JP2002033338A5 - - Google Patents
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- Publication number
- JP2002033338A5 JP2002033338A5 JP2000213096A JP2000213096A JP2002033338A5 JP 2002033338 A5 JP2002033338 A5 JP 2002033338A5 JP 2000213096 A JP2000213096 A JP 2000213096A JP 2000213096 A JP2000213096 A JP 2000213096A JP 2002033338 A5 JP2002033338 A5 JP 2002033338A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000213096A JP4501093B2 (ja) | 2000-07-13 | 2000-07-13 | フリップチップ実装装置及び実装方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000213096A JP4501093B2 (ja) | 2000-07-13 | 2000-07-13 | フリップチップ実装装置及び実装方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2002033338A JP2002033338A (ja) | 2002-01-31 |
| JP2002033338A5 true JP2002033338A5 (enExample) | 2007-06-14 |
| JP4501093B2 JP4501093B2 (ja) | 2010-07-14 |
Family
ID=18708907
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000213096A Expired - Lifetime JP4501093B2 (ja) | 2000-07-13 | 2000-07-13 | フリップチップ実装装置及び実装方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4501093B2 (enExample) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3220483B2 (ja) * | 1991-09-12 | 2001-10-22 | 松下電器産業株式会社 | ボンディング装置 |
| JPH07221138A (ja) * | 1994-02-07 | 1995-08-18 | Fujitsu Ltd | ボンディング装置及びボンディング方法 |
| JP3262683B2 (ja) * | 1995-01-20 | 2002-03-04 | 松下電器産業株式会社 | 半導体実装装置 |
| JPH10340931A (ja) * | 1997-06-05 | 1998-12-22 | Toray Eng Co Ltd | チップボンディングツール |
| JP3497078B2 (ja) * | 1998-03-31 | 2004-02-16 | 株式会社日立ハイテクインスツルメンツ | ダイボンダ |
| JP3328878B2 (ja) * | 1998-10-26 | 2002-09-30 | 澁谷工業株式会社 | ボンディング装置 |
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2000
- 2000-07-13 JP JP2000213096A patent/JP4501093B2/ja not_active Expired - Lifetime