JP5784691B2 - 導電性粒子 - Google Patents
導電性粒子 Download PDFInfo
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- JP5784691B2 JP5784691B2 JP2013251635A JP2013251635A JP5784691B2 JP 5784691 B2 JP5784691 B2 JP 5784691B2 JP 2013251635 A JP2013251635 A JP 2013251635A JP 2013251635 A JP2013251635 A JP 2013251635A JP 5784691 B2 JP5784691 B2 JP 5784691B2
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Landscapes
- Non-Insulated Conductors (AREA)
Description
(式中、σは粒子径の標準偏差(μm)を表し、Dnは数平均粒子径(μm)を表す。)
(式中、L1:反転までの変位(μm)、L2:原点荷重値までの変位(μm)
<複合粒子粉末の製造>
基材樹脂粒子(種類:アクリル樹脂球(商品名:M-11(早川ゴム株式会社製))、粒子形状:球状、平均粒子径:5.11μm、比重:1.20g/cm3、表面抵抗値:6.8×1015Ω・cm)の800gをエッジランナーに投入し、次いで、メチルトリエトキシシラン(商品名:TSL8123(GE東芝シリコーン株式会社製))の8gを、エッジランナーを稼動させながら、基材樹脂粒子に対し添加し、294N/cmの線荷重で20分間混合撹拌を行った。
得られた複合粒子に無電解メッキの形成段階において、導電性粒子1.0gと5%PVA(ポリビニルアルコール)水溶液120gを200mLビーカーに入れ、超音波による分散を10〜30分行った。得られた導電性粒子分散液に撹拌しながら1%塩化金酸水溶液を40g入れ、マントルヒーターで温度80℃、加熱時間30分で反応を行い、導電性粒子表面上に金の無電解メッキを形成させた。その反応液を、吸引ろ過装置を用いて濾過を行い、80℃の温水を2L通過させて残ったPVA水溶液、塩化金酸を取り除いた。さらに、80℃で16時間乾燥して、目的とする導電性樹脂粒子を入手した。このときの金メッキ層の厚みは計算上16nmであった。
<複合粒子粉末の製造>
実施例1と同様にして、得られた粒子表面が表面改質剤によって被覆されている基材樹脂粒子の170gとナノサイズ導電粒子B(種類:ITO、平均粒子径:0.02μm、比重:7.1g/cm3、体積固有抵抗値:1.6Ω・cm)の32.0gを高速せん断ミルに入れ、4100rpmの回転数で20分間高速せん断処理を行った後、乾燥機を用いて80℃で30分間加熱処理を行い、複合粒子粉末を入手した。
得られた複合粒子に、実施例1と同様に無電解メッキを施し、導電性樹脂粒子を入手した。
<複合粒子粉末の製造>
実施例1と同様にして、得られた粒子表面が表面改質剤によって被覆されている基材樹脂粒子の170gとナノサイズ導電粒子C(種類:ケッチェンブラック、平均粒子径:0.03μm、比重:1.4g/cm3、体積固有抵抗値:3.2×10-3Ω・cm)の4.7gを高速せん断ミルに入れ、4100rpmの回転数で20分間高速せん断処理を行った後、乾燥機を用いて80℃で30分間加熱処理を行い、複合粒子粉末を入手した。
得られた複合粒子に、実施例1と同様に無電解メッキを施し、導電性樹脂粒子を入手した。
<複合粒子粉末の製造>
実施例1と同様にして、得られた粒子表面が表面改質剤によって被覆されている基材樹脂粒子の170gとナノサイズ導電粒子D(種類:カーボンナノチューブ、平均直径:0.01μm、平均長さ:0.5μm、比重:5.6cm3、体積固有抵抗値:4.1×10-2Ω・cm)の0.6gを高速せん断ミルに入れ、4100rpmの回転数で20分間高速せん断処理を行った後、乾燥機を用いて80℃で30分間加熱処理を行い、複合粒子粉末を入手した。
得られた複合粒子に、実施例1と同様に無電解メッキを施し、導電性樹脂粒子を入手した。
実施例1の無電解メッキを行う前の導電性粒子、即ち複合粒子を用いた。
市販のメッキ導電スペーサ5.6μmを用いた。
(1)導電性評価
微小圧縮試験機((株)島津製作所製MCT-W200J抵抗キッド付)を用いて、粒子の圧縮試験を行い、1個あたりの抵抗値を測定した。結果を図1に示す。図1は粒子の圧縮変形時における電気抵抗値を示すグラフである。図1に示すように、実施例1では、異方導電性粒子(ACF)で必要とされる低抵抗値(1.0E+2Ω未満)が得られた。
評価(1)で用いた各粒子を走査型電子顕微鏡で観察し、その結果を図3〜6に示す。図3は実施例で用いた基材樹脂粒子の図面代用写真である。図4は実施例1で得られた複合粒子の図面代用写真である。図5は実施例4で得られた複合粒子の図面代用写真である。図6は実施例1で得られた導電性粒子の図面代用写真である。
Claims (2)
- 基材樹脂粒子、複数のナノサイズ導電粒子及び導電層を具える導電性粒子であって、基材樹脂粒子の表面に付着する複数のナノサイズ導電粒子間の点状接合による導電ネットワーク及び前記ナノサイズ導電粒子上にめっきにより形成された導電層を備え、
前記基材樹脂粒子は前記ナノサイズ導電粒子の付着に先立ち表面改質剤によって被覆され、
前記ナノサイズ導電粒子は、30nm以上100nm以下の平均粒子径を持ち、金属、金属酸化物、導電性カーボン及び/又は導電性高分子の少なくとも1種の材質からなり、前記基材樹脂粒子の表面にせん断または衝撃による乾式方式により付着していることを特徴とする導電性粒子。 - 前記基材樹脂粒子は10%以下の粒子径変動係数(Cv値)を有することを特徴とする請求項1に記載の導電性粒子。
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