US20110030920A1 - Heat Sink Structure - Google Patents

Heat Sink Structure Download PDF

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Publication number
US20110030920A1
US20110030920A1 US12/535,094 US53509409A US2011030920A1 US 20110030920 A1 US20110030920 A1 US 20110030920A1 US 53509409 A US53509409 A US 53509409A US 2011030920 A1 US2011030920 A1 US 2011030920A1
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United States
Prior art keywords
heat
heat dissipating
sink structure
dissipating body
heat sink
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US12/535,094
Inventor
Teng-Zhi Qin
Wen-Ji Lan
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Asia Vital Components Shenzhen Co Ltd
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Asia Vital Components Shenzhen Co Ltd
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Priority to US12/535,094 priority Critical patent/US20110030920A1/en
Assigned to Asia Vital Components (Shen Zhen) Co., Ltd. reassignment Asia Vital Components (Shen Zhen) Co., Ltd. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LAN, WEN-JI, QIN, Teng-zhi
Publication of US20110030920A1 publication Critical patent/US20110030920A1/en
Abandoned legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/06—Constructions of heat-exchange apparatus characterised by the selection of particular materials of plastics material
    • F28F21/067—Details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D7/00—Heat-exchange apparatus having stationary tubular conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall
    • F28D7/02—Heat-exchange apparatus having stationary tubular conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits being helically coiled
    • F28D7/024—Heat-exchange apparatus having stationary tubular conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits being helically coiled the conduits of only one medium being helically coiled tubes, the coils having a cylindrical configuration
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/14—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending longitudinally
    • F28F1/16—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending longitudinally the means being integral with the element, e.g. formed by extrusion
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00—Fastening; Joining
    • F28F2275/02—Fastening; Joining by using bonding materials; by embedding elements in particular materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a heat sink structure, and more particularly to a heat sink structure consisting of a heat dissipating body made of a heat-conducting plastic material and a heat pipe made of a metal material to thereby have reduce weight and material cost while providing good heat dissipating effect.
  • a light emitting diode emits cold light, and has the advantages of low power consumption, energy-saving, long service life, low pollution, no idling time, fast response speed, and high efficiency. Therefore, street lights or other lighting fixture related thereto that are usually required to provide higher illuminance will adopt high-power LEDs as their light source. By supplying higher current to the LED, a relatively high illuminance can be obtained.
  • FIGS. 1 and 2 are perspective and sectional views, respectively, of a conventional heat sink structure 1 , which has a heat dissipating body 11 made of aluminum or other single type of metal material.
  • the heat dissipating body 11 is configured as a hollow cylindrical member with a plurality of radiating fins 12 radially extended from an inner and an outer wall surface thereof.
  • the radiating fins 12 are also formed with one single type of metal material the same as the heat dissipating body 11 and are integrally formed with the heat dissipating body 11 . Since both of the heat dissipating body 11 and the radiating fins 12 are made of a metal material, the heat sink structure 1 requires relatively high material cost and is relatively heavy, which form limitations in the applicability of the heat sink structure 1 .
  • the LED module When the heat sink structure 1 is used to remove the heat produced by an LED module, the LED module is assembled to one end of the heat dissipating body 11 , so that heat produced by the LED module is absorbed by the heat dissipating body 11 and dissipated into ambient air via the heat dissipating body 11 and the radiating fins 12 .
  • the heat sink structure 1 With the heat dissipating body 11 and the radiating fins 12 being made of the same single type of metal material, the heat sink structure 1 provides relatively low heat conductivity and fails to effectively transfer the heat produced by the LED module from the end of the heat dissipating body 11 with the LED module to the other end of the heat dissipating body 11 that has a relatively low temperature.
  • the conventional heat sink structure 1 has the following disadvantages: (1) low heat conductivity; (2) high material cost; and (3) heavy in weight.
  • a primary object of the present invention is to provide a heat sink structure that has a plastic heat dissipating body with a heat pipe: embedded therein to provide high thermal conductivity and good heat dissipating efficiency.
  • Another object of the present invention is to provide a heat sink structure that has reduced overall weight compared to conventional heat sink structures of similar types.
  • a further object of the present invention is to provide a heat sink structure that can be manufactured with reduced material cost compared to conventional heat sink structures of similar types.
  • the heat sink structure includes a heat dissipating body and at least one heat pipe.
  • the heat dissipating body includes a main body having two opposite first and second end faces, and a plurality of radiating fins formed on two opposite wall surfaces of the main body to axially extend between the first and the second end face.
  • the heat dissipating body is made of a heat-conducting plastic material through injection molding, and the heat pipe is embedded in the heat dissipating body during the process of injection molding the heat dissipating body.
  • the heat pipe has a first and a second end respectively exposed from the first and second end faces of the heat dissipating body for directly contacting with a heat source, and a pipe body helically extended between the first and the second end and embedded in the heat dissipating body.
  • the heat sink structure of the present invention not only provides high thermal conductivity and good heat dissipating effect, but also has reduced weight and material cost.
  • FIG. 1 is a perspective view of a conventional heat sink structure
  • FIG. 2 is a perspective sectional view of the heat sink structure of FIG. 1 ;
  • FIG. 3 is a perspective view of a heat sink structure according to the present invention.
  • FIG. 4 is a perspective sectional view of the heat sink structure of FIG. 3 ;
  • FIG. 5 shows the heat sink structure of the present invention in use
  • FIG. 6 is a perspective sectional view of FIG. 5 ;
  • FIG. 7 is a side view of FIG. 5 .
  • a heat sink structure includes a heat dissipating body 2 and a heat pipe 3 .
  • the heat dissipating body 2 is made of a plastic material through injection molding, and can be molded into various shapes depending on actual need.
  • the plastic material for molding the heat dissipating body 2 is a heat-conducting material selected from the group consisting of Ethylon (UPE), polyoxymethylene (POM), polyethylene terephthalate (PETP), nylon, polypropylene (PP), polyethylene (PE), polyvinylidene fluoride (PVDF), Teflon (polytetrafluoroethylene or PTFE), polyvinyl chloride (PVC), Acrylonitrile Butadiene Styrene (ABS), tempered glass, polyether polyols (PES), acrylic (polymethylmethacrylate or PMMA), poly(ether-ether-ketone) (PEEK), and poly(amide-imide) (PAI).
  • Ethylon Ethylon
  • POM polyoxymethylene
  • PETP polyethylene terephthalate
  • nylon nylon
  • PP polypropylene
  • PE polyethylene
  • PVDF polyvinylidene fluoride
  • PVDF Teflon (polytetra
  • the heat dissipating body 2 is injection molded into a hollow cylinder including a main body 21 and a plurality of radiating fins 24 .
  • the main body 21 has a first end face 22 and a second end face 23 opposite to the first, end face 22 , both of which are a plane surface.
  • the radiating fins 24 are formed on an inner and an outer wall surface of the main body 21 to axially extend between the first and the second end face 22 , 23 .
  • the radiating fins 24 are also formed of a plastic material through injection molding.
  • the heat pipe 3 is embedded in the heat dissipating body 2 during the process of injection molding the heat dissipating body 2 , and includes a first end 31 , a second end 33 , and a pipe body 32 extended between the first and the second end 31 , 33 .
  • the pipe body 32 of the heat pipe 3 is helically extended between the first and the second end 31 , 33 .
  • the first and the second end 31 , 33 of the heat pipe 3 are located at and exposed from the first and the second end face 22 , 23 of the heat dissipating body 2 , respectively.
  • the heat dissipating body 2 is made of a plastic material through injection molding
  • the heat pipe 3 is made of a metal material, such as copper.
  • the material selected for the heat dissipating body 2 should have a melting point lower than that of the material for the heat pipe 3 .
  • the heat dissipating body 2 is made of a plastic material.
  • the heat dissipating body 2 is not necessarily made of a plastic material but can be made of other suitable materials.
  • the heat dissipating body 2 can be associated with an LED module 4 .
  • the LED module 4 can be attached to either the first end face 22 or the second end face 23 of the heat dissipating body 2 .
  • the LED module 4 is attached to the second end face 23 of the heat dissipating body 2 and accordingly contacts with the second end 33 of the heat pipe 3 exposed from the second end face 23 .
  • the LED module 4 produces heat during the operation thereof, the produced heat is directly absorbed by the second end 33 of the heat pipe 3 and then transferred via the pipe body 32 to the first end 31 .
  • the heat sink structure of the present invention can advantageously provide high efficient thermal conduction.
  • the heat pipe 3 made of a metal material embedded in the heat dissipating body 2 made of a heat-conducting plastic material, heat absorbed by the heat pipe 3 can be more effectively guided away from the LED module 4 and dissipated into air, and the heat sink structure can have reduced overall weight and be manufactured at reduced material cost.
  • the heat sink structure of the present invention has the following advantages: (1) having high thermal conductivity; (2) requiring only reduced material cost; and (3) being light in weight.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Geometry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A heat sink structure includes a heat dissipating body and at least one heat pipe. The heat dissipating body includes a main body having two opposite first and second end faces, and a plurality of radiating fins formed on two wall surfaces of the main body. The heat dissipating body is made of a heat-conducting plastic material through injection molding, and the heat pipe is embedded in the heat dissipating body during the process of injection molding the heat dissipating body. The heat pipe has two opposite first and second ends respectively exposed from the first and second end faces of the heat dissipating body for directly contacting with a heat source, and a pipe body helically extended between the first and second ends and embedded in the heat dissipating body. With these arrangements, the heat sink structure has reduced weight and material cost while providing good heat dissipating effect.

Description

    FIELD OF THE INVENTION
  • The present invention relates to a heat sink structure, and more particularly to a heat sink structure consisting of a heat dissipating body made of a heat-conducting plastic material and a heat pipe made of a metal material to thereby have reduce weight and material cost while providing good heat dissipating effect.
    • BACKGROUND OF THE INVENTION
  • Various kinds of electronic information products, such as computers, have become very popular among consumers and been widely applied in many different fields. Consumers' demands bring prosperous development in the electronic information industry, and all the currently commercially available electronic information products have increasingly upgraded computing speed and expanded access capacity. As a result, a high amount of heat is also produced by the electronic elements in the electronic information products when they operate at high speed.
  • A light emitting diode (LED) emits cold light, and has the advantages of low power consumption, energy-saving, long service life, low pollution, no idling time, fast response speed, and high efficiency. Therefore, street lights or other lighting fixture related thereto that are usually required to provide higher illuminance will adopt high-power LEDs as their light source. By supplying higher current to the LED, a relatively high illuminance can be obtained.
  • However, while the high-current LED provides increased illuminance, the heat produced by the LED is inevitably increased, too. The produced high amount of heat must be timely removed, lest the heat should accumulate around the LED to cause lowered lighting efficiency and even shortened LED service life. There are many electronic apparatuses that use LEDs as a main light source thereof. However, all these electronic apparatuses have the same problem of having relatively poor heat dissipation efficiency, which adversely results in burned-out apparatus due to overheating, increased light wane and shortened service life.
  • FIGS. 1 and 2 are perspective and sectional views, respectively, of a conventional heat sink structure 1, which has a heat dissipating body 11 made of aluminum or other single type of metal material. The heat dissipating body 11 is configured as a hollow cylindrical member with a plurality of radiating fins 12 radially extended from an inner and an outer wall surface thereof. The radiating fins 12 are also formed with one single type of metal material the same as the heat dissipating body 11 and are integrally formed with the heat dissipating body 11. Since both of the heat dissipating body 11 and the radiating fins 12 are made of a metal material, the heat sink structure 1 requires relatively high material cost and is relatively heavy, which form limitations in the applicability of the heat sink structure 1.
  • When the heat sink structure 1 is used to remove the heat produced by an LED module, the LED module is assembled to one end of the heat dissipating body 11, so that heat produced by the LED module is absorbed by the heat dissipating body 11 and dissipated into ambient air via the heat dissipating body 11 and the radiating fins 12. With the heat dissipating body 11 and the radiating fins 12 being made of the same single type of metal material, the heat sink structure 1 provides relatively low heat conductivity and fails to effectively transfer the heat produced by the LED module from the end of the heat dissipating body 11 with the LED module to the other end of the heat dissipating body 11 that has a relatively low temperature.
  • In brief, the conventional heat sink structure 1 has the following disadvantages: (1) low heat conductivity; (2) high material cost; and (3) heavy in weight.
  • It is therefore tried by the inventor to develop an improved heat sink structure to overcome the above disadvantages.
    • SUMMARY OF THE INVENTION
  • A primary object of the present invention is to provide a heat sink structure that has a plastic heat dissipating body with a heat pipe: embedded therein to provide high thermal conductivity and good heat dissipating efficiency.
  • Another object of the present invention is to provide a heat sink structure that has reduced overall weight compared to conventional heat sink structures of similar types.
  • A further object of the present invention is to provide a heat sink structure that can be manufactured with reduced material cost compared to conventional heat sink structures of similar types.
  • To achieve the above and other objects, the heat sink structure according to a preferred embodiment of the present invention includes a heat dissipating body and at least one heat pipe. The heat dissipating body includes a main body having two opposite first and second end faces, and a plurality of radiating fins formed on two opposite wall surfaces of the main body to axially extend between the first and the second end face. The heat dissipating body is made of a heat-conducting plastic material through injection molding, and the heat pipe is embedded in the heat dissipating body during the process of injection molding the heat dissipating body. The heat pipe has a first and a second end respectively exposed from the first and second end faces of the heat dissipating body for directly contacting with a heat source, and a pipe body helically extended between the first and the second end and embedded in the heat dissipating body.
  • With the heat dissipating body made of a heat-conducting plastic material through injection molding and the heat pipe helically embedded in the plastic heat dissipating body, the heat sink structure of the present invention not only provides high thermal conductivity and good heat dissipating effect, but also has reduced weight and material cost.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • The structure and the technical means adopted by the present invention to achieve the above and other objects can be best understood by referring to the following detailed description of the preferred embodiments and the accompanying drawings, wherein
  • FIG. 1 is a perspective view of a conventional heat sink structure;
  • FIG. 2 is a perspective sectional view of the heat sink structure of FIG. 1;
  • FIG. 3 is a perspective view of a heat sink structure according to the present invention;
  • FIG. 4 is a perspective sectional view of the heat sink structure of FIG. 3;
  • FIG. 5 shows the heat sink structure of the present invention in use;
  • FIG. 6 is a perspective sectional view of FIG. 5; and
  • FIG. 7 is a side view of FIG. 5.
    •  DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
  • Please refer to FIGS. 3 and 4. A heat sink structure according to a preferred embodiment of the present invention includes a heat dissipating body 2 and a heat pipe 3. The heat dissipating body 2 is made of a plastic material through injection molding, and can be molded into various shapes depending on actual need. The plastic material for molding the heat dissipating body 2 is a heat-conducting material selected from the group consisting of Ethylon (UPE), polyoxymethylene (POM), polyethylene terephthalate (PETP), nylon, polypropylene (PP), polyethylene (PE), polyvinylidene fluoride (PVDF), Teflon (polytetrafluoroethylene or PTFE), polyvinyl chloride (PVC), Acrylonitrile Butadiene Styrene (ABS), tempered glass, polyether polyols (PES), acrylic (polymethylmethacrylate or PMMA), poly(ether-ether-ketone) (PEEK), and poly(amide-imide) (PAI).
  • In the illustrated embodiment of the present invention, the heat dissipating body 2 is injection molded into a hollow cylinder including a main body 21 and a plurality of radiating fins 24. The main body 21 has a first end face 22 and a second end face 23 opposite to the first, end face 22, both of which are a plane surface. The radiating fins 24 are formed on an inner and an outer wall surface of the main body 21 to axially extend between the first and the second end face 22, 23. The radiating fins 24 are also formed of a plastic material through injection molding. The heat pipe 3 is embedded in the heat dissipating body 2 during the process of injection molding the heat dissipating body 2, and includes a first end 31, a second end 33, and a pipe body 32 extended between the first and the second end 31, 33.
  • In the illustrated embodiment, the pipe body 32 of the heat pipe 3 is helically extended between the first and the second end 31, 33. The first and the second end 31, 33 of the heat pipe 3 are located at and exposed from the first and the second end face 22, 23 of the heat dissipating body 2, respectively. While the heat dissipating body 2 is made of a plastic material through injection molding, the heat pipe 3 is made of a metal material, such as copper. In other words, for the heat pipe 3 to be embedded in the heat dissipating body 2, the material selected for the heat dissipating body 2 should have a melting point lower than that of the material for the heat pipe 3. In the illustrated preferred embodiment, the heat dissipating body 2 is made of a plastic material. However, it is understood, in practical implementation of the present invention, the heat dissipating body 2 is not necessarily made of a plastic material but can be made of other suitable materials.
  • Please refer to FIGS. 5, 6 and 7 at the same time. The heat dissipating body 2 can be associated with an LED module 4. The LED module 4 can be attached to either the first end face 22 or the second end face 23 of the heat dissipating body 2. In the illustrated embodiment, the LED module 4 is attached to the second end face 23 of the heat dissipating body 2 and accordingly contacts with the second end 33 of the heat pipe 3 exposed from the second end face 23. When the LED module 4 produces heat during the operation thereof, the produced heat is directly absorbed by the second end 33 of the heat pipe 3 and then transferred via the pipe body 32 to the first end 31. Since the first end 31, the pipe body 32, and the second end 33 of the heat pipe 3 are embedded in the heat dissipating body 2, the heat absorbed by the second end 33 and transferred to the pipe body 32 and the first end 31 of the heat pipe 3 can also be quickly transferred to the heat dissipating body 2 to dissipate into ambient environment. That is, the heat sink structure of the present invention can advantageously provide high efficient thermal conduction. With the heat pipe 3 made of a metal material embedded in the heat dissipating body 2 made of a heat-conducting plastic material, heat absorbed by the heat pipe 3 can be more effectively guided away from the LED module 4 and dissipated into air, and the heat sink structure can have reduced overall weight and be manufactured at reduced material cost.
  • In brief, the heat sink structure of the present invention has the following advantages: (1) having high thermal conductivity; (2) requiring only reduced material cost; and (3) being light in weight.
  • The present invention has been described with a preferred embodiment thereof and it is understood that many changes and modifications in the described embodiment can be carried out without departing from the scope and the spirit of the invention that is intended to be limited only by the appended claims.

Claims (11)

1. A heat sink structure comprising:
a heat dissipating body including a main body having a first end face and a second end face opposite to the first end face, and a plurality of radiating fins formed on the main body; and
at least one heat pipe being embedded in the main body of the heat dissipating body, and having a first end and a second end located at the first end face and the second end face of the main body of the heat dissipating body, respectively.
2. The heat sink structure as claimed in claim 1, wherein the radiating fins are formed on an outer wall surface of the main body.
3. The heat sink structure as claimed in claim 1, wherein the radiating fins are formed on an inner wall surface of the main body.
4. The heat sink structure as claimed in claim 1, wherein the heat dissipating body is made of a plastic material through injection molding, and the heat pipe is embedded in the heat dissipating body during the process of injection molding the heat dissipating body.
5. The heat sink structure as claimed in claim 1, wherein the first end of the heat pipe is exposed from the first end face of the main body of the heat dissipating body.
6. The heat sink structure as claimed in claim 1, wherein the second end of the heat pipe is exposed from the second end face of the main body of the heat dissipating body.
7. The heat sink structure as claimed in claim 1, wherein the heat pipe has a pipe body extended between the first and the second end, and the pipe body being embedded in the heat dissipating body.
8. The heat sink structure as claimed in claim 7, wherein the pipe body is helically extended between the first and the second end.
9. The heat sink structure as claimed in claim 4, wherein the plastic material for molding the heat dissipating body has thermal conductivity.
10. The heat sink structure as claimed in claim 9, wherein the plastic material has a melting point lower than that of a material selected for forming the heat pipe.
11. The heat sink structure as claimed in claim 10, wherein the plastic material is selected from the group consisting of Ethylon (UPE), polyoxymethylene (POM), polyethylene terephthalate (PETP), nylon, polypropylene (PP), polyethylene (PE), polyvinylidene fluoride (PVDF), Teflon (polytetrafluoroethylene or PTFE), polyvinyl chloride (PVC), Acrylonitrile Butadiene Styrene (ABS), tempered glass, polyether polyols (PES), acrylic (polymethylmethacrylate or PMMA), poly(ether-ether-ketone) (PEEK), and poly(amide-imide) (PAI).
US12/535,094 2009-08-04 2009-08-04 Heat Sink Structure Abandoned US20110030920A1 (en)

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CN106322131A (en) * 2016-08-19 2017-01-11 东莞市闻誉实业有限公司 Front end type LED heat dissipating lamp
CN107809878A (en) * 2016-09-08 2018-03-16 奇鋐科技股份有限公司 Water-cooling arranges structure
US10378836B2 (en) * 2016-09-26 2019-08-13 Asia Vital Components Co., Ltd. Water-cooling radiator assembly
WO2022140552A1 (en) * 2020-12-23 2022-06-30 Baltimore Aircoil Company, Inc. Hybrid heat exchanger
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