JP4461858B2 - SiC単結晶の接着方法 - Google Patents
SiC単結晶の接着方法 Download PDFInfo
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- JP4461858B2 JP4461858B2 JP2004076278A JP2004076278A JP4461858B2 JP 4461858 B2 JP4461858 B2 JP 4461858B2 JP 2004076278 A JP2004076278 A JP 2004076278A JP 2004076278 A JP2004076278 A JP 2004076278A JP 4461858 B2 JP4461858 B2 JP 4461858B2
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- seed crystal
- single crystal
- resin
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- sic
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- 239000013078 crystal Substances 0.000 title claims description 64
- 238000000034 method Methods 0.000 title claims description 27
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 50
- 239000000853 adhesive Substances 0.000 claims description 28
- 230000001070 adhesive effect Effects 0.000 claims description 28
- 229910052799 carbon Inorganic materials 0.000 claims description 28
- 229910002804 graphite Inorganic materials 0.000 claims description 22
- 239000010439 graphite Substances 0.000 claims description 22
- 239000011347 resin Substances 0.000 claims description 19
- 229920005989 resin Polymers 0.000 claims description 19
- 229920001187 thermosetting polymer Polymers 0.000 claims description 13
- 238000010438 heat treatment Methods 0.000 claims description 12
- 239000002245 particle Substances 0.000 claims description 9
- 230000003746 surface roughness Effects 0.000 claims description 6
- 239000005011 phenolic resin Substances 0.000 claims description 5
- 239000007787 solid Substances 0.000 claims description 4
- 239000002904 solvent Substances 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 2
- 229920000647 polyepoxide Polymers 0.000 claims description 2
- 229920001225 polyester resin Polymers 0.000 claims description 2
- 239000004645 polyester resin Substances 0.000 claims description 2
- 229920001721 polyimide Polymers 0.000 claims description 2
- 239000009719 polyimide resin Substances 0.000 claims description 2
- 238000010000 carbonizing Methods 0.000 claims 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 40
- 238000003763 carbonization Methods 0.000 description 15
- 239000012790 adhesive layer Substances 0.000 description 9
- 230000007423 decrease Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000005092 sublimation method Methods 0.000 description 4
- 239000000155 melt Substances 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 239000012071 phase Substances 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 241000234435 Lilium Species 0.000 description 1
- 229910018540 Si C Inorganic materials 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000859 sublimation Methods 0.000 description 1
- 230000008022 sublimation Effects 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Ceramic Products (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Description
上記接着材は上記炭素成分として粒径100nm以下の固形炭素を15〜40wt%含有し、
SiC種結晶の接着面の面粗度をRa≧0.1μmとすることを特徴とする。
Claims (7)
- 熱硬化性樹脂と溶媒と炭素成分とから成る接着剤を用いてSiC単結晶と黒鉛棒とを接着する方法であって、
上記接着材は上記炭素成分として粒径100nm以下の固形炭素を15〜40wt%含有し、
SiC種結晶の接着面の面粗度をRa≧0.1μmとすることを特徴とする接着方法。 - 請求項1において、上記熱硬化性樹脂が、フェノール樹脂、エポキシ樹脂、ポリイミド樹脂、ポリエステル樹脂から選択した少なくとも一種であることを特徴とする接着方法。
- 請求項1または2において、上記熱硬化性樹脂の残炭率が50%以上であることを特徴とする接着方法。
- 請求項1から3までのいずれか1項において、上記熱硬化性樹脂がフェノール樹脂であることを特徴とする接着方法。
- 請求項1から4までのいずれか1項記載において、上記接着剤でSiC種結晶を黒鉛棒に粘着させた後に、上記熱硬化性樹脂の炭化温度以上の保持温度で熱処理することを特徴とする接着方法。
- 請求項5において、上記保持温度が650℃以上であることを特徴とする接着方法。
- 請求項5または6において、上記保持温度への昇温を昇温速度90℃/h以下で行なうことを特徴とする請求項5または6記載の接着方法。
Priority Applications (1)
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JP2004076278A JP4461858B2 (ja) | 2004-03-17 | 2004-03-17 | SiC単結晶の接着方法 |
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JP2004076278A JP4461858B2 (ja) | 2004-03-17 | 2004-03-17 | SiC単結晶の接着方法 |
Publications (2)
Publication Number | Publication Date |
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JP2005263540A JP2005263540A (ja) | 2005-09-29 |
JP4461858B2 true JP4461858B2 (ja) | 2010-05-12 |
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JP2004076278A Expired - Lifetime JP4461858B2 (ja) | 2004-03-17 | 2004-03-17 | SiC単結晶の接着方法 |
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JP (1) | JP4461858B2 (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4924200B2 (ja) * | 2007-05-22 | 2012-04-25 | トヨタ自動車株式会社 | SiC単結晶の製造装置および製造方法 |
KR101000890B1 (ko) | 2008-01-15 | 2010-12-13 | 에스케이씨 주식회사 | 대구경 고품질 탄화규소 단결정 잉곳 성장을 위한 종자정부착 방법 |
JP2010116275A (ja) * | 2008-11-11 | 2010-05-27 | Bridgestone Corp | 炭化珪素単結晶の製造方法 |
JP5071406B2 (ja) * | 2009-02-13 | 2012-11-14 | トヨタ自動車株式会社 | 溶液法によるSiC単結晶成長用種結晶の複合接着方法 |
JP4998491B2 (ja) * | 2009-02-20 | 2012-08-15 | トヨタ自動車株式会社 | SiC単結晶の接着方法及びSiC単結晶の溶液成長法 |
JP5726035B2 (ja) * | 2011-09-28 | 2015-05-27 | 京セラ株式会社 | 結晶育成装置 |
JP2015131740A (ja) * | 2014-01-10 | 2015-07-23 | 住友電気工業株式会社 | 種基板、インゴットおよびインゴットの製造方法 |
JP6593212B2 (ja) * | 2015-09-30 | 2019-10-23 | 住友電気工業株式会社 | 炭化珪素単結晶の製造方法 |
CN114248342B (zh) * | 2022-02-07 | 2023-03-31 | 东莞市志橙半导体材料有限公司 | 一种异形半导体管芯非导电保护管的制备方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4224755B2 (ja) * | 2001-10-16 | 2009-02-18 | 株式会社デンソー | 種結晶の固定方法 |
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2004
- 2004-03-17 JP JP2004076278A patent/JP4461858B2/ja not_active Expired - Lifetime
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