JP4459914B2 - インプリントリソグラフィ - Google Patents

インプリントリソグラフィ Download PDF

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Publication number
JP4459914B2
JP4459914B2 JP2006039322A JP2006039322A JP4459914B2 JP 4459914 B2 JP4459914 B2 JP 4459914B2 JP 2006039322 A JP2006039322 A JP 2006039322A JP 2006039322 A JP2006039322 A JP 2006039322A JP 4459914 B2 JP4459914 B2 JP 4459914B2
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JP
Japan
Prior art keywords
substrate
template
imprint
force
compensation
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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JP2006039322A
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English (en)
Japanese (ja)
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JP2006229232A (ja
Inventor
ヴェンデラ クルイート − シュテゲマン イボンヌ
ヴィルヘルムス アロイシウス ヤンセン ヘンリクス
ユリーフィヒ コレスニーチェンコ アレクセイ
ファン サンテン ヘルマー
Original Assignee
エーエスエムエル ネザーランズ ビー．ブイ．
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Publication of JP2006229232A publication Critical patent/JP2006229232A/ja
Application granted granted Critical
Publication of JP4459914B2 publication Critical patent/JP4459914B2/ja
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/02—Local etching
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00—Nanotechnology
    • Y10S977/84—Manufacture, treatment, or detection of nanostructure
    • Y10S977/887—Nanoimprint lithography, i.e. nanostamp

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mathematical Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Theoretical Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Micromachines (AREA)
JP2006039322A 2005-02-17 2006-02-16 インプリントリソグラフィ Expired - Fee Related JP4459914B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/155,941 US7922474B2 (en) 2005-02-17 2005-02-17 Imprint lithography

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2010003894A Division JP5249250B2 (ja) 2005-02-17 2010-01-12 インプリント方法およびインプリント装置

Publications (2)

Publication Number Publication Date
JP2006229232A JP2006229232A (ja) 2006-08-31
JP4459914B2 true JP4459914B2 (ja) 2010-04-28

Family

ID=36814864

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2006039322A Expired - Fee Related JP4459914B2 (ja) 2005-02-17 2006-02-16 インプリントリソグラフィ
JP2010003894A Expired - Fee Related JP5249250B2 (ja) 2005-02-17 2010-01-12 インプリント方法およびインプリント装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2010003894A Expired - Fee Related JP5249250B2 (ja) 2005-02-17 2010-01-12 インプリント方法およびインプリント装置

Country Status (2)

Country Link
US (1) US7922474B2 (enExample)
JP (2) JP4459914B2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010087533A (ja) * 2005-02-17 2010-04-15 Asml Netherlands Bv インプリントリソグラフィ

Families Citing this family (8)

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US20080160129A1 (en) 2006-05-11 2008-07-03 Molecular Imprints, Inc. Template Having a Varying Thickness to Facilitate Expelling a Gas Positioned Between a Substrate and the Template
US7789294B2 (en) * 2005-02-18 2010-09-07 Ebet Systems Pty Ltd System and method for monitoring a validator
JP4595120B2 (ja) * 2005-05-27 2010-12-08 独立行政法人産業技術総合研究所 裏面加圧によるインプリント方法及び装置
US7613538B2 (en) * 2006-07-24 2009-11-03 Hewlett-Packard Development Company, L.P. Compensation for distortion in contact lithography
JP2010503993A (ja) * 2006-09-19 2010-02-04 モレキュラー・インプリンツ・インコーポレーテッド リフトオフ・パターニング向けの向上したエッチング技法
US8652393B2 (en) * 2008-10-24 2014-02-18 Molecular Imprints, Inc. Strain and kinetics control during separation phase of imprint process
NL2006929A (en) 2010-08-05 2012-02-13 Asml Netherlands Bv Imprint lithography.
JP5995567B2 (ja) * 2012-07-12 2016-09-21 キヤノン株式会社 インプリント装置、それを用いた物品の製造方法

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JP3187014B2 (ja) * 1990-01-24 2001-07-11 ホーヤ株式会社 レンズ成形用型
US5512131A (en) 1993-10-04 1996-04-30 President And Fellows Of Harvard College Formation of microstamped patterns on surfaces and derivative articles
JP2691148B2 (ja) * 1995-08-22 1997-12-17 エドカ工業株式会社 シート状レンズの製法
US5772905A (en) 1995-11-15 1998-06-30 Regents Of The University Of Minnesota Nanoimprint lithography
US6518189B1 (en) 1995-11-15 2003-02-11 Regents Of The University Of Minnesota Method and apparatus for high density nanostructures
US6482742B1 (en) 2000-07-18 2002-11-19 Stephen Y. Chou Fluid pressure imprint lithography
US6309580B1 (en) 1995-11-15 2001-10-30 Regents Of The University Of Minnesota Release surfaces, particularly for use in nanoimprint lithography
US20030080471A1 (en) 2001-10-29 2003-05-01 Chou Stephen Y. Lithographic method for molding pattern with nanoscale features
US20040036201A1 (en) 2000-07-18 2004-02-26 Princeton University Methods and apparatus of field-induced pressure imprint lithography
EP1003078A3 (en) 1998-11-17 2001-11-07 Corning Incorporated Replicating a nanoscale pattern
US6334960B1 (en) 1999-03-11 2002-01-01 Board Of Regents, The University Of Texas System Step and flash imprint lithography
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US6165911A (en) 1999-12-29 2000-12-26 Calveley; Peter Braden Method of patterning a metal layer
WO2001053889A1 (en) 2000-01-21 2001-07-26 Obducat Aktiebolag A mold for nano imprinting
SE515785C2 (sv) 2000-02-23 2001-10-08 Obducat Ab Anordning för homogen värmning av ett objekt och användning av anordningen
SE515962C2 (sv) 2000-03-15 2001-11-05 Obducat Ab Anordning för överföring av mönster till objekt
SE0001367L (sv) 2000-04-13 2001-10-14 Obducat Ab Apparat och förfarande för elektrokemisk bearbetning av substrat
SE0001368L (sv) 2000-04-13 2001-10-14 Obducat Ab Apparat och förfarande för elektrokemisk bearbetning av substrat
SE516194C2 (sv) 2000-04-18 2001-12-03 Obducat Ab Substrat för samt process vid tillverkning av strukturer
US6365059B1 (en) 2000-04-28 2002-04-02 Alexander Pechenik Method for making a nano-stamp and for forming, with the stamp, nano-size elements on a substrate
SE516414C2 (sv) 2000-05-24 2002-01-15 Obducat Ab Metod vid tillverkning av en mall, samt mallen tillverkad därav
KR100862301B1 (ko) 2000-07-16 2008-10-13 보드 오브 리전츠, 더 유니버시티 오브 텍사스 시스템 임프린트 리소그래피를 위한 고분해능 오버레이 정렬 방법 및 시스템
EP2270592B1 (en) 2000-07-17 2015-09-02 Board of Regents, The University of Texas System Method of forming a pattern on a substrate
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US6964793B2 (en) * 2002-05-16 2005-11-15 Board Of Regents, The University Of Texas System Method for fabricating nanoscale patterns in light curable compositions using an electric field
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TWI277836B (en) * 2002-10-17 2007-04-01 Adv Lcd Tech Dev Ct Co Ltd Method and apparatus for forming pattern on thin-substrate or the like
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JP4317375B2 (ja) * 2003-03-20 2009-08-19 株式会社日立製作所 ナノプリント装置、及び微細構造転写方法
WO2004086471A1 (en) 2003-03-27 2004-10-07 Korea Institute Of Machinery & Materials Uv nanoimprint lithography process using elementwise embossed stamp and selectively additive pressurization
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JP4455092B2 (ja) * 2004-02-20 2010-04-21 キヤノン株式会社 加工装置及び加工方法
US7168939B2 (en) * 2004-02-26 2007-01-30 Hitachi Global Storage Technologies Netherlands Bv System, method, and apparatus for multilevel UV molding lithography for air bearing surface patterning
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010087533A (ja) * 2005-02-17 2010-04-15 Asml Netherlands Bv インプリントリソグラフィ

Also Published As

Publication number Publication date
JP5249250B2 (ja) 2013-07-31
US7922474B2 (en) 2011-04-12
US20060180952A1 (en) 2006-08-17
JP2010087533A (ja) 2010-04-15
JP2006229232A (ja) 2006-08-31

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