JP4492878B2 - ドナー基板,有機電界発光表示装置の製造方法 - Google Patents

ドナー基板,有機電界発光表示装置の製造方法 Download PDF

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Publication number
JP4492878B2
JP4492878B2 JP2005299226A JP2005299226A JP4492878B2 JP 4492878 B2 JP4492878 B2 JP 4492878B2 JP 2005299226 A JP2005299226 A JP 2005299226A JP 2005299226 A JP2005299226 A JP 2005299226A JP 4492878 B2 JP4492878 B2 JP 4492878B2
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substrate
heat generating
photothermal conversion
base substrate
layer
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JP2006123546A (ja
Inventor
泰旻 姜
城宅 李
茂顯 金
炳斗 陳
明原 宋
在濠 李
鎭洙 金
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Samsung Display Co Ltd
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Samsung Mobile Display Co Ltd
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/10Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41MPRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00Duplicating or marking methods; Sheet materials for use therein
    • B41M5/26Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used
    • B41M5/40Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used characterised by the base backcoat, intermediate, or covering layers, e.g. for thermal transfer dye-donor or dye-receiver sheets; Heat, radiation filtering or absorbing means or layers; combined with other image registration layers or compositions; Special originals for reproduction by thermography
    • B41M5/46Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used characterised by the base backcoat, intermediate, or covering layers, e.g. for thermal transfer dye-donor or dye-receiver sheets; Heat, radiation filtering or absorbing means or layers; combined with other image registration layers or compositions; Special originals for reproduction by thermography characterised by the light-to-heat converting means; characterised by the heat or radiation filtering or absorbing means or layers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41MPRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00Duplicating or marking methods; Sheet materials for use therein
    • B41M5/26Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used
    • B41M5/265Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used for the production of optical filters or electrical components
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04Coating on selected surface areas, e.g. using masks
    • C23C14/048Coating on selected surface areas, e.g. using masks using irradiation by energy or particles
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10Deposition of organic active material
    • H10K71/18Deposition of organic active material using non-liquid printing techniques, e.g. thermal transfer printing from a donor sheet
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40Thermal treatment, e.g. annealing in the presence of a solvent vapour
    • H10K71/421Thermal treatment, e.g. annealing in the presence of a solvent vapour using coherent electromagnetic radiation, e.g. laser annealing
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/146Laser beam

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Optics & Photonics (AREA)
  • Physics & Mathematics (AREA)
  • Toxicology (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Electroluminescent Light Sources (AREA)
  • Laminated Bodies (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
JP2005299226A 2004-10-19 2005-10-13 ドナー基板,有機電界発光表示装置の製造方法 Active JP4492878B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR20040083744A KR100667069B1 (ko) 2004-10-19 2004-10-19 도너 기판 및 그를 사용한 유기전계발광표시장치의 제조방법

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JP2006123546A JP2006123546A (ja) 2006-05-18
JP4492878B2 true JP4492878B2 (ja) 2010-06-30

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US (1) US7674749B2 (ko)
EP (2) EP1787822B1 (ko)
JP (1) JP4492878B2 (ko)
KR (1) KR100667069B1 (ko)
CN (1) CN1769066B (ko)

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* Cited by examiner, † Cited by third party
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JP2006309995A (ja) * 2005-04-27 2006-11-09 Sony Corp 転写用基板および表示装置の製造方法ならびに表示装置
KR100759685B1 (ko) * 2005-09-08 2007-09-17 삼성에스디아이 주식회사 레이저 전사용 전사부재 및 이를 이용한 발광소자 및발광소자의 제조방법
JP4449890B2 (ja) * 2005-11-21 2010-04-14 ソニー株式会社 転写用基板および転写方法ならびに表示装置の製造方法
JP5013048B2 (ja) 2006-04-06 2012-08-29 ソニー株式会社 赤色有機発光素子およびこれを備えた表示装置
JP2008027722A (ja) * 2006-07-21 2008-02-07 Sony Corp 表示装置および表示装置の製造方法
US7994021B2 (en) * 2006-07-28 2011-08-09 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing semiconductor device
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US8425974B2 (en) * 2007-11-29 2013-04-23 Semiconductor Energy Laboratory Co., Ltd. Evaporation donor substrate and method for manufacturing light-emitting device
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WO2009107548A1 (en) * 2008-02-29 2009-09-03 Semiconductor Energy Laboratory Co., Ltd. Deposition method and manufacturing method of light-emitting device
JP5416987B2 (ja) * 2008-02-29 2014-02-12 株式会社半導体エネルギー研究所 成膜方法及び発光装置の作製方法
JP5079722B2 (ja) * 2008-03-07 2012-11-21 株式会社半導体エネルギー研究所 発光装置の作製方法
US8182863B2 (en) * 2008-03-17 2012-05-22 Semiconductor Energy Laboratory Co., Ltd. Deposition method and manufacturing method of light-emitting device
US7932112B2 (en) * 2008-04-14 2011-04-26 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing light-emitting device
JP5159689B2 (ja) * 2008-04-25 2013-03-06 株式会社半導体エネルギー研究所 発光装置の作製方法
US8182633B2 (en) * 2008-04-29 2012-05-22 Samsung Electronics Co., Ltd. Method of fabricating a flexible display device
KR101629637B1 (ko) * 2008-05-29 2016-06-13 가부시키가이샤 한도오따이 에네루기 켄큐쇼 성막방법 및 발광장치의 제조방법
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JP5469950B2 (ja) * 2008-08-08 2014-04-16 株式会社半導体エネルギー研究所 発光装置の作製方法
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KR102081209B1 (ko) * 2013-03-26 2020-02-26 삼성디스플레이 주식회사 유기 발광 표시 장치 및 그 제조 방법, 및 그 유기 발광 표시 장치의 제조에 사용되는 도너 기판 및 도너 기판 세트
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KR20140129784A (ko) * 2013-04-30 2014-11-07 삼성디스플레이 주식회사 레이저 열전사용 도너 기판, 레이저 열전사 방법 및 레이저 열전사 방법을 이용한 유기 발광 표시 장치의 제조 방법
KR20140139853A (ko) 2013-05-28 2014-12-08 삼성디스플레이 주식회사 도너기판 및 이를 이용한 전사패턴 형성방법
DE102013111785A1 (de) * 2013-10-25 2015-04-30 Osram Oled Gmbh Optoelektronisches Bauelement und Verfahren zum Herstellen eines optoelektronischen Bauelementes
TWI636896B (zh) * 2013-10-30 2018-10-01 荷蘭Tno自然科學組織公司 用以在基材上形成圖案化結構之方法與系統
KR20150056112A (ko) * 2013-11-14 2015-05-26 삼성디스플레이 주식회사 막 형성용 마스크, 이를 이용한 막 형성 방법 및 유기 발광 표시 장치의 제조 방법
KR101975289B1 (ko) * 2016-10-28 2019-05-07 주식회사 다원시스 유기 발광 소자의 제조 시스템 및 제조 방법
CN108242454B (zh) * 2016-12-23 2020-05-26 京东方科技集团股份有限公司 显示基板及其制备方法、显示装置
KR101921304B1 (ko) * 2017-07-03 2018-11-23 한국생산기술연구원 가스-보조 발광잉크 패터닝 방법, 이를 통한 전사방법, 및 전사 장치
KR102180071B1 (ko) 2017-10-31 2020-11-17 엘지디스플레이 주식회사 초미세 패턴 증착장치, 이를 이용한 초미세 패턴 증착방법 그리고 초미세 패턴 증착방법에 의해 제작된 전계발광표시장치
KR20200115749A (ko) * 2019-03-25 2020-10-08 삼성디스플레이 주식회사 표시 장치 및 그 제조 방법
CN114072722B (zh) * 2020-03-30 2024-04-16 京东方科技集团股份有限公司 背光模组和显示装置

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JP2006123546A (ja) 2006-05-18
EP1787822A3 (en) 2007-05-30
CN1769066B (zh) 2012-02-15
US20060084006A1 (en) 2006-04-20
EP1787822B1 (en) 2012-12-19
CN1769066A (zh) 2006-05-10
EP1787822A2 (en) 2007-05-23
KR100667069B1 (ko) 2007-01-10
EP1650046B1 (en) 2012-12-19
US7674749B2 (en) 2010-03-09
KR20060034575A (ko) 2006-04-24
EP1650046A1 (en) 2006-04-26

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