JP4520460B2 - セルフクリーニング触媒化学蒸着装置及びそのクリーニング方法 - Google Patents
セルフクリーニング触媒化学蒸着装置及びそのクリーニング方法 Download PDFInfo
- Publication number
- JP4520460B2 JP4520460B2 JP2006510810A JP2006510810A JP4520460B2 JP 4520460 B2 JP4520460 B2 JP 4520460B2 JP 2006510810 A JP2006510810 A JP 2006510810A JP 2006510810 A JP2006510810 A JP 2006510810A JP 4520460 B2 JP4520460 B2 JP 4520460B2
- Authority
- JP
- Japan
- Prior art keywords
- gas
- cleaning
- vapor deposition
- chemical vapor
- deposition apparatus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
- C23C16/4405—Cleaning of reactor or parts inside the reactor by using reactive gases
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
- Drying Of Semiconductors (AREA)
- Exhaust Gas Treatment By Means Of Catalyst (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004067174 | 2004-03-10 | ||
| JP2004067174 | 2004-03-10 | ||
| PCT/JP2005/004205 WO2005086210A1 (ja) | 2004-03-10 | 2005-03-10 | セルフクリーニング触媒化学蒸着装置及びそのクリーニング方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2005086210A1 JPWO2005086210A1 (ja) | 2008-01-24 |
| JP4520460B2 true JP4520460B2 (ja) | 2010-08-04 |
Family
ID=34918384
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006510810A Expired - Lifetime JP4520460B2 (ja) | 2004-03-10 | 2005-03-10 | セルフクリーニング触媒化学蒸着装置及びそのクリーニング方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US20070209677A1 (show.php) |
| JP (1) | JP4520460B2 (show.php) |
| CN (1) | CN100530546C (show.php) |
| TW (1) | TW200533780A (show.php) |
| WO (1) | WO2005086210A1 (show.php) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5016810B2 (ja) * | 2005-11-30 | 2012-09-05 | 株式会社アルバック | 触媒線化学気相成長装置、この装置を用いた化学気相成長方法及びこの装置のセルフクリーニング方法 |
| US7504643B2 (en) * | 2005-12-22 | 2009-03-17 | Asml Netherlands B.V. | Method for cleaning a lithographic apparatus module, a cleaning arrangement and a lithographic apparatus comprising the cleaning arrangement |
| US7495239B2 (en) * | 2005-12-22 | 2009-02-24 | Asml Netherlands B.V. | Method for cleaning a lithographic apparatus module, a cleaning arrangement and a lithographic apparatus comprising the cleaning arrangement |
| JP5586199B2 (ja) * | 2009-10-02 | 2014-09-10 | 三洋電機株式会社 | 触媒cvd装置、膜の形成方法及び太陽電池の製造方法 |
| US10606180B2 (en) * | 2017-03-08 | 2020-03-31 | Asml Netherlands B.V. | EUV cleaning systems and methods thereof for an extreme ultraviolet light source |
| US10784091B2 (en) | 2017-09-29 | 2020-09-22 | Taiwan Semiconductor Manufacturing Co., Ltd. | Process and related device for removing by-product on semiconductor processing chamber sidewalls |
| CN114369812A (zh) * | 2021-12-15 | 2022-04-19 | 北京博纳晶科科技有限公司 | 一种化学气相沉积设备的清洁方法 |
| CN116924623B (zh) * | 2023-08-14 | 2024-06-11 | 衡阳凯新特种材料科技有限公司 | 一种特种材料生产线用污水处理装置 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4781803A (en) * | 1985-02-26 | 1988-11-01 | The Standard Oil Company | Electrolytic processes employing platinum based amorphous metal alloy oxygen anodes |
| US5185074A (en) * | 1988-08-15 | 1993-02-09 | Idemitsu Kosan Co., Ltd. | Process for producing color filter |
| US5012868A (en) * | 1989-03-14 | 1991-05-07 | Uentech Corporation | Corrosion inhibition method and apparatus for downhole electrical heating in mineral fluid wells |
| JPH05270982A (ja) * | 1992-03-27 | 1993-10-19 | Idemitsu Petrochem Co Ltd | ダイヤモンド膜の製造方法 |
| US5451754A (en) * | 1993-10-27 | 1995-09-19 | Xerox Corporation | Corona generating device |
| US6271498B1 (en) * | 1997-06-23 | 2001-08-07 | Nissin Electric Co., Ltd | Apparatus for vaporizing liquid raw material and method of cleaning CVD apparatus |
| US6079426A (en) * | 1997-07-02 | 2000-06-27 | Applied Materials, Inc. | Method and apparatus for determining the endpoint in a plasma cleaning process |
| US20030164225A1 (en) * | 1998-04-20 | 2003-09-04 | Tadashi Sawayama | Processing apparatus, exhaust processing process and plasma processing |
| JP4459329B2 (ja) * | 1999-08-05 | 2010-04-28 | キヤノンアネルバ株式会社 | 付着膜の除去方法及び除去装置 |
| JP2001345280A (ja) * | 2000-03-28 | 2001-12-14 | Hideki Matsumura | 化学蒸着方法及び化学蒸着装置 |
| US20050109627A1 (en) * | 2003-10-10 | 2005-05-26 | Applied Materials, Inc. | Methods and chemistry for providing initial conformal electrochemical deposition of copper in sub-micron features |
| JP2002008997A (ja) * | 2000-06-23 | 2002-01-11 | Hitachi Kokusai Electric Inc | 半導体装置の製造方法及びその装置 |
| EP1258914B1 (en) * | 2000-09-14 | 2006-11-22 | Japan as represented by President of Japan Advanced Institute of Science and Technology | Heating element cvd device |
| JP4435395B2 (ja) * | 2000-09-14 | 2010-03-17 | キヤノンアネルバ株式会社 | 発熱体cvd装置 |
| US6569257B1 (en) * | 2000-11-09 | 2003-05-27 | Applied Materials Inc. | Method for cleaning a process chamber |
| JP2002246310A (ja) * | 2001-02-14 | 2002-08-30 | Sony Corp | 半導体薄膜の形成方法及び半導体装置の製造方法、これらの方法の実施に使用する装置、並びに電気光学装置 |
| US6562201B2 (en) * | 2001-06-08 | 2003-05-13 | Applied Semiconductor, Inc. | Semiconductive polymeric system, devices incorporating the same, and its use in controlling corrosion |
| JP3787816B2 (ja) * | 2002-10-04 | 2006-06-21 | キヤノンアネルバ株式会社 | 発熱体cvd装置 |
-
2005
- 2005-03-08 TW TW094107035A patent/TW200533780A/zh not_active IP Right Cessation
- 2005-03-10 WO PCT/JP2005/004205 patent/WO2005086210A1/ja not_active Ceased
- 2005-03-10 JP JP2006510810A patent/JP4520460B2/ja not_active Expired - Lifetime
- 2005-03-10 US US10/591,905 patent/US20070209677A1/en not_active Abandoned
- 2005-03-10 CN CNB2005800111037A patent/CN100530546C/zh not_active Expired - Fee Related
-
2012
- 2012-02-16 US US13/398,594 patent/US20120145184A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| US20070209677A1 (en) | 2007-09-13 |
| US20120145184A1 (en) | 2012-06-14 |
| CN1943014A (zh) | 2007-04-04 |
| CN100530546C (zh) | 2009-08-19 |
| TW200533780A (en) | 2005-10-16 |
| JPWO2005086210A1 (ja) | 2008-01-24 |
| TWI374944B (show.php) | 2012-10-21 |
| WO2005086210A1 (ja) | 2005-09-15 |
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