JP4492785B2 - 複合導電性粒子粉末、該複合導電性粒子粉末を含む導電性塗料並びに積層セラミックコンデンサ - Google Patents
複合導電性粒子粉末、該複合導電性粒子粉末を含む導電性塗料並びに積層セラミックコンデンサ Download PDFInfo
- Publication number
- JP4492785B2 JP4492785B2 JP2004020553A JP2004020553A JP4492785B2 JP 4492785 B2 JP4492785 B2 JP 4492785B2 JP 2004020553 A JP2004020553 A JP 2004020553A JP 2004020553 A JP2004020553 A JP 2004020553A JP 4492785 B2 JP4492785 B2 JP 4492785B2
- Authority
- JP
- Japan
- Prior art keywords
- particle powder
- conductive particle
- composite conductive
- composite
- nickel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000002245 particle Substances 0.000 title claims description 150
- 239000000843 powder Substances 0.000 title claims description 96
- 239000002131 composite material Substances 0.000 title claims description 71
- 239000003985 ceramic capacitor Substances 0.000 title claims description 40
- 239000003973 paint Substances 0.000 title claims description 31
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 109
- 229910052759 nickel Inorganic materials 0.000 claims description 48
- 239000003989 dielectric material Substances 0.000 claims description 45
- 239000000919 ceramic Substances 0.000 claims description 32
- 239000003607 modifier Substances 0.000 claims description 27
- 238000000576 coating method Methods 0.000 claims description 19
- 239000011248 coating agent Substances 0.000 claims description 18
- 239000000126 substance Substances 0.000 claims description 17
- 239000006104 solid solution Substances 0.000 claims description 9
- 229910002367 SrTiO Inorganic materials 0.000 claims description 7
- 239000007822 coupling agent Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 7
- 150000003961 organosilicon compounds Chemical class 0.000 claims description 5
- 239000004094 surface-active agent Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 4
- 229910010413 TiO 2 Inorganic materials 0.000 claims description 3
- 239000011246 composite particle Substances 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 35
- 230000003647 oxidation Effects 0.000 description 17
- 238000007254 oxidation reaction Methods 0.000 description 17
- 238000003795 desorption Methods 0.000 description 14
- -1 but in recent years Substances 0.000 description 12
- 239000007772 electrode material Substances 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 11
- 238000003756 stirring Methods 0.000 description 10
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 9
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 8
- 229910002113 barium titanate Inorganic materials 0.000 description 8
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 7
- 238000002156 mixing Methods 0.000 description 7
- 229920001296 polysiloxane Polymers 0.000 description 7
- 229910052782 aluminium Inorganic materials 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- 239000007771 core particle Substances 0.000 description 6
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 6
- 238000010304 firing Methods 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 239000001856 Ethyl cellulose Substances 0.000 description 4
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 4
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 4
- 230000032798 delamination Effects 0.000 description 4
- 235000019325 ethyl cellulose Nutrition 0.000 description 4
- 229920001249 ethyl cellulose Polymers 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 229910052726 zirconium Inorganic materials 0.000 description 4
- UMHKOAYRTRADAT-UHFFFAOYSA-N [hydroxy(octoxy)phosphoryl] octyl hydrogen phosphate Chemical compound CCCCCCCCOP(O)(=O)OP(O)(=O)OCCCCCCCC UMHKOAYRTRADAT-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 3
- 150000004645 aluminates Chemical class 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 3
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 229940116411 terpineol Drugs 0.000 description 3
- HMUNWXXNJPVALC-UHFFFAOYSA-N 1-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperazin-1-yl]-2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethanone Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)N1CCN(CC1)C(CN1CC2=C(CC1)NN=N2)=O HMUNWXXNJPVALC-UHFFFAOYSA-N 0.000 description 2
- VZSRBBMJRBPUNF-UHFFFAOYSA-N 2-(2,3-dihydro-1H-inden-2-ylamino)-N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]pyrimidine-5-carboxamide Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C(=O)NCCC(N1CC2=C(CC1)NN=N2)=O VZSRBBMJRBPUNF-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- 239000006087 Silane Coupling Agent Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000012461 cellulose resin Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- MWKFXSUHUHTGQN-UHFFFAOYSA-N decan-1-ol Chemical compound CCCCCCCCCCO MWKFXSUHUHTGQN-UHFFFAOYSA-N 0.000 description 2
- XEJNLUBEFCNORG-UHFFFAOYSA-N ditridecyl hydrogen phosphate Chemical compound CCCCCCCCCCCCCOP(O)(=O)OCCCCCCCCCCCCC XEJNLUBEFCNORG-UHFFFAOYSA-N 0.000 description 2
- 238000000635 electron micrograph Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 150000002815 nickel Chemical class 0.000 description 2
- 229910000510 noble metal Inorganic materials 0.000 description 2
- 150000002894 organic compounds Chemical class 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N phosphoric acid Substances OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 230000007847 structural defect Effects 0.000 description 2
- 238000002076 thermal analysis method Methods 0.000 description 2
- 238000001132 ultrasonic dispersion Methods 0.000 description 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- KKYDYRWEUFJLER-UHFFFAOYSA-N 1,1,2,2,3,3,4,4,5,5,6,6,7,7,10,10,10-heptadecafluorodecyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)CCC(F)(F)F KKYDYRWEUFJLER-UHFFFAOYSA-N 0.000 description 1
- OXYZDRAJMHGSMW-UHFFFAOYSA-N 3-chloropropyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)CCCCl OXYZDRAJMHGSMW-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- 238000004438 BET method Methods 0.000 description 1
- 229920002134 Carboxymethyl cellulose Polymers 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- AFCARXCZXQIEQB-UHFFFAOYSA-N N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CCNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 AFCARXCZXQIEQB-UHFFFAOYSA-N 0.000 description 1
- 241001272996 Polyphylla fullo Species 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- FVQVTTMDOISRDX-UHFFFAOYSA-J [Zr+4].CCC(C([O-])=O)C(=O)C(CC)(CC)CC.CCC(C([O-])=O)C(=O)C(CC)(CC)CC.CCC(C([O-])=O)C(=O)C(CC)(CC)CC.CCC(C([O-])=O)C(=O)C(CC)(CC)CC Chemical compound [Zr+4].CCC(C([O-])=O)C(=O)C(CC)(CC)CC.CCC(C([O-])=O)C(=O)C(CC)(CC)CC.CCC(C([O-])=O)C(=O)C(CC)(CC)CC.CCC(C([O-])=O)C(=O)C(CC)(CC)CC FVQVTTMDOISRDX-UHFFFAOYSA-J 0.000 description 1
- WDJHALXBUFZDSR-UHFFFAOYSA-M acetoacetate Chemical compound CC(=O)CC([O-])=O WDJHALXBUFZDSR-UHFFFAOYSA-M 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- VSSMJHUOAAZQMT-UHFFFAOYSA-N butanedioic acid;1-octylsulfonyloctane Chemical compound OC(=O)CCC(O)=O.CCCCCCCCS(=O)(=O)CCCCCCCC VSSMJHUOAAZQMT-UHFFFAOYSA-N 0.000 description 1
- XGZGKDQVCBHSGI-UHFFFAOYSA-N butyl(triethoxy)silane Chemical compound CCCC[Si](OCC)(OCC)OCC XGZGKDQVCBHSGI-UHFFFAOYSA-N 0.000 description 1
- 239000001768 carboxy methyl cellulose Substances 0.000 description 1
- 235000010948 carboxy methyl cellulose Nutrition 0.000 description 1
- 239000008112 carboxymethyl-cellulose Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- BAAAEEDPKUHLID-UHFFFAOYSA-N decyl(triethoxy)silane Chemical compound CCCCCCCCCC[Si](OCC)(OCC)OCC BAAAEEDPKUHLID-UHFFFAOYSA-N 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- ZZNQQQWFKKTOSD-UHFFFAOYSA-N diethoxy(diphenyl)silane Chemical compound C=1C=CC=CC=1[Si](OCC)(OCC)C1=CC=CC=C1 ZZNQQQWFKKTOSD-UHFFFAOYSA-N 0.000 description 1
- JJQZDUKDJDQPMQ-UHFFFAOYSA-N dimethoxy(dimethyl)silane Chemical compound CO[Si](C)(C)OC JJQZDUKDJDQPMQ-UHFFFAOYSA-N 0.000 description 1
- AHUXYBVKTIBBJW-UHFFFAOYSA-N dimethoxy(diphenyl)silane Chemical compound C=1C=CC=CC=1[Si](OC)(OC)C1=CC=CC=C1 AHUXYBVKTIBBJW-UHFFFAOYSA-N 0.000 description 1
- WHGNXNCOTZPEEK-UHFFFAOYSA-N dimethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](C)(OC)CCCOCC1CO1 WHGNXNCOTZPEEK-UHFFFAOYSA-N 0.000 description 1
- YYLGKUPAFFKGRQ-UHFFFAOYSA-N dimethyldiethoxysilane Chemical compound CCO[Si](C)(C)OCC YYLGKUPAFFKGRQ-UHFFFAOYSA-N 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- XYIBRDXRRQCHLP-UHFFFAOYSA-N ethyl acetoacetate Chemical compound CCOC(=O)CC(C)=O XYIBRDXRRQCHLP-UHFFFAOYSA-N 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- PYGSKMBEVAICCR-UHFFFAOYSA-N hexa-1,5-diene Chemical group C=CCCC=C PYGSKMBEVAICCR-UHFFFAOYSA-N 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 1
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 1
- 150000002816 nickel compounds Chemical class 0.000 description 1
- CAQIWIAAHXOQOS-UHFFFAOYSA-N octadecanoic acid;propan-2-ol;titanium Chemical compound [Ti].CC(C)O.CCCCCCCCCCCCCCCCCC(O)=O.CCCCCCCCCCCCCCCCCC(O)=O.CCCCCCCCCCCCCCCCCC(O)=O CAQIWIAAHXOQOS-UHFFFAOYSA-N 0.000 description 1
- MSRJTTSHWYDFIU-UHFFFAOYSA-N octyltriethoxysilane Chemical compound CCCCCCCC[Si](OCC)(OCC)OCC MSRJTTSHWYDFIU-UHFFFAOYSA-N 0.000 description 1
- 229960003493 octyltriethoxysilane Drugs 0.000 description 1
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000012798 spherical particle Substances 0.000 description 1
- 238000005118 spray pyrolysis Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- PMQIWLWDLURJOE-UHFFFAOYSA-N triethoxy(1,1,2,2,3,3,4,4,5,5,6,6,7,7,10,10,10-heptadecafluorodecyl)silane Chemical compound CCO[Si](OCC)(OCC)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)CCC(F)(F)F PMQIWLWDLURJOE-UHFFFAOYSA-N 0.000 description 1
- BPCXHCSZMTWUBW-UHFFFAOYSA-N triethoxy(1,1,2,2,3,3,4,4,5,5,8,8,8-tridecafluorooctyl)silane Chemical compound CCO[Si](OCC)(OCC)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)CCC(F)(F)F BPCXHCSZMTWUBW-UHFFFAOYSA-N 0.000 description 1
- ZLGWXNBXAXOQBG-UHFFFAOYSA-N triethoxy(3,3,3-trifluoropropyl)silane Chemical compound CCO[Si](OCC)(OCC)CCC(F)(F)F ZLGWXNBXAXOQBG-UHFFFAOYSA-N 0.000 description 1
- DENFJSAFJTVPJR-UHFFFAOYSA-N triethoxy(ethyl)silane Chemical compound CCO[Si](CC)(OCC)OCC DENFJSAFJTVPJR-UHFFFAOYSA-N 0.000 description 1
- WUMSTCDLAYQDNO-UHFFFAOYSA-N triethoxy(hexyl)silane Chemical compound CCCCCC[Si](OCC)(OCC)OCC WUMSTCDLAYQDNO-UHFFFAOYSA-N 0.000 description 1
- JCVQKRGIASEUKR-UHFFFAOYSA-N triethoxy(phenyl)silane Chemical compound CCO[Si](OCC)(OCC)C1=CC=CC=C1 JCVQKRGIASEUKR-UHFFFAOYSA-N 0.000 description 1
- QQQSFSZALRVCSZ-UHFFFAOYSA-N triethoxysilane Chemical compound CCO[SiH](OCC)OCC QQQSFSZALRVCSZ-UHFFFAOYSA-N 0.000 description 1
- XYJRNCYWTVGEEG-UHFFFAOYSA-N trimethoxy(2-methylpropyl)silane Chemical compound CO[Si](OC)(OC)CC(C)C XYJRNCYWTVGEEG-UHFFFAOYSA-N 0.000 description 1
- JLGNHOJUQFHYEZ-UHFFFAOYSA-N trimethoxy(3,3,3-trifluoropropyl)silane Chemical compound CO[Si](OC)(OC)CCC(F)(F)F JLGNHOJUQFHYEZ-UHFFFAOYSA-N 0.000 description 1
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 238000004876 x-ray fluorescence Methods 0.000 description 1
Landscapes
- Non-Insulated Conductors (AREA)
- Powder Metallurgy (AREA)
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Conductive Materials (AREA)
Description
本発明において最も重要な点は、ニッケル粒子の粒子表面が表面改質剤によって被覆されていると共に該被覆に誘電体物質が付着している複合導電性粒子粉末は、熱収縮特性及び耐酸化性に優れると共に、導電性塗料中における分散性に優れているという事実である。
誘電体物質の脱離率(%)={(Wa−We)/Wa}×100
Wa:複合導電性粒子粉末の誘電体物質付着量
We:脱離試験後の複合導電性粒子粉末の誘電体物質付着量
ニッケル粒子粉末(粒子形状:球状、平均粒子径0.22μm、BET比表面積値3.3m2/g、熱収縮開始温度405℃、酸化開始温度360℃、流動性指数40)10.0kgに、メチルトリエトキシシラン(商品名:TSL8123:GE東芝シリコーン株式会社製)75gを、エッジランナーを稼動させながらニッケル粒子粉末に添加し、588N/cmの線荷重で30分間混合攪拌を行った。なお、このときの攪拌速度は22rpmで行った。
前記複合導電性粒子粉末100重量部、ターピネオール115重量部及びエチルセルロースのターピネオール溶液(エチルセルロースの含有量:20重量%)100重量部とを混合し、3本ロールミルを用いて混合分散させ、導電性塗料を得た。
複合導電性粒子粉末の処理に用いたBaTiO3(誘電体A)を用いて従来法で作製したセラミックスラリーをシート状に形成し、厚さ約2.8μmのセラミックグリーンシートを得た。次いで、セラミックグリーンシート上に前記導電性塗料をスクリーン印刷等によって印刷し、内部電極層を形成した。次いで、該内部電極層が形成されたセラミックグリーンシートを複数枚積層し、熱プレスして一体化したものを還元雰囲気下、1300℃で2時間焼成した後、外部電極を焼付けることによって積層セラミックコンデンサを得た。
芯粒子粉末として表1に示す特性を有する芯粒子を用意した。
誘電体物質として表2に示す諸特性を有する誘電体物質を用意した。
表面改質剤による被覆工程における添加物の種類、添加量、エッジランナー処理の線荷重及び時間、誘電体物質の付着工程における誘電体物質の種類、添加量、エッジランナー処理の線荷重及び時間を種々変化させた以外は、前記実施例1−1と同様にして複合導電性粒子粉末を得た。
実施例3−1〜3−6、比較例4〜9:
導電性粒子粉末の種類及びセラミック誘電体層に用いる誘電体物質を種々変化させた以外は、前記実施例3−1の積層セラミックコンデンサの製造と同様にして積層を得た。
Claims (4)
- ニッケル粒子の粒子表面が、有機ケイ素化合物、カップリング剤又は界面活性剤から選ばれる一種又は二種以上の表面改質剤によって被覆されていると共に該被覆に誘電体物質が付着している複合粒子粉末であって、前記誘電体物質はBaTiO 3 、SrTiO 3 及びその固溶体からなる強誘電体又はMgO、CaO、SrO、BaOとTiO 2 との固溶体からなる誘電体から選ばれる一種以上であり、前記表面改質剤の被覆量がニッケル粒子粉末に対してC換算で0.001〜5.0重量%であり、前記誘電体物質の付着量が複合導電性粒子粉末に対して0.01〜30重量%であることを特徴とする複合導電性粒子粉末。
- 誘電体物質が、BaTiO 3 、SrTiO 3 及びその固溶体から選ばれる一種以上の強誘電体であることを特徴とする請求項1記載の複合導電性粒子粉末。
- 少なくとも導電性粒子粉末と樹脂とを含有する導電性塗料において、前記導電性粒子粉末が請求項1又は請求項2記載の複合導電性粒子粉末であることを特徴とする導電性塗料。
- セラミック誘電体層と内部電極層とが交互に積層された構造を有する積層セラミックコンデンサにおいて、内部電極層に請求項1又は2記載の複合導電性粒子粉末を含有することを特徴とする積層セラミックコンデンサ。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004020553A JP4492785B2 (ja) | 2004-01-28 | 2004-01-28 | 複合導電性粒子粉末、該複合導電性粒子粉末を含む導電性塗料並びに積層セラミックコンデンサ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004020553A JP4492785B2 (ja) | 2004-01-28 | 2004-01-28 | 複合導電性粒子粉末、該複合導電性粒子粉末を含む導電性塗料並びに積層セラミックコンデンサ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005216634A JP2005216634A (ja) | 2005-08-11 |
JP4492785B2 true JP4492785B2 (ja) | 2010-06-30 |
Family
ID=34904432
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004020553A Expired - Lifetime JP4492785B2 (ja) | 2004-01-28 | 2004-01-28 | 複合導電性粒子粉末、該複合導電性粒子粉末を含む導電性塗料並びに積層セラミックコンデンサ |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4492785B2 (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4780272B2 (ja) * | 2004-06-15 | 2011-09-28 | 戸田工業株式会社 | 複合導電性粒子粉末、該複合導電性粒子粉末を含む導電性塗料並びに積層セラミックコンデンサ |
JP2007332446A (ja) * | 2006-06-16 | 2007-12-27 | Mitsui Mining & Smelting Co Ltd | 誘電材粒子付ニッケル粒子及びその誘電材粒子付ニッケル粒子の製造方法 |
JP5528673B2 (ja) * | 2008-02-01 | 2014-06-25 | 三井金属鉱業株式会社 | 誘電体粒子付ニッケル粒子及びその製造方法 |
JP5168492B2 (ja) * | 2008-10-16 | 2013-03-21 | Tdk株式会社 | 薄膜コンデンサおよびその製造方法 |
TWI547325B (zh) * | 2012-02-08 | 2016-09-01 | Jx Nippon Mining & Metals Corp | A surface-treated metal powder, and a method for producing the same |
JP5573936B2 (ja) * | 2012-12-27 | 2014-08-20 | 戸田工業株式会社 | 導電性粒子粉末 |
JP5784691B2 (ja) * | 2013-12-05 | 2015-09-24 | 戸田工業株式会社 | 導電性粒子 |
JP5978371B2 (ja) * | 2015-09-10 | 2016-08-24 | 株式会社ノリタケカンパニーリミテド | コアシェル粒子及び導体形成用組成物 |
JP6630208B2 (ja) * | 2016-03-28 | 2020-01-15 | Jxtgエネルギー株式会社 | 金属粉ペーストの製造方法、金属粉ペーストのスクリーン印刷方法、電極の製造方法、チップ積層セラミックコンデンサーの製造方法および金属粉ペースト |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1068002A (ja) * | 1996-08-29 | 1998-03-10 | Nittetsu Mining Co Ltd | 被覆粉体固結物およびその製造方法 |
JPH1112490A (ja) * | 1997-06-27 | 1999-01-19 | Nittetsu Mining Co Ltd | グリーン色系顔料及びその製造方法 |
JP2000109902A (ja) * | 1998-10-02 | 2000-04-18 | Nittetsu Mining Co Ltd | 蓄光性多層膜被覆粉体 |
JP2000178602A (ja) * | 1998-10-06 | 2000-06-27 | Shoei Chem Ind Co | ニッケル複合粒子及びその製造方法 |
JP2003317542A (ja) * | 2002-02-22 | 2003-11-07 | Murata Mfg Co Ltd | 導電性ペーストおよび積層セラミック電子部品 |
-
2004
- 2004-01-28 JP JP2004020553A patent/JP4492785B2/ja not_active Expired - Lifetime
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1068002A (ja) * | 1996-08-29 | 1998-03-10 | Nittetsu Mining Co Ltd | 被覆粉体固結物およびその製造方法 |
JPH1112490A (ja) * | 1997-06-27 | 1999-01-19 | Nittetsu Mining Co Ltd | グリーン色系顔料及びその製造方法 |
JP2000109902A (ja) * | 1998-10-02 | 2000-04-18 | Nittetsu Mining Co Ltd | 蓄光性多層膜被覆粉体 |
JP2000178602A (ja) * | 1998-10-06 | 2000-06-27 | Shoei Chem Ind Co | ニッケル複合粒子及びその製造方法 |
JP2003317542A (ja) * | 2002-02-22 | 2003-11-07 | Murata Mfg Co Ltd | 導電性ペーストおよび積層セラミック電子部品 |
Also Published As
Publication number | Publication date |
---|---|
JP2005216634A (ja) | 2005-08-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4697539B2 (ja) | ニッケル粉末、導体ペーストおよびそれを用いた積層電子部品 | |
TWI241601B (en) | Electronic device, dielectric ceramic composition and the production method | |
TW419685B (en) | Dielectric ceramic, method for producing the same, laminated ceramic electronic element, and method for producing the same | |
JP4483597B2 (ja) | 電子部品、誘電体磁器組成物およびその製造方法 | |
TWI508102B (zh) | 導電性糊狀組成物及使用其所形成之導電性膜 | |
JP3452034B2 (ja) | 導電性ペーストおよび積層セラミック電子部品 | |
JP2001023852A (ja) | 積層セラミック電子部品 | |
JP2012022799A (ja) | 電極形成用の導電微粒子及び金属ペースト並びに電極 | |
WO2015022968A1 (ja) | 表面処理された金属粉、及びその製造方法 | |
WO2005050679A1 (ja) | 積層型セラミックコンデンサ | |
JP4492785B2 (ja) | 複合導電性粒子粉末、該複合導電性粒子粉末を含む導電性塗料並びに積層セラミックコンデンサ | |
TWI464751B (zh) | 導電粒子、其製造方法、金屬膏以及電極 | |
JP2010067418A (ja) | 導体ペーストおよびその製造方法 | |
JP4400728B2 (ja) | 軟磁性材料及びその製造法、該軟磁性材料を含む圧粉磁心 | |
TWI698328B (zh) | 陶瓷層與銅粉糊燒結體之積層體 | |
JP2002025847A (ja) | 導電性ペーストおよび積層セラミック電子部品 | |
JP2004079211A (ja) | 導電ペースト用銀粉及びその製造方法並びにその銀粉を用いた導電ペースト | |
JP2008262916A (ja) | 導電ペースト用銀粉及びその銀粉を用いた導電ペースト | |
TWI419980B (zh) | 鎳-錸合金粉末及含有它之導電糊 | |
JP4914065B2 (ja) | 積層セラミックコンデンサ電極用ニッケル粉末、電極形成用ペースト及び積層セラミックコンデンサ | |
WO2005026077A1 (ja) | セラミックスラリーの製造方法、グリーンシートおよび積層セラミック部品 | |
TW202007528A (zh) | 陶瓷層與銅粉糊燒結體之積層體 | |
JP2007332446A (ja) | 誘電材粒子付ニッケル粒子及びその誘電材粒子付ニッケル粒子の製造方法 | |
JP2009024204A (ja) | 炭化物被覆ニッケル粉末およびその製造方法 | |
JP2009079269A (ja) | 導電性ペースト用銅粉およびその製造方法、並びに、導電性ペースト |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20061107 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20090824 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20090916 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20091116 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20091224 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20100222 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20100317 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 4492785 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20100330 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130416 Year of fee payment: 3 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130416 Year of fee payment: 3 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130416 Year of fee payment: 3 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140416 Year of fee payment: 4 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |