JP4452495B2 - スポット照明用高パワーledモジュール - Google Patents
スポット照明用高パワーledモジュール Download PDFInfo
- Publication number
- JP4452495B2 JP4452495B2 JP2003500968A JP2003500968A JP4452495B2 JP 4452495 B2 JP4452495 B2 JP 4452495B2 JP 2003500968 A JP2003500968 A JP 2003500968A JP 2003500968 A JP2003500968 A JP 2003500968A JP 4452495 B2 JP4452495 B2 JP 4452495B2
- Authority
- JP
- Japan
- Prior art keywords
- thermally conductive
- light emitting
- emitting diode
- optical module
- module according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/0005—Fastening of light sources or lamp holders of sources having contact pins, wires or blades, e.g. pinch sealed lamp
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/233—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating a spot light distribution, e.g. for substitution of reflector lamps
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
- F21V29/767—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having directions perpendicular to the light emitting axis
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
- F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/80—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with pins or wires
- F21V29/81—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with pins or wires with pins or wires having different shapes, lengths or spacing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
- H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/858—Means for heat extraction or cooling
- H10H20/8582—Means for heat extraction or cooling characterised by their shape
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V7/00—Reflectors for light sources
- F21V7/0083—Array of reflectors for a cluster of light sources, e.g. arrangement of multiple light sources in one plane
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V7/00—Reflectors for light sources
- F21V7/04—Optical design
- F21V7/041—Optical design with conical or pyramidal surface
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V7/00—Reflectors for light sources
- F21V7/04—Optical design
- F21V7/06—Optical design with parabolic curvature
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2113/00—Combination of light sources
- F21Y2113/10—Combination of light sources of different colours
- F21Y2113/13—Combination of light sources of different colours comprising an assembly of point-like light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S362/00—Illumination
- Y10S362/80—Light emitting diode
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Optics & Photonics (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US29382701P | 2001-05-26 | 2001-05-26 | |
| PCT/US2002/016750 WO2002097884A1 (en) | 2001-05-26 | 2002-05-24 | High power led module for spot illumination |
| US10/063,924 US6799864B2 (en) | 2001-05-26 | 2002-05-24 | High power LED power pack for spot module illumination |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004528698A JP2004528698A (ja) | 2004-09-16 |
| JP2004528698A5 JP2004528698A5 (enExample) | 2005-12-22 |
| JP4452495B2 true JP4452495B2 (ja) | 2010-04-21 |
Family
ID=26743954
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003500968A Expired - Lifetime JP4452495B2 (ja) | 2001-05-26 | 2002-05-24 | スポット照明用高パワーledモジュール |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US6799864B2 (enExample) |
| EP (2) | EP2241803B1 (enExample) |
| JP (1) | JP4452495B2 (enExample) |
| CN (1) | CN100524746C (enExample) |
| WO (1) | WO2002097884A1 (enExample) |
Families Citing this family (239)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
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| US6712486B1 (en) | 1999-10-19 | 2004-03-30 | Permlight Products, Inc. | Mounting arrangement for light emitting diodes |
| US6578986B2 (en) | 2001-06-29 | 2003-06-17 | Permlight Products, Inc. | Modular mounting arrangement and method for light emitting diodes |
| US6974234B2 (en) * | 2001-12-10 | 2005-12-13 | Galli Robert D | LED lighting assembly |
| CN1653297B (zh) | 2002-05-08 | 2010-09-29 | 佛森技术公司 | 高效固态光源及其使用和制造方法 |
| US6573536B1 (en) * | 2002-05-29 | 2003-06-03 | Optolum, Inc. | Light emitting diode light source |
| US20050269581A1 (en) * | 2002-05-29 | 2005-12-08 | Optolum, Inc. | Light emitting diode light source |
| USRE47011E1 (en) | 2002-05-29 | 2018-08-28 | Optolum, Inc. | Light emitting diode light source |
| US6897486B2 (en) * | 2002-12-06 | 2005-05-24 | Ban P. Loh | LED package die having a small footprint |
| JP2004265986A (ja) * | 2003-02-28 | 2004-09-24 | Citizen Electronics Co Ltd | 高輝度発光素子及びそれを用いた発光装置及び高輝度発光素子の製造方法 |
| US7528421B2 (en) * | 2003-05-05 | 2009-05-05 | Lamina Lighting, Inc. | Surface mountable light emitting diode assemblies packaged for high temperature operation |
| EP1627178B1 (en) * | 2003-05-05 | 2018-11-07 | GE Lighting Solutions, LLC | Led-based light bulb |
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| JP2000031546A (ja) * | 1998-07-08 | 2000-01-28 | Mitsubishi Electric Corp | Led集合体モジュール |
| US6429581B1 (en) * | 1998-09-10 | 2002-08-06 | Corning Incorporated | TIR lens for uniform brightness |
| US6254262B1 (en) | 1998-11-27 | 2001-07-03 | Crunk Paul D | Signaling lamp having led light array with removable plastic lens |
| US6367949B1 (en) * | 1999-08-04 | 2002-04-09 | 911 Emergency Products, Inc. | Par 36 LED utility lamp |
| US6161910A (en) * | 1999-12-14 | 2000-12-19 | Aerospace Lighting Corporation | LED reading light |
| US6160596A (en) * | 1999-12-20 | 2000-12-12 | Delphi Technologies, Inc. | Backlighting system for a liquid crystal display unit |
| DE20004105U1 (de) * | 2000-03-04 | 2000-05-31 | Zweibrüder Stahlwarenkontor GmbH, 42697 Solingen | Taschenlampe |
| US6472823B2 (en) * | 2001-03-07 | 2002-10-29 | Star Reach Corporation | LED tubular lighting device and control device |
-
2002
- 2002-05-24 WO PCT/US2002/016750 patent/WO2002097884A1/en not_active Ceased
- 2002-05-24 EP EP10171923.5A patent/EP2241803B1/en not_active Expired - Lifetime
- 2002-05-24 US US10/063,924 patent/US6799864B2/en not_active Expired - Lifetime
- 2002-05-24 JP JP2003500968A patent/JP4452495B2/ja not_active Expired - Lifetime
- 2002-05-24 CN CNB028123662A patent/CN100524746C/zh not_active Expired - Lifetime
- 2002-05-24 EP EP02739450.1A patent/EP1393374B1/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| EP1393374A1 (en) | 2004-03-03 |
| EP2241803B1 (en) | 2018-11-07 |
| CN100524746C (zh) | 2009-08-05 |
| EP2241803A3 (en) | 2016-03-23 |
| EP1393374B1 (en) | 2016-08-24 |
| EP2241803A2 (en) | 2010-10-20 |
| US20020176250A1 (en) | 2002-11-28 |
| JP2004528698A (ja) | 2004-09-16 |
| CN1518768A (zh) | 2004-08-04 |
| US6799864B2 (en) | 2004-10-05 |
| WO2002097884A1 (en) | 2002-12-05 |
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