JP4481688B2 - 基板処理装置，塗布装置、塗布方法、及び、フォトマスクの製造方法 - Google Patents

基板処理装置，塗布装置、塗布方法、及び、フォトマスクの製造方法 Download PDF

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Publication number
JP4481688B2
JP4481688B2 JP2004071234A JP2004071234A JP4481688B2 JP 4481688 B2 JP4481688 B2 JP 4481688B2 JP 2004071234 A JP2004071234 A JP 2004071234A JP 2004071234 A JP2004071234 A JP 2004071234A JP 4481688 B2 JP4481688 B2 JP 4481688B2
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JP
Japan
Prior art keywords
substrate
coating
nozzle
holding means
holding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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JP2004071234A
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English (en)
Japanese (ja)
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JP2004327963A5 (enExample
JP2004327963A (ja
Inventor
秀峰 元村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hoya Corp
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Hoya Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hoya Corp filed Critical Hoya Corp
Priority to JP2004071234A priority Critical patent/JP4481688B2/ja
Priority to TW093109910A priority patent/TWI244406B/zh
Priority to KR1020040024586A priority patent/KR100678567B1/ko
Priority to US10/820,752 priority patent/US20040253380A1/en
Priority to CNB2004100337168A priority patent/CN1296145C/zh
Publication of JP2004327963A publication Critical patent/JP2004327963A/ja
Publication of JP2004327963A5 publication Critical patent/JP2004327963A5/ja
Application granted granted Critical
Publication of JP4481688B2 publication Critical patent/JP4481688B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21F—WORKING OR PROCESSING OF METAL WIRE
    • B21F23/00—Feeding wire in wire-working machines or apparatus
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21F—WORKING OR PROCESSING OF METAL WIRE
    • B21F27/00—Making wire network, i.e. wire nets
    • B21F27/12—Making special types or portions of network by methods or means specially adapted therefor
    • B21F27/121—Making special types or portions of network by methods or means specially adapted therefor of tubular form, e.g. as reinforcements for pipes or pillars
    • B21F27/122—Making special types or portions of network by methods or means specially adapted therefor of tubular form, e.g. as reinforcements for pipes or pillars by attaching a continuous stirrup to longitudinal wires
    • B21F27/124—Making special types or portions of network by methods or means specially adapted therefor of tubular form, e.g. as reinforcements for pipes or pillars by attaching a continuous stirrup to longitudinal wires applied by rotation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Coating Apparatus (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Materials For Photolithography (AREA)
JP2004071234A 2003-04-10 2004-03-12 基板処理装置，塗布装置、塗布方法、及び、フォトマスクの製造方法 Expired - Lifetime JP4481688B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2004071234A JP4481688B2 (ja) 2003-04-10 2004-03-12 基板処理装置，塗布装置、塗布方法、及び、フォトマスクの製造方法
TW093109910A TWI244406B (en) 2003-04-10 2004-04-09 Substrate processing system, coating apparatus, and coating method
KR1020040024586A KR100678567B1 (ko) 2003-04-10 2004-04-09 기판처리장치, 도포장치 및 도포방법
US10/820,752 US20040253380A1 (en) 2003-04-10 2004-04-09 Substrate processing system, coating apparatus, and coating method
CNB2004100337168A CN1296145C (zh) 2003-04-10 2004-04-09 基板处理装置、涂敷装置及涂敷方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003106562 2003-04-10
JP2004071234A JP4481688B2 (ja) 2003-04-10 2004-03-12 基板処理装置，塗布装置、塗布方法、及び、フォトマスクの製造方法

Publications (3)

Publication Number Publication Date
JP2004327963A JP2004327963A (ja) 2004-11-18
JP2004327963A5 JP2004327963A5 (enExample) 2007-04-12
JP4481688B2 true JP4481688B2 (ja) 2010-06-16

Family

ID=33513043

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004071234A Expired - Lifetime JP4481688B2 (ja) 2003-04-10 2004-03-12 基板処理装置，塗布装置、塗布方法、及び、フォトマスクの製造方法

Country Status (5)

Country Link
US (1) US20040253380A1 (enExample)
JP (1) JP4481688B2 (enExample)
KR (1) KR100678567B1 (enExample)
CN (1) CN1296145C (enExample)
TW (1) TWI244406B (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006294820A (ja) * 2005-04-08 2006-10-26 Hoya Corp 塗布装置及びフォトマスクブランクの製造方法
KR101334012B1 (ko) * 2005-07-25 2013-12-02 호야 가부시키가이샤 마스크 블랭크용 기판의 제조방법, 마스크 블랭크의제조방법 및 마스크의 제조방법
JP2007219038A (ja) * 2006-02-15 2007-08-30 Hoya Corp マスクブランク及びフォトマスク
JP5363724B2 (ja) * 2007-12-13 2013-12-11 Ｈｏｙａ株式会社 フォトマスクブランク、フォトマスク及びそれらの製造方法並びに塗布装置
KR101145562B1 (ko) 2008-04-10 2012-05-15 호야 가부시키가이샤 포토마스크 블랭크의 제조 방법, 포토마스크의 제조 방법
WO2010100710A1 (ja) * 2009-03-02 2010-09-10 キヤノンアネルバ株式会社 基板処理装置、磁気デバイスの製造装置及び製造方法
JP2011013321A (ja) * 2009-06-30 2011-01-20 Hoya Corp フォトマスクブランクの製造方法、フォトマスクの製造方法及び塗布装置
CN102962166B (zh) * 2012-11-26 2016-12-21 南京工业大学 一种石墨涂膜机
KR20140069677A (ko) * 2012-11-29 2014-06-10 삼성디스플레이 주식회사 기판 프린팅 장치 및 기판 프린팅 방법
JP5735161B1 (ja) * 2014-07-08 2015-06-17 中外炉工業株式会社 塗布装置及びその改良方法
JP6659422B2 (ja) * 2016-03-29 2020-03-04 アルバック成膜株式会社 塗布装置、マスクブランクの製造方法
CN112827738B (zh) * 2021-01-15 2021-12-31 江苏神铸智能科技有限公司 一种垃圾桶口部上色一体机
CN113083611B (zh) * 2021-03-12 2022-01-11 杭州沃镭智能科技股份有限公司 一种igbt模块的陶瓷片涂脂装置
CN115722399A (zh) * 2021-08-26 2023-03-03 衢州纤纳新能源科技有限公司 倒置涂布装置以及倒置涂布方法
CN114192326A (zh) * 2021-12-13 2022-03-18 绍兴高新技术产业开发区迪荡新城投资发展有限公司 一种铝合金板喷涂设备
CN114515666A (zh) * 2022-01-18 2022-05-20 深圳大学 基于机器人的涂胶装置和涂胶方法
CN116197088B (zh) * 2023-03-28 2025-10-10 浙江知索科技有限公司 一种烟雾报警器壳体点胶装置

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5940592A (ja) * 1982-08-30 1984-03-06 Sharp Corp 半導体レ−ザ素子
JPH084105B2 (ja) * 1987-06-19 1996-01-17 株式会社エンヤシステム ウェハ接着方法
US5455062A (en) * 1992-05-28 1995-10-03 Steag Microtech Gmbh Sternenfels Capillary device for lacquering or coating plates or disks
WO1994025177A1 (de) * 1993-05-05 1994-11-10 Steag Micro-Tech Gmbh Sternenfels Vorrichtung zur belackung oder beschichtung von platten oder scheiben
DE4445985A1 (de) * 1994-12-22 1996-06-27 Steag Micro Tech Gmbh Verfahren und Vorrichtung zur Belackung oder Beschichtung eines Substrats
DE59510480D1 (de) * 1994-12-22 2003-01-09 Steag Hamatech Ag Vorrichtung zur Belackung oder Beschichtung eines Substrats
US5858459A (en) * 1996-02-22 1999-01-12 Micron Technology, Inc. Cassette invertor apparatus and method
JPH09254028A (ja) * 1996-03-25 1997-09-30 Ebara Corp ポリッシング装置のプッシャー
JP3672377B2 (ja) * 1996-05-02 2005-07-20 大日本スクリーン製造株式会社 基板処理装置
JP3278714B2 (ja) * 1996-08-30 2002-04-30 東京エレクトロン株式会社 塗布膜形成装置
JPH10202163A (ja) * 1997-01-20 1998-08-04 Dainippon Printing Co Ltd 基板保持部材および塗布装置
JPH1157587A (ja) * 1997-08-22 1999-03-02 Dainippon Screen Mfg Co Ltd 塗布装置
JP4334645B2 (ja) * 1999-01-18 2009-09-30 大日本印刷株式会社 塗布装置
JP3334045B2 (ja) * 1999-08-31 2002-10-15 株式会社ヒラノテクシード 塗工方法及び塗工装置
JP3742822B2 (ja) 2000-05-16 2006-02-08 株式会社ヒラノテクシード 塗工装置及びそれを使用した塗工システム
JP3661010B2 (ja) * 2000-05-16 2005-06-15 株式会社ヒラノテクシード 塗工装置及びその方法
JP2002127070A (ja) * 2000-10-18 2002-05-08 Hiroshi Akashi 板状体保持装置
JP3811740B2 (ja) * 2001-06-20 2006-08-23 株式会社ヒラノテクシード 塗工装置
JP3658355B2 (ja) * 2001-10-03 2005-06-08 Ｈｏｙａ株式会社 塗布膜の乾燥方法、塗布膜の形成方法、及び塗布膜形成装置

Also Published As

Publication number Publication date
KR20040089544A (ko) 2004-10-21
JP2004327963A (ja) 2004-11-18
TWI244406B (en) 2005-12-01
KR100678567B1 (ko) 2007-02-02
CN1535763A (zh) 2004-10-13
TW200425961A (en) 2004-12-01
US20040253380A1 (en) 2004-12-16
CN1296145C (zh) 2007-01-24

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