ashing, vapor deposition, etching, or cleaning. One or a plurality of process chambers 26 are provided on the side of the load lock chamber 22. When a plurality of process chambers 26 are provided, each process chamber 26 can perform the same process on the wafer W. Alternatively, when a plurality of process chambers 26 are provided, the process chamber 26 can sequentially perform a series of processes on the wafer W.

The process chamber 26 includes a housing 72 and a support member 74. The housing 72 provides a space in which a process is performed. The support member 74 is provided in the housing 72 and supports the wafer W during the process. The support member 74 can be configured to fix the wafer W by mechanical clamping, or can be configured to fix the wafer W by electrostatic force. Two support members 74 are provided in the housing 72. The two support members 74 are arranged side by side in the lateral direction. An entrance / exit 76 through which the wafer W enters / exits is formed in a region facing the transfer chamber 24 in the outer wall of the housing 72.

  The doorway 76 can be opened and closed by a door 78. The entrance / exit 76 is provided with a width that allows two wafers W to enter / exit simultaneously. Optionally, the entrances and exits 76 may be provided in the same number as the support members 74 in the housing 72, and each entrance and exit 76 may be provided with a width that allows one wafer W to enter and exit. The number of support members 74 provided to the housing 72 may be increased further.

  FIG. 2 is a drawing schematically showing another example of the substrate processing apparatus 1 ′. Referring to FIG. 2, the process chamber 26 includes a housing 72 and a support member 74 in the substrate processing apparatus 1 ′. The housing 72 is provided with one doorway 76, and the housing 72 is provided with one support member 74. Of the plurality of process chambers 26, two process chambers 26 are provided side by side so as to form a group. The doorway 76 can be opened and closed by a door 78. The doorway 76 provided to each of the two process chambers 26 can be opened and closed by a single door 78. Optionally, a door 78 may be provided for each process chamber 26.

Some transfer chamber 24, the transfer unit 30 is attached. The transfer unit 30 transfers the wafer W between the process chamber 26 and the load lock chamber 22. When a plurality of process chambers 26 are provided, the transfer unit 30 can transfer the wafer W between the process chambers 26. FIG. 3 is a perspective view of the transfer unit 30. Referring to FIG. 3, the transfer unit 30 includes a blade member 120, an arm member 140, a rotating body 160, and a driving member 180. The wafer W is placed on the blade member 120. The blade member 120 is provided so that it can move with the arm member 140 and rotate relative to the arm member 140. The driving member 180 provides a driving force to the arm member 140 or the blade member 120.

The blade member 120 has an upper blade 120a and a lower blade 120b. Accordingly, the blade member 120 can transfer two wafers W at the same time. The lower blade 120 b is installed on the arm member 140. The upper blade 120a is located above the lower blade 120b. The upper blade 120a and the lower blade 120b are provided so that their relative positions can be changed. For example, the upper blade 120a and the lower blade 120b are provided so as to be able to switch between a folded state that is vertically overlapped with each other and a spread state that is shifted by a certain angle. The upper blade 120a and the lower blade 120b can be changed from a folded state to a widened state by being rotated by a predetermined angle in opposite directions.

  The upper blade 120 a includes a first support part 122, a second support part 124, and a connection part 126. Each of the first support part 122 and the second support part 124 is a part where the wafer W is placed, and the connection part 126 connects the first support part 122 and the second support part 124. The connection part 126 has a rod shape. The first support part 122 extends from one end of the connection part 126 in the length direction of the connection part 126. The second support part 124 extends from the other end of the connection part 126 in the length direction of the connection part 126. The first support part 122 and the second support part 124 have the same shape. For example, the first support part 122 and the second support part 124 may be provided in a 'C' shape. The lower blade 120b has generally the same shape as the upper blade 120a. However, a through-hole is formed in the vertical direction in the central region of the connecting portion 126 of the lower blade 120b so that a rotating shaft for rotating the upper blade 120a is inserted.

  The blade member 120 is provided on the arm member 140 and moves with the arm member 140. The arm member 140 has a plurality of arms. According to an example, the arm member 140 includes an upper arm 140a and a lower arm 140b. The upper arm 140a is positioned on the upper portion of the lower arm 140b and is provided to be rotatable on the lower arm 140b.

  The upper arm 140a and the lower arm 140b each have a long rod shape. An empty space into which the components of the driving member 180 are inserted is provided in the upper arm 140a and the lower arm 140b. An opening is formed in the upper wall of one end of the upper arm 140a. An opening is formed in the upper wall of one end of the lower arm 140b. The connecting portion 126 of the blade member 120 is positioned on one end of the upper arm 140a, and the other end of the upper arm 140a is positioned on one end of the lower arm 140b.

  The rotating body 160 rotates the lower arm 140b and linearly moves it up and down. The rotating body 160 has a drum shape in which an empty space is formed. An opening is formed in the upper wall of the rotator 160.

The drive member 180 drives the rotating body 160, the arm member 140, and the blade member 120, respectively. FIG. 4 is a cross-sectional view of the transfer unit 30. Referring to FIG. 4, the driving member 180 includes a rotating body driving machine 200, a lower arm driving machine 300, an upper arm driving machine 400, a lower blade driving machine 500, and an upper blade driving machine 600. The rotary body driving machine 200 includes a vertical driving machine 220 that linearly moves the rotary body 160 up and down and a rotary driving machine 240 that rotates the rotary body 160. The rotational drive unit 240 includes a motor 242, a first pulley 244 and a second pulley 246, and a belt 248. The first pulley 244 is connected to the motor 242, and the second pulley 246 is provided to the rotating body 160. The first pulley 244 and the second pulley 246 are connected by a belt 248. The rotational force of the motor 242 is transmitted to the rotating body 160 through the first pulley 244, the belt 248, and the second pulley 246. The vertical driver 220 may be provided in an assembly structure including a cylinder.

  The lower arm driving machine 300 includes a motor 320, a rotating shaft 341, a first pulley 361 and a second pulley 362, and a belt 381. The motor 320, the belt 381, and the first pulley 361 and the second pulley 362 are positioned in a space within the rotating body 160. The rotation shaft 341 extends downward from the lower wall of the other end of the lower arm 140b and is inserted into a space in the rotation body 160 through an opening provided on the upper wall of the rotation body 160. The first pulley 361 is connected to the motor 320, the second pulley 362 is provided at a lower end region of the rotating shaft 341, and the belt 381 connects the first pulley 361 and the second pulley 362. The rotational force of the motor 320 is transmitted to the lower arm 140b through the first pulley 361, the belt 381, the second pulley 362, and the rotating shaft 341.

  The upper arm driver 400 includes a motor 420, a first rotating shaft 441 and a second rotating shaft 442, first to fourth pulleys 461 to 464, and a first belt 481 and a second belt 482. The first rotation shaft extends from the space in the lower arm 140 b to the space in the rotator 160 through the first rotation shaft 341 of the lower arm driver 300.

  The second rotation shaft 442 extends downward from the lower wall of the other end of the upper arm 140a and is inserted into the space in the lower arm 140b through an opening provided on the upper wall of one end of the lower arm 140b. The first pulley 461 is connected to the motor 420, and the second pulley 462 is provided at the lower end of the first rotation shaft 441. The first pulley 461 and the second pulley 462 are connected by a first belt 481. The third pulley 463 is provided at the upper end of the first rotating shaft 441, and the fourth pulley 464 is provided at the lower end of the second rotating shaft 442. The third pulley 463 and the fourth pulley 464 are connected by the second belt 482. The rotational force of the motor 420 is transmitted to the upper arm 140a through the first pulley 461, the first belt 481, the second pulley 462, the first rotating shaft 441, the third pulley 463, the second belt 482, and the second rotating shaft 442. Is done.

  The lower blade driver 500 includes a motor 520, first to third rotating shafts 541 to 543, first to sixth pulleys 561 to 566, and first to third belts 581 to 583. The first rotating shaft 541 extends from the space in the lower arm 140 b to the space in the rotating body 160 through the first rotating shaft 341 of the lower arm driving machine 300.

  The second rotation shaft 542 extends from the space in the upper arm 140a to the space in the lower arm 140b through the second rotation shaft 442 of the upper arm driver 400. The third rotating shaft 543 extends downward from the lower wall of the connecting portion 126 of the lower blade 120b, and is inserted into the space in the upper arm 140a through an opening provided on the upper wall of one end of the upper arm 140a.

  The first pulley 561 is connected to the motor 520, and the second pulley 562 is provided at the lower end of the first rotating shaft 541. The first pulley 561 and the second pulley 562 are connected by a first belt 581. The third pulley 563 is provided at the upper end of the first rotating shaft 541, and the fourth pulley 564 is provided at the lower end of the second rotating shaft 542. The third pulley 563 and the fourth pulley 564 are connected by the second belt 582. The fifth pulley 565 is provided at the upper end of the second rotating shaft 542, and the sixth pulley 566 is provided at the lower end of the third rotating shaft 543. The fifth pulley 565 and the sixth pulley 566 are connected by a third belt 583. The rotational force of the motor 520 includes the first pulley 561, the first belt 581, the second pulley 562, the first rotating shaft 541, the third pulley 563, the second belt 582, the fourth pulley 564, the second rotating shaft 542, It is transmitted to the lower blade 120b through the fifth pulley 565, the third belt 583, the sixth pulley 566, and the third rotating shaft 543.

  The upper blade driver 600 includes a motor 620, first to third rotating shafts 641 to 643, first to sixth pulleys 661 to 666, and first to third belts 681 to 683. The first rotating shaft 641 extends from the space in the lower arm 140 b to the space in the rotating body 160 through the inside of the first rotating shaft 641 of the lower blade driver 500. The second rotation shaft 642 extends from the space in the upper arm 140a to the space in the lower arm 140b through the second rotation shaft 442 of the upper arm driver 400. The third rotating shaft 643 extends downward from the lower wall of the connecting portion 126 of the upper blade 120a, and passes through the through hole provided in the lower blade 120b and the third rotating shaft 543 of the lower blade driving machine 500. It is inserted into the space in 140a.

  The first pulley 661 is connected to the motor 620, and the second pulley 662 is provided at the lower end of the first rotating shaft 641. The first pulley 661 and the second pulley 662 are connected by a first belt 681. The third pulley 663 is provided at the upper end of the first rotating shaft 641, and the fourth pulley 664 is provided at the lower end of the second rotating shaft 642. The third pulley 663 and the fourth pulley 664 are connected by a second belt 682. The fifth pulley 665 is provided at the upper end of the second rotating shaft 642, and the sixth pulley 666 is provided at the lower end of the third rotating shaft 643. The fifth pulley 665 and the sixth pulley 666 are connected by a third belt 683. The rotational force of the motor 620 includes the first pulley 661, the first belt 681, the second pulley 662, the first rotating shaft 641, the third pulley 663, the second belt 682, the fourth pulley 664, the second rotating shaft 642, It is transmitted to the upper blade 120a through the fifth pulley 665, the third belt 683, the sixth pulley 666, and the third rotating shaft 643.

  The first rotating shaft 541 of the lower blade driver 500 is inserted into the first rotating shaft 341 of the lower arm driver 300, and both ends of the first rotating shaft 541 of the lower blade driver 500 are connected to the lower arm driver 300. The first rotation shaft 341 protrudes from both ends.

  The first rotating shaft 641 of the upper blade driving device 600 is inserted into the first rotating shaft 541 of the lower blade driving device 500, and both ends of the first rotating shaft 641 of the upper blade driving device 600 are connected to the lower blade driving device 500. It protrudes further from both ends of the first rotating shaft 541.

  The first rotary shaft 441 of the upper arm driver 400 is inserted into the first rotary shaft 641 of the upper blade driver 600, and both ends of the first rotary shaft 441 of the upper arm driver 400 are connected to the upper blade driver 600. It protrudes further from both ends of the first rotation shaft 641.

  In addition, the second rotating shaft 542 of the lower blade driver 500 is inserted into the second rotating shaft 642 of the upper blade driver 600, and both ends of the second rotating shaft 542 of the lower blade driver 500 are connected to the upper blade driver. 600 protrudes from both ends of the second rotation shaft 642.

  In the structure described above, it has been described that the lower arm 140b, the upper arm 140a, the lower blade 120b, and the upper blade 120a are independently driven by the respective driving machines 300, 400, 500, and 600. However, unlike this, the lower arm 140b and the upper arm 140a may be driven in conjunction with one drive machine. Further, the lower blade 120b and the upper blade 120a may be linked and driven by one driving machine.

  The blade member 120 maintains a folded state when the wafer W is taken out from the load lock chamber 22 placed so that the wafers W are stacked or when the wafer W is put into the load lock chamber 22. The blade member 120 maintains an expanded state when the wafer W is taken out from the process chamber 26 where the wafers W are arranged side by side or when the wafer W is put into the process chamber 26. FIG. 5 shows a state where the wafer W is put into the process chamber 26 with the blade member 120 expanded, and FIG. 6 shows a state where the wafer W is put into the load lock chamber 22 with the blade member 120 folded.

  As described above, the lower blade 120b and the upper blade 120a have the first support part 122 and the second support part 124, respectively. Therefore, while the process is performed on the wafer W in the process chamber 26, the blade member 120 stands by in a state where the wafer W on which the process is performed next is supported by the first support part 122. When the process is completed in the process chamber 26, the blade member 120 takes out the wafer W from the process chamber 26 using the vacant second support portion 124, and the lower blade 120 b and the upper blade 120 a are moved to the arm member 140. After rotating 180 degrees (°), the wafer W placed on the first support part 122 is immediately put into the process chamber 26. Accordingly, since the time required until a new wafer W is placed after the wafer W is taken out in the process chamber 26 is reduced, the throughput of the process chamber 26 is improved.

  Next, a method for processing a substrate according to an embodiment of the present invention will be described. In the present embodiment, an example will be described in which two process chambers 26 that sequentially proceed through a series of processes are provided, and two support members 74 are provided in each process chamber 26.

  First, the wafer W is placed in the load lock chamber 22 such that the wafers W are stacked apart from each other.

  As shown in FIG. 7, the blade member 120 takes out the first wafer W1 and the second wafer W2 from the load lock chamber 22 using the first support part 122 in a folded state. Next, as shown in FIG. 8, the blade member 120 puts the first wafer W <b> 1 and the second wafer W <b> 2 into the first process chamber 26 a using the first support part 122 in the expanded state.

  As shown in FIG. 9, the first process is performed on the first wafer W1 and the second wafer W2 in the first process chamber 26a. The blade member 120 takes out the third wafer W3 and the fourth wafer W4 from the load lock chamber 22 using the first support portion 122 in a folded state. Instead of the first support part 122, the second support part 124 may be used to take out the third wafer W3 and the fourth wafer W4 from the load lock chamber 22.

  As shown in FIG. 10, the blade member 120 waits until the process is completed for the first wafer W1 and the second wafer W2 in the first process chamber 26a. When the process is completed in the first process chamber 26a with respect to the first wafer W1 and the second wafer W2, the blade member 120 uses the second support part 124 in an unfolded state and the second wafer W1 and the second wafer W2. The wafer W2 is taken out from the first process chamber 26a.

  As shown in FIG. 11, the blade member 120 puts the first wafer W1 and the second wafer W2 into the second process chamber 26b by using the second support part 124 in an unfolded state. Then, a process is performed on the first wafer W1 and the second wafer W2 in the second process chamber 26b.

  Then, as shown in FIG. 12, the blade member 120 puts the third wafer W3 and the fourth wafer W4 into the first process chamber 26a using the first support part 122 in the expanded state.

  Alternatively, after the third wafer W3 and the fourth wafer W4 are placed in the first process chamber 26a, the first wafer W1 and the second wafer W2 may be placed in the second process chamber 26b.

  Next, a process is performed on the third wafer W3 and the fourth wafer W4 in the first process chamber 26a. As shown in FIG. 13, the blade member 120 takes out the fifth wafer W5 and the sixth wafer W6 from the load lock chamber 22 using the first support portion 122 in a folded state.

  As shown in FIG. 14, when the process is completed for the first wafer W1 and the second wafer W2 in the second process chamber 26b, the blade member 120 is first expanded using the second support part 124 in an unfolded state. The wafer W1 and the second wafer W2 are taken out from the second process chamber 26b.

  As shown in FIG. 15, the blade member 120 puts the first wafer W <b> 1 and the second wafer W <b> 2 into the load lock chamber 22 using the second support portion 124 in a folded state.

  As shown in FIG. 16, when the process is completed for the third wafer W3 and the fourth wafer W4 in the first process chamber 26a, the blade member 120 is expanded using the second support part 124. The three wafers W3 and the fourth wafer W4 are taken out from the first process chamber 26a.

  Then, as shown in FIG. 17, the blade member 120 puts the third wafer W3 and the fourth wafer W4 into the second process chamber 26b using the second support part 124 in the expanded state.

  Then, as shown in FIG. 18, the process is performed on the third wafer W3 and the fourth wafer W4 in the second process chamber 26b. The blade member 120 puts the fifth wafer W5 and the sixth wafer W6 into the first process chamber 26a by using the first support part 122 in the expanded state.

  Alternatively, after the fifth wafer W5 and the sixth wafer W6 are put in the first process chamber 26a, the third wafer W3 and the fourth wafer W4 can be put into the first process chamber 26a.

  Then, the process is performed on the fifth wafer W5 and the sixth wafer W6 in the first process chamber 26a, and the blade member 120 takes out and waits for a new wafer W in the load lock chamber 22, and the process is performed on all the wafers W. Repeat the above process until complete.

  In the above-described process, the method for transferring the wafer W by the cluster type substrate processing apparatus has been described. However, the technical idea of the present invention is that the first support plate on which the wafer W is placed so as to be separated from each other in the vertical direction and the second support plate on which the wafer W is placed side by side are arranged. All of the structures can be applied to a structure in which two wafers W are transferred at the same time. In this case, the first support plate corresponds to the slot 22a provided in the load lock chamber 22, and the second support plate corresponds to the support member. The method of transferring the wafer between the first support plate and the second support plate is similar to the method of transferring the wafer between the slot 22a in the load lock chamber 22 and the support member 74 in the process chamber 26. Therefore, detailed description is omitted.

1 is a plan view schematically showing a substrate processing apparatus according to a preferred embodiment of the present invention. It is a top view which shows the modification of the substrate processing apparatus of FIG. FIG. 2 is a perspective view of the substrate transfer unit of FIG. 1. It is sectional drawing of the board | substrate transfer unit of FIG. It is a perspective view which shows the state which the board | substrate transfer unit extended. It is a perspective view which shows the state by which the board | substrate transfer unit was folded. 2 is a schematic and sequential view illustrating a process of transferring a wafer during substrate processing. 2 is a schematic and sequential view illustrating a process of transferring a wafer during substrate processing. 2 is a schematic and sequential view illustrating a process of transferring a wafer during substrate processing. 2 is a schematic and sequential view illustrating a process of transferring a wafer during substrate processing. 2 is a schematic and sequential view illustrating a process of transferring a wafer during substrate processing. 2 is a schematic and sequential view illustrating a process of transferring a wafer during substrate processing. 2 is a schematic and sequential view illustrating a process of transferring a wafer during substrate processing. 2 is a schematic and sequential view illustrating a process of transferring a wafer during substrate processing. 2 is a schematic and sequential view illustrating a process of transferring a wafer during substrate processing. 2 is a schematic and sequential view illustrating a process of transferring a wafer during substrate processing. 2 is a schematic and sequential view illustrating a process of transferring a wafer during substrate processing. 2 is a schematic and sequential view illustrating a process of transferring a wafer during substrate processing.

Explanation of symbols

22 Load lock chamber
24 transfer chamber 26 process chamber
30 transfer unit 120a upper blade
120b Lower blade 122 First support part
124 2nd support part 126 Connection part
140a Upper arm 140b Lower arm
160 Rotating body 300 Lower arm drive
400 Upper arm drive 500 Lower blade drive
600 Upper blade drive

Claims (11)

  1. A unit for transferring a substrate,
    A blade member on which the substrate is placed;
    An arm member coupled to the blade member and moving the blade member;
    A driving member for providing a driving force to the blade member or the arm member,
    The blade member is
    A lower blade,
    An upper blade that is located on the upper portion of the lower blade and is capable of changing a relative position with respect to the lower blade ;
    Each of the lower blade and the upper blade is
    A first support on which the first substrate is placed;
    A second support part on which a second substrate different from the first substrate is placed;
    A connecting portion that connects the first support portion and the second support portion ;
    The first support part is extended from one end of the connection part,
    The second support part is extended from the other end of the connection part in a direction opposite to the direction in which the first support part is extended from the connection part.
    The substrate transfer unit, wherein a rotating shaft that connects the lower blade and the arm member and a rotating shaft that connects the upper blade and the arm member are coupled to the connecting portion.
  2. The upper blade and the lower blade are in a folded state in which the upper blade is positioned at a vertical upper portion of the lower blade, and in a spread state in which the upper blade is rotated by a predetermined angle in a direction opposite to each other from the folded state. The substrate transfer unit according to claim 1, wherein the substrate transfer unit is provided so that the position of the substrate can be changed.
  3. The drive member includes a blade drive machine that rotates the blade member independently of the arm member, and a vertical drive machine that moves the arm member and the blade member up and down.
    The blade driving machine comprises: a lower blade driving machine that rotates the lower blade; and an upper blade driving machine that rotates the upper blade independently of the lower blade. Substrate transfer unit.
  4. The lower blade driving machine includes a rotating shaft that extends into the arm member through an opening provided in an upper wall of the arm member from a lower portion of the connecting portion of the lower blade member,
    The upper blade driving machine is inserted into a through hole provided in the connecting part of the lower blade member and a rotating shaft of the lower blade driving machine from a lower part of the connecting part of the upper blade member, and the arm. The substrate transfer unit according to claim 3, further comprising a rotating shaft extending into the member.
  5. A transfer chamber;
    At least one process chamber disposed on one side of the transfer chamber;
    A load lock chamber that is disposed on the other side of the transfer chamber and in which a substrate is placed so as to be spaced apart from each other in the vertical direction;
    A transfer unit provided in the transfer chamber for transferring a substrate between the load lock chamber and the process chamber;
    The transfer unit is
    A blade member on which the substrate is placed;
    An arm member coupled to the blade member and moving the blade member;
    A driving member for providing a driving force to the blade member and the arm member,
    The blade member is
    A lower blade,
    An upper blade positioned on top of the lower blade,
    The relative position of the lower blade and the upper blade is provided to be variable,
    Each of the lower blade and the upper blade is
    A first support on which a substrate is placed;
    A second support part on which the substrate is placed;
    A connecting portion that connects the first support portion and the second support portion;
    The first support part extends from one end of the connection part, and the second support part extends from the other end of the connection part in a direction opposite to the direction in which the first support part extends from the connection part. ,
    A rotating shaft that connects the lower blade and the arm member is coupled to a connecting portion of the lower blade,
    A substrate processing apparatus, wherein a rotating shaft that connects the upper blade and the arm member is coupled to a connecting portion of the upper blade.
  6. The process chamber is
    A housing provided with an inlet / outlet through which a substrate enters / exits,
    The substrate processing apparatus according to claim 5, further comprising a support member that is arranged side by side in the housing and on which the substrate is placed.
  7. The process chamber is
    A housing provided with an inlet / outlet through which a substrate enters / exits,
    A support member disposed in the housing and on which the substrate is placed,
    The substrate processing apparatus according to claim 5, wherein the substrate processing apparatus includes a plurality of the process chambers, and at least two of the process chambers are arranged side by side.
  8. The upper blade and the lower blade are provided such that they can be switched from a folded state, which is a vertically opposed position, to a widened state rotated from the folded state by a predetermined angle in opposite directions. The substrate processing apparatus according to claim 5.
  9. A method for transferring a substrate, comprising:
    Using the transfer unit, two substrates are provided between a first support plate on which the substrate is placed so as to be separated from each other in the vertical direction and a second support plate on which the substrate is placed side by side in the lateral direction. At the same time,
    The transfer unit has an upper blade and a lower blade that can be converted into a folded state that is a vertically opposed position and a widened state that is rotated from the folded state by a predetermined angle in opposite directions. The substrate is placed on or taken out of the first support plate in the folded state, and the substrate is placed on or taken out of the second support plate in the unfolded state,
    Each of the upper blade and the lower blade includes a first support part and a second support part in which substrates are respectively disposed at both ends, and any one of the first support part and the second support part. A substrate transfer method, wherein a substrate placed in the second support plate is placed on a support portion, and another support portion takes out the substrate placed on the second support plate.
  10. The substrate placed on the one support portion is placed on the second support plate in a state where the substrate taken out from the second support plate is placed on the other support portion. The substrate transfer method according to claim 9.
  11. A substrate processing method comprising:
    A transfer chamber, at least one process chamber disposed on one side of the transfer chamber, a load lock chamber disposed on the other side of the transfer chamber, and provided in the transfer chamber, the load lock chamber and the Processing the substrate using a substrate processing apparatus comprising a transfer unit for transferring the substrate to and from the process chamber;
    In the load lock chamber, the substrate is placed so as to be opposed to each other in the vertical direction,
    In the process chamber, the substrate is placed so as to be arranged side by side,
    The transfer unit has an upper blade and a lower blade that are convertible from a folded state facing up and down and a widened state rotated from the folded state by a predetermined angle in opposite directions to each other,
    The transfer unit puts and removes the substrate in the load lock chamber in the folded state, and puts and removes the substrate in the process chamber in the expanded state,
    Each of the upper blade and the lower blade includes a first support part and a second support part in which substrates are respectively placed at both ends,
    The transfer unit uses another support part in a state where a substrate on which a process is performed in the process chamber is held in any one of the first support part and the second support part. A substrate processing method comprising: taking out a substrate that has been processed in the process chamber.
JP2007219938A 2007-05-02 2007-08-27 Substrate transfer unit, substrate transfer method, substrate processing apparatus having the unit, and substrate processing method using the unit Active JP4542574B2 (en)

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CN101299415B (en) 2012-07-04
JP2008277725A (en) 2008-11-13
SG147356A1 (en) 2008-11-28
CN101299415A (en) 2008-11-05
KR100803559B1 (en) 2008-02-15
TW200845275A (en) 2008-11-16

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