JP4518024B2 - 電子装置 - Google Patents

電子装置 Download PDF

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Publication number
JP4518024B2
JP4518024B2 JP2005517695A JP2005517695A JP4518024B2 JP 4518024 B2 JP4518024 B2 JP 4518024B2 JP 2005517695 A JP2005517695 A JP 2005517695A JP 2005517695 A JP2005517695 A JP 2005517695A JP 4518024 B2 JP4518024 B2 JP 4518024B2
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JP
Japan
Prior art keywords
circuit layer
circuit
base substrate
layer
antenna
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2005517695A
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English (en)
Japanese (ja)
Other versions
JPWO2005076202A1 (ja
Inventor
耕司 田崎
裕宣 石坂
正仁 渋谷
耕輔 田中
正久 新沢
秀彦 殿塚
克也 岩田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Resonac Corp
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Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd, Resonac Corp filed Critical Hitachi Chemical Co Ltd
Publication of JPWO2005076202A1 publication Critical patent/JPWO2005076202A1/ja
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Publication of JP4518024B2 publication Critical patent/JP4518024B2/ja
Anticipated expiration legal-status Critical
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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Details Of Aerials (AREA)
  • Credit Cards Or The Like (AREA)
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FI7351U1 (fi) * 2006-09-19 2007-01-12 Upm Kymmene Wood Oy Puulevy
EP2169594B1 (en) * 2007-07-18 2018-03-07 Murata Manufacturing Co., Ltd. Wireless ic device and method for manufacturing the same
CN104246630B (zh) * 2012-04-11 2017-09-12 英频杰公司 在多个表面上具有天线触点的rfid集成电路和标签
US10600753B2 (en) * 2015-08-28 2020-03-24 Texas Instruments Incorporated Flip chip backside mechanical die grounding techniques
DE102016103790B8 (de) * 2016-03-03 2021-06-02 Infineon Technologies Ag Herstellung einer Packung unter Verwendung eines platebaren Verkapselungsmaterials
WO2017194618A1 (en) * 2016-05-11 2017-11-16 Flex Automotive Gmbh Electrical circuitry assembly and method for manufacturing the same
JP2019004266A (ja) * 2017-06-13 2019-01-10 富士通株式会社 アンテナ装置および電子機器
FI20216339A1 (en) * 2019-05-29 2021-12-23 Digital Tags Finland Oy Method and apparatus for making radio frequency identification (RFID) transponders

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JP2001217380A (ja) * 2000-02-04 2001-08-10 Hitachi Ltd 半導体装置およびその製造方法
JP2002017614A (ja) * 2000-07-07 2002-01-22 Toto Ltd 便座装置
JP2002366917A (ja) * 2001-06-07 2002-12-20 Hitachi Ltd アンテナを内蔵するｉｃカード

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JP3398705B2 (ja) * 2000-02-24 2003-04-21 九州日本電気株式会社 半導体装置
JP2002164392A (ja) * 2000-11-28 2002-06-07 Toppan Forms Co Ltd Ｉｃチップの実装方法
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JPH061096A (ja) * 1992-06-17 1994-01-11 Omron Corp カード形基板及びその製造方法
WO2000076279A1 (fr) * 1999-06-03 2000-12-14 Toyo Kohan Co.,Ltd. Procede de production d'une plaquette imprimee, d'une carte a circuit imprime et d'un substrat imprime
JP2001217380A (ja) * 2000-02-04 2001-08-10 Hitachi Ltd 半導体装置およびその製造方法
JP2002017614A (ja) * 2000-07-07 2002-01-22 Toto Ltd 便座装置
JP2002366917A (ja) * 2001-06-07 2002-12-20 Hitachi Ltd アンテナを内蔵するｉｃカード

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EP1715445A1 (en) 2006-10-25
JPWO2005076202A1 (ja) 2007-08-02
KR20060126801A (ko) 2006-12-08
CN1918583B (zh) 2011-06-15
TW200527312A (en) 2005-08-16
EP1715445A4 (en) 2016-08-31
KR100879416B1 (ko) 2009-01-19
TWI295789B (enExample) 2008-04-11
US20090065586A1 (en) 2009-03-12
CN1918583A (zh) 2007-02-21
WO2005076202A1 (ja) 2005-08-18

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