JP4501093B2 - フリップチップ実装装置及び実装方法 - Google Patents

フリップチップ実装装置及び実装方法 Download PDF

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Publication number
JP4501093B2
JP4501093B2 JP2000213096A JP2000213096A JP4501093B2 JP 4501093 B2 JP4501093 B2 JP 4501093B2 JP 2000213096 A JP2000213096 A JP 2000213096A JP 2000213096 A JP2000213096 A JP 2000213096A JP 4501093 B2 JP4501093 B2 JP 4501093B2
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Japan
Prior art keywords
flip chip
cylinder
motor
slider
package
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Expired - Lifetime
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JP2000213096A
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English (en)
Japanese (ja)
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JP2002033338A (ja
JP2002033338A5 (enExample
Inventor
芳直 北野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
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NEC Corp
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Publication date
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Priority to JP2000213096A priority Critical patent/JP4501093B2/ja
Publication of JP2002033338A publication Critical patent/JP2002033338A/ja
Publication of JP2002033338A5 publication Critical patent/JP2002033338A5/ja
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Publication of JP4501093B2 publication Critical patent/JP4501093B2/ja
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Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP2000213096A 2000-07-13 2000-07-13 フリップチップ実装装置及び実装方法 Expired - Lifetime JP4501093B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000213096A JP4501093B2 (ja) 2000-07-13 2000-07-13 フリップチップ実装装置及び実装方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000213096A JP4501093B2 (ja) 2000-07-13 2000-07-13 フリップチップ実装装置及び実装方法

Publications (3)

Publication Number Publication Date
JP2002033338A JP2002033338A (ja) 2002-01-31
JP2002033338A5 JP2002033338A5 (enExample) 2007-06-14
JP4501093B2 true JP4501093B2 (ja) 2010-07-14

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ID=18708907

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000213096A Expired - Lifetime JP4501093B2 (ja) 2000-07-13 2000-07-13 フリップチップ実装装置及び実装方法

Country Status (1)

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JP (1) JP4501093B2 (enExample)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3220483B2 (ja) * 1991-09-12 2001-10-22 松下電器産業株式会社 ボンディング装置
JPH07221138A (ja) * 1994-02-07 1995-08-18 Fujitsu Ltd ボンディング装置及びボンディング方法
JP3262683B2 (ja) * 1995-01-20 2002-03-04 松下電器産業株式会社 半導体実装装置
JPH10340931A (ja) * 1997-06-05 1998-12-22 Toray Eng Co Ltd チップボンディングツール
JP3497078B2 (ja) * 1998-03-31 2004-02-16 株式会社日立ハイテクインスツルメンツ ダイボンダ
JP3328878B2 (ja) * 1998-10-26 2002-09-30 澁谷工業株式会社 ボンディング装置

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Publication number Publication date
JP2002033338A (ja) 2002-01-31

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