WO2012167732A1 - Heat dissipation structure for lamp body, corresponding lighting device and manufacturing method therefor - Google Patents

Heat dissipation structure for lamp body, corresponding lighting device and manufacturing method therefor Download PDF

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Publication number
WO2012167732A1
WO2012167732A1 PCT/CN2012/076563 CN2012076563W WO2012167732A1 WO 2012167732 A1 WO2012167732 A1 WO 2012167732A1 CN 2012076563 W CN2012076563 W CN 2012076563W WO 2012167732 A1 WO2012167732 A1 WO 2012167732A1
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WO
WIPO (PCT)
Prior art keywords
heat
glass casing
circuit board
conductive material
generating component
Prior art date
Application number
PCT/CN2012/076563
Other languages
French (fr)
Chinese (zh)
Inventor
蔡子丰
Original Assignee
莱姆尼斯照明(亚洲)有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 莱姆尼斯照明(亚洲)有限公司 filed Critical 莱姆尼斯照明(亚洲)有限公司
Publication of WO2012167732A1 publication Critical patent/WO2012167732A1/en

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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90Methods of manufacture
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/23Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/233Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating a spot light distribution, e.g. for substitution of reflector lamps
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00Fastening of light sources or lamp holders
    • F21V19/0005Fastening of light sources or lamp holders of sources having contact pins, wires or blades, e.g. pinch sealed lamp
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/502Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/507Cooling arrangements characterised by the adaptation for cooling of specific components of means for protecting lighting devices from damage, e.g. housings
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00Planar light sources
    • F21Y2105/10Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Definitions

  • Light-emitting body heat dissipation structure corresponding illumination device and manufacturing method thereof
  • the invention relates to the field of illuminating illumination, in particular to the field of illuminating lighting equipment and manufacturing process thereof, and particularly to a illuminating body heat dissipating structure, a corresponding illuminating device and a manufacturing method thereof.
  • lighting devices With the continuous advancement of human civilization and the continuous development of science and technology, lighting devices have long been widely known.
  • such lighting devices include a housing and a lighting component disposed within the housing.
  • LEDs have been able to provide enough light energy for lighting purposes.
  • incandescent and halogen lamps have been used in order to reduce the energy consumption of lighting and reduce carbon dioxide emissions.
  • LED light sources have been It is the trend of the times that consumers need products that can achieve the light output of incandescent or halogen lamps, have lower energy consumption and longer service life, and are cheaper.
  • many different LED products are already on the market, most of them are too expensive for the average consumer, and the product performance has not achieved the desired results.
  • LEDs need to work within a certain temperature range in order to have reasonable performance and service life. Due to the compact structure, especially the illuminating device is received in the housing, the following disadvantages exist:
  • the illuminating equipment itself consumes electric energy, and the efficiency of electro-optical conversion is not 100%. Some of the heat is always generated. Since the inside of the casing is mostly sealed, heat cannot be released in time.
  • the object of the present invention is to overcome the shortcomings of the prior art mentioned above, and to provide an efficient heat dissipation, effectively avoiding excessive temperature inside the light-emitting lamp body, energy saving, safety and environmental protection, significantly prolonging service life, practical structure, and convenient manufacturing process.
  • the light-emitting lamp body heat-dissipating structure, the corresponding lighting device and the manufacturing method thereof are fast, stable and reliable in work performance and widely applicable.
  • the heat-dissipating structure of the illuminating lamp body of the present invention the corresponding illuminating device and the manufacturing method thereof are as follows:
  • the heat-generating component is in close contact with the glass casing, and the area of the closely contacting portion is maximized.
  • the inner wall of the glass casing in the light-emitting body heat dissipation structure has a heat transfer contact portion in close contact with the heat generating member.
  • the heat transfer contact portion in the heat dissipation structure of the light-emitting body may be an annular boss, and the bottom surface of the annular boss is in close contact with the heat generating member.
  • the heat transfer contact portion of the light emitting body heat dissipation structure may also be at least two outer concave inner protrusions uniformly distributed on the edge of the glass housing, and the inner surface of each outer concave inner protrusion and the inner surface The heating parts are in close contact.
  • the glass casing in the light-emitting body heat dissipation structure is in close contact with the heat-generating component through a layer of heat-conductive material.
  • the layer of heat conductive material in the heat dissipation structure of the light body is a thermal grease layer.
  • the heat generating component in the light emitting body heat dissipating structure is a driving circuit board of the light emitting lamp body, and the driving circuit board is a metal base circuit board.
  • the metal-based circuit board in the heat-dissipating structure of the light-emitting body may have a single-sided exposed metal surface, and the one-side exposed metal surface is in close contact with the glass casing; or the metal-based circuit board is also It may have a double exposed metal surface, and one of the exposed metal faces is in close contact with the glass casing.
  • the metal-based circuit board in the heat-dissipating structure of the light-emitting body is an aluminum-based circuit board.
  • the space between the metal-based circuit board and the glass housing in the heat-dissipating structure of the light-emitting body is filled with a heat-conducting material body, and the heat-conducting material body is in close contact with the metal-based circuit board and the glass housing, respectively. .
  • the heat conductive material body in the light emitting body heat dissipation structure is a heat conductive silica gel filled in a space provided between the metal base circuit board and the glass case.
  • the rear portion of the glass casing in the heat dissipation structure of the illuminating lamp body is further provided with a lamp holder, and the thermal conductive silicone and the lamp holder are filled with an epoxy resin potting material.
  • the material of the socket in the heat dissipation structure of the light body may be an engineering plastic or a ceramic material.
  • the metal base circuit board in the heat dissipation structure of the light emitting body is further fixed with a metal power supply pin perpendicular to the surface of the metal base circuit board, and the metal power supply guide pin penetrates through the heat conductive material body and The body of thermally conductive material is in intimate contact.
  • the material of the metal power supply pin in the heat dissipation structure of the light body is brass, and the content of copper is at least 59%.
  • the metal power supply pin surface of the light emitting body heat dissipation structure is further covered with an insulating sleeve, and the metal power supply pin is in close contact with the heat conductive material body through the insulating sleeve, and the insulating sleeve is Thermally conductive material.
  • the insulating sleeve in the heat dissipation structure of the light body may be a liquid crystal polymer LCP, polyphenylene sulfide PPS, nylon PA66 or nylon PA46.
  • the light-emitting element included in the light-emitting lamp body in the light-emitting body of the light-emitting body is a light-emitting diode LED.
  • the light emitting diode LED in the heat dissipation structure of the light emitting body may be a patch light emitting LED component, the patch light emitting LED component is attached to the driving circuit board; or the light emitting diode LED may also be an integrated LED module.
  • the integrated LED module is fixedly disposed on the driving circuit board.
  • a space between the heat-generating component and the glass casing in the heat-dissipating structure of the light-emitting lamp body is filled with a heat-conducting material body, and the heat-conducting material body is in close contact with the heat-generating component and the glass casing, respectively.
  • the heat conductive material body in the heat radiating structure of the light emitting body is a heat conductive silica gel filled in a space provided between the heat generating component and the glass casing.
  • the rear portion of the glass casing in the heat dissipation structure of the illuminating lamp body is further provided with a lamp holder, and the thermal conductive silicone and the lamp holder are filled with an epoxy resin potting material.
  • the material of the socket in the heat dissipation structure of the light body may be an engineering plastic or a ceramic material.
  • the illuminating device having the above-mentioned heat dissipating structure is characterized in that: the front end of the glass casing is provided with a condensing and refracting lens, and the position of the condensing and refracting lens and the illuminating light in the illuminating lamp body The components correspond.
  • the condensing and refracting lens in the illuminating device is fixedly bonded to the front end of the glass casing by a photo-curable resin adhesive layer.
  • the method of manufacturing the above lighting device characterized in that the method comprises the following steps:
  • a condensing and refracting lens is attached to the front end of the glass casing, and the position of the condensing and refracting lens corresponds to the illuminating element included in the illuminating lamp body.
  • the method of manufacturing the illuminating device is such that the glass casing is in close contact with the heat generating component, and the method comprises the following steps: (21) injecting the heat conductive material into the space between the heat generating component and the glass casing through the opening at the rear end of the glass casing (22) forming a layer of thermally conductive material between the glass casing and the contact surface of the heat generating component;
  • the step (23) in the method of manufacturing the lighting device further includes the following steps:
  • the sealing of the opening at the rear end of the glass casing in the method of manufacturing the lighting device comprises the steps of: (241) inserting a plug into the heat conductive material injected into the space between the heat generating component and the glass casing, and plugging the opening of the rear end of the glass casing;
  • installing the heat generating component in the glass casing in an assembly jig includes the following steps:
  • the glass casing is sleeved outside the driving circuit board, and the metal power guiding pin penetrates the glass casing and is in close electrical contact with the conductive contact end provided at the rear end of the glass casing.
  • the step (21) in the method of manufacturing the lighting device further comprises the following steps:
  • the condensing refractive lens is mounted on the front end of the glass casing, and the method includes the following steps:
  • the light-emitting body heat-dissipating structure of the invention, the corresponding illuminating device and the manufacturing method thereof are used, and since the glass is used as the main material of the casing of the illuminating lamp body, it is not only cheap and economical, but also capable of both insulation and heat transfer.
  • the heat dissipation structure can ensure that the glass shell and the heat-generating component have the largest possible contact area, thereby becoming the main heat load transmission path, and the thermal conductive silicone potting can ensure efficient heat transfer, and the heat transfer effect is simpler than that of the simple air.
  • the drive circuit board uses a metal-based circuit board, which further improves the efficiency of heat transfer, thereby achieving efficient heat dissipation, effectively avoiding excessive temperature inside the light-emitting lamp body, saving energy, safety and environmental protection, due to the lamp
  • the body can maintain a relatively low temperature under long working conditions, thus significantly prolonging the service life, and the structure is simple and practical, the manufacturing process is convenient and quick, the work performance is stable and reliable, and the scope of application is wide, and it is carried out for people's work and life. It has come a lot of convenience.
  • Figure la is an internal perspective view of the heat dissipation structure of the light-emitting lamp body of the present invention.
  • Figure 1b is a longitudinal cross-sectional view of the light-emitting body heat dissipation structure of the present invention from another direction.
  • FIGS. 2a and 2b are schematic views showing two specific forms of a glass casing of the heat dissipation structure of the light-emitting lamp body of the present invention.
  • 3a and 3b are schematic views showing the structure of a driving circuit board in the heat dissipation structure of the light-emitting lamp body of the present invention.
  • FIG. 4 is a schematic view showing the overall structure of a lighting device of the present invention.
  • 5a to 5h are schematic views showing respective steps of an assembly process of a method of manufacturing a lighting device of the present invention. detailed description
  • the illuminating body heat dissipation structure includes:
  • the heat generating component 2 and the glass casing 1 are in close contact with each other, and the area of the portions in close contact with each other is maximized.
  • the inner wall of the glass casing 1 has a heat transfer contact portion 11 , and the heat transfer contact portion 11 is in close contact with the heat generating component 2; the heat transfer contact portion 11 can be at least two forms:
  • Fig. 2a which is an annular boss
  • the bottom surface of the annular boss is in close contact with the heat generating component 2; the structure is easy to manufacture and more durable;
  • FIG. 2b is at least two concave inner protrusions 12 uniformly distributed on the edge of the glass casing 1, and the inner surface of each of the concave inner protrusions 12 is
  • the heat generating component 2 is in close contact with each other. This structure not only increases the contact area with the heat generating component 2, but also increases the area in which the glass casing 1 is in contact with the outside air, improves the heat dissipation effect, and also saves raw materials.
  • the glass casing 1 in the heat dissipation structure of the illuminating lamp body can be in close contact with the heat generating component 2 through the heat conductive material layer 3, which can further improve the heat transfer effect, and the contact surface
  • the thermally conductive material layer 3 may be a thermally conductive silicone layer 3, or other materials that can provide a desired close contact effect and have good thermal conductivity.
  • the heat generating component 2 in the heat dissipation structure of the light emitting lamp body is the driving circuit board 2 of the light emitting lamp body,
  • the drive circuit board 2 is a metal base circuit board 2.
  • the metal-based circuit board 2 in the heat-dissipating structure of the light-emitting lamp body may have a single-sided exposed metal surface 21, and the one-side dew
  • the metal surface 21 is in close contact with the heat transfer contact portion 11 on the inner wall of the glass casing 1; or the metal base circuit board 2 may have a metal surface on both sides, and one side of the metal surface is exposed.
  • the metal surface 21 is in close contact with the heat transfer contact portion 11 on the inner wall of the glass casing 1; in order to obtain a good heat conduction effect and light weight, the metal base circuit board 2 may be an aluminum base circuit board 2 Of course, other suitable metal materials can also be used.
  • the space between the metal-based circuit board 2 and the glass housing 1 in the heat-dissipating structure of the light-emitting body is further filled with a heat-conducting material body 4, and the heat-conductive material body 4
  • the metal-based circuit board 2 and the glass housing 1 are in close contact with each other.
  • the heat conductive material body 4 in the heat dissipation structure of the light-emitting body can be filled and disposed on the metal-based circuit board 2
  • the rear portion of the glass casing 1 in the heat-dissipating structure of the light-emitting body is further provided with a lamp holder 5, and the heat-conductive silicone rubber 4 and the lamp holder 5 are filled with an epoxy resin potting material 51.
  • the lamp holder 5 in the heat dissipation structure of the illuminating lamp body may be integrated with the glass case 1 or may be a part detachable from the glass case 1.
  • the material of the lamp holder 5 may be engineering plastic or ceramic material. It can be other suitable materials.
  • a metal power supply lead pin 6 perpendicular to the surface of the metal base circuit board 2 is fixedly disposed on the metal base circuit board 2 in the heat dissipation structure of the light emitting lamp body, and the metal power supply guide pin 6 penetrates through the heat conductive material body. 4 and in close contact with the body 4 of thermal conductive material; in a specific embodiment of the invention, the material of the metal power supply pin 6 is brass, wherein the content of copper is at least 59%.
  • the surface of the metal power supply pin 6 is further covered with an insulating sleeve 61, and the metal power supply pin 6 is in close contact with the heat conductive material body 4 through the insulating sleeve 61, the insulation
  • the material of the sleeve is a heat conductive material;
  • the insulating sleeve may be a liquid crystal polymer LCP, polyphenylene sulfide PPS, nylon PA66 or nylon PA46, wherein:
  • Liquid Crystal Polymer (LCP) – is a new type of polymer material that generally exhibits liquid crystallinity in the molten state.
  • Nylon-66 also known as polyamide-66, polyhexamethylene adipamide, its outstanding features are tough, wear-resistant, oil-resistant, water-resistant, anti-enzytic, but absorbent, suitable for production General mechanical parts, wear-reducing parts, transmission parts, and chemical, electrical, instrumentation and other parts;
  • Nylon-46 (PA46) also known as polyamide-46, which is polyadipyldiamine, its outstanding feature is High crystallinity, high temperature resistance, high rigidity, high strength.
  • PA46 polyamide-46
  • the light-emitting elements in the light-emitting lamp body in the light-emitting body of the light-emitting body may be light-emitting diodes LED 7 or other high-efficiency light.
  • the light-emitting diode LED 7 in the heat-dissipating structure of the light-emitting body may be a patch-emitting LED element 7, and the patch-emitting LED element 7 is attached to the On the driving circuit board 2; or the LEDs 7 can also be an integrated LED module, the integrated LED module is fixedly disposed on the driving circuit board, so that a better heat dissipation effect can be obtained.
  • the heat-generating component in the heat-dissipating structure of the light-emitting lamp body is in a space between the heat-generating component and the glass casing 1 without using a metal-based circuit board and other forms. It is still possible to fill the body 4 with a heat-conducting material 4 which is in close contact with the heat-generating component and the glass casing 1, respectively.
  • the heat conductive material body 4 in the heat dissipation structure of the light emitting body is filled with the heat conductive silicone 4 disposed in the space between the heat generating component and the glass housing 1; the rear portion of the glass housing 1 is further provided with the lamp holder 5
  • the thermal conductive silicone 4 and the lamp holder 5 are filled with an epoxy resin potting material 51; the material of the lamp holder 5 may be an engineering plastic or a ceramic material.
  • the illumination device having the above-mentioned heat dissipation structure, wherein the front end of the glass casing 1 is provided with a condensing and refracting lens 8, and the concentrating light
  • the position of the refractive lens 8 corresponds to the light-emitting element included in the light-emitting lamp body; the light-condensing refractive lens 8 is fixedly bonded to the front end of the glass casing 1 by a photo-curable resin adhesive layer.
  • the method of manufacturing the above lighting device includes the following steps:
  • Locating the heat generating component 2 in the glass housing 1 in the assembly jig 9, comprising the steps of: (a) locating the driving circuit board 2 in an assembly jig, and (b) arranging the glass housing 1 outside the driving circuit board 2, and causing the metal power supply pin 6 to penetrate the glass housing 1 and The conductive contact end provided at the rear end of the glass casing 1 is in close electrical contact;
  • the present invention mainly uses very inexpensive glass as the main constituent material of the lamp, and at the same time functions as an insulating and heat conductor material, and at the same time maximizes the contact area of the glass and the metal-based circuit board as the main heat load transfer.
  • thermal silica gel potting is used as an auxiliary route to ensure complete heat transfer.
  • the metal-based circuit board has the LED light-emitting element circuit and the driving circuit disposed on one side, so that the metal-based circuit board can dissipate the heat generated by the LED light-emitting element circuit and the driving circuit, thereby obtaining the maximum
  • the contact area is in contact with the surface of the glass envelope.
  • the thermal grease is placed on the bonding surface of the glass casing and the metal-based circuit board to ensure the continuity of heat conduction throughout the contact surface;
  • the metal power supply pin has two functions, one function is to connect the power from the lamp holder, and One effect is to further conduct heat from the metal-based board directly to the thermally conductive silicone or epoxy potting and then to the glass housing and air.
  • the illumination device using the heat dissipation structure of the light-emitting body of the present invention can realize an effective heat management function, so that a glass lamp, such as a GUI 0 LED spotlight, consumes 2 to 4 iL of energy, but the output light energy is equivalent to 50 watts.
  • the GU10 halogen lamp saves 90% of its energy consumption.
  • the heat dissipation structure can ensure that the glass casing 1 and the heat generating component 2 have the largest possible contact area, thereby becoming the main heat load transmission path, and the thermal conductive silicone potting can ensure efficient heat transfer and heat transfer than pure air.
  • the effect is significantly improved; not only that, the driving circuit board 2 uses the metal-based circuit board 2, further improving the efficiency of heat transfer, thereby achieving efficient heat dissipation, effectively avoiding excessive temperature inside the light-emitting lamp body, saving energy, safety and environmental protection.
  • the lamp body can maintain a relatively low temperature under long working conditions, the service life is significantly prolonged, and the structure is simple and practical, the manufacturing process is convenient and quick, the work performance is stable and reliable, and the scope of application is wide, for people's work and Life has brought great convenience.

Abstract

A heat dissipation structure for a lamp body comprising a glass shell (1) and a heat-radiating component (2) arranged within said glass shell (1), said heat-radiating component (2) being in close contact with the glass shell (1), and the area of those parts being in such close contact being maximized. A lighting device having the present heat dissipation structure is also disclosed. Use of the present lamp heat dissipation structure and the corresponding lighting device is economical and achieves the dual purposes of insulation and heat transfer; ensuring that the contact area between the glass shell and the heat-radiating component is maximized to the greatest possible extent ensures that said area serves as the main path for transferring heat load, while the seal of heat-conducting thermal silicone ensures high-efficiency heat transfer. A metal-based circuit board further improves heat-transfer efficiency and effectively averts overheating inside the lamp body. The present structure is energy-saving, safe and environment-friendly, provides extended service life, is structurally simple, fast and convenient to manufacture, and stable and reliable in working performance.

Description

发光灯体散热结构、 相应的照明装置及其制造方法 技术领域  Light-emitting body heat dissipation structure, corresponding illumination device and manufacturing method thereof
本发明涉及发光照明领域, 特别涉及发光照明器材及其制造工艺领域, 具体是指一种发 光灯体散热结构、 相应的照明装置及其制造方法。  The invention relates to the field of illuminating illumination, in particular to the field of illuminating lighting equipment and manufacturing process thereof, and particularly to a illuminating body heat dissipating structure, a corresponding illuminating device and a manufacturing method thereof.
背景技术 Background technique
随着人类文明的不断进步以及科学技术的不断发展, 照明装置早已广为人知。 总的说来, 这类照明装置包括壳体和设置在所述壳体内的发光部件。  With the continuous advancement of human civilization and the continuous development of science and technology, lighting devices have long been widely known. In general, such lighting devices include a housing and a lighting component disposed within the housing.
随着技术的进步, LED已经能够提供足够的光能用于照明用途, 为了减少照明的能源消 耗, 减少二氧化碳的排放, 为推动替代光源市场的不断前进, 用 LED光源取代白炽灯和卤素 灯已经是大势所趋, 消费者所需要的是能够达到白炽灯或卤素灯的光量输出、 同时具有更低 的能耗和更长的使用寿命、物美价廉的产品。虽然市场上已经有许多不同的 LED产品在推出, 但其中大多数对一般消费者来说太过于昂贵, 而且产品性能并没有达到预期效果。  With the advancement of technology, LEDs have been able to provide enough light energy for lighting purposes. In order to reduce the energy consumption of lighting and reduce carbon dioxide emissions, in order to promote the continuous advancement of the alternative light source market, replacing incandescent and halogen lamps with LED light sources has been It is the trend of the times that consumers need products that can achieve the light output of incandescent or halogen lamps, have lower energy consumption and longer service life, and are cheaper. Although many different LED products are already on the market, most of them are too expensive for the average consumer, and the product performance has not achieved the desired results.
但是, LED需要在一定的温度范围内工作才能有合理的性能和使用寿命, 由于结构紧凑, 尤其发光器材被接纳于壳体内, 因此存在以下缺点:  However, LEDs need to work within a certain temperature range in order to have reasonable performance and service life. Due to the compact structure, especially the illuminating device is received in the housing, the following disadvantages exist:
发光器材本身消耗电能, 而且电光转换的效率不会是 100 % , 总会有一部分变成热能产 生出来, 由于壳体内部大多为密封状态, 热量无法及时散发出来。  The illuminating equipment itself consumes electric energy, and the efficiency of electro-optical conversion is not 100%. Some of the heat is always generated. Since the inside of the casing is mostly sealed, heat cannot be released in time.
因此, 整个灯的散热问题一直是技术上的瓶颈, 虽然 LED本身技术有所进步, 可以在更 高的温度工作, 但总是希望能够进一步确保更好的光输出量和使用寿命, 因此如何降低灯本 身的温度, 使其有良好的散热结构一直是摆在人们面前亟待解决的问题。 发明内容  Therefore, the heat dissipation problem of the entire lamp has always been a technical bottleneck. Although the technology of the LED itself has improved and can work at a higher temperature, it is always desirable to further ensure a better light output and service life, so how to reduce it The temperature of the lamp itself, so that it has a good heat dissipation structure has always been a problem that needs to be solved in front of people. Summary of the invention
本发明的目的是克服了上述现有技术中的缺点, 提供一种能够实现高效散热、 有效避免 发光灯体内部温度过高、 节能安全环保、 显著延长使用寿命、 结构筒单实用、 制造过程方便 快捷、 工作性能稳定可靠、 适用范围较为广泛的发光灯体散热结构、 相应的照明装置及其制 造方法。  The object of the present invention is to overcome the shortcomings of the prior art mentioned above, and to provide an efficient heat dissipation, effectively avoiding excessive temperature inside the light-emitting lamp body, energy saving, safety and environmental protection, significantly prolonging service life, practical structure, and convenient manufacturing process. The light-emitting lamp body heat-dissipating structure, the corresponding lighting device and the manufacturing method thereof are fast, stable and reliable in work performance and widely applicable.
为了实现上述的目的, 本发明的发光灯体散热结构、相应的照明装置及其制造方法如下: 该发光灯体散热结构, 包括:  In order to achieve the above object, the heat-dissipating structure of the illuminating lamp body of the present invention, the corresponding illuminating device and the manufacturing method thereof are as follows:
- 玻璃壳体, 以及 - 设置于玻璃壳体中的发热部件; - glass housing, and - a heat generating component disposed in the glass housing;
其主要特点是,  Its main feature is that
所述的发热部件与玻璃壳体之间相紧密接触, 且相紧密接触的部分的面积最大化。 该发光灯体散热结构中的玻璃壳体内壁上具有传热接触部, 该传热接触部与所述的发热 部件相紧密接触。  The heat-generating component is in close contact with the glass casing, and the area of the closely contacting portion is maximized. The inner wall of the glass casing in the light-emitting body heat dissipation structure has a heat transfer contact portion in close contact with the heat generating member.
该发光灯体散热结构中的传热接触部可以为环形凸台, 该环形凸台的底面与所述的发热 部件相紧密接触。  The heat transfer contact portion in the heat dissipation structure of the light-emitting body may be an annular boss, and the bottom surface of the annular boss is in close contact with the heat generating member.
该发光灯体散热结构中的传热接触部也可以为环形均匀分布于该玻璃壳体边缘上的至少 二个外凹内凸体, 且每个外凹内凸体的内表面与所述的发热部件相紧密接触。  The heat transfer contact portion of the light emitting body heat dissipation structure may also be at least two outer concave inner protrusions uniformly distributed on the edge of the glass housing, and the inner surface of each outer concave inner protrusion and the inner surface The heating parts are in close contact.
该发光灯体散热结构中的玻璃壳体通过导热材料层与所述的发热部件相紧密接触。 该发光灯体散热结构中的导热材料层为导热硅脂层。  The glass casing in the light-emitting body heat dissipation structure is in close contact with the heat-generating component through a layer of heat-conductive material. The layer of heat conductive material in the heat dissipation structure of the light body is a thermal grease layer.
该发光灯体散热结构中的发热部件为发光灯体的驱动电路板, 所述的驱动电路板为金属 基电路板。  The heat generating component in the light emitting body heat dissipating structure is a driving circuit board of the light emitting lamp body, and the driving circuit board is a metal base circuit board.
该发光灯体散热结构中的金属基电路板可以具有单侧棵露金属面, 所述的单侧棵露金属 面与所述的玻璃壳体相紧密接触; 或者所述的金属基电路板也可以具有双侧棵露金属面, 且 其中一侧棵露金属面与所述的玻璃壳体相紧密接触。  The metal-based circuit board in the heat-dissipating structure of the light-emitting body may have a single-sided exposed metal surface, and the one-side exposed metal surface is in close contact with the glass casing; or the metal-based circuit board is also It may have a double exposed metal surface, and one of the exposed metal faces is in close contact with the glass casing.
该发光灯体散热结构中的金属基电路板为铝基电路板。  The metal-based circuit board in the heat-dissipating structure of the light-emitting body is an aluminum-based circuit board.
该发光灯体散热结构中的金属基电路板与玻璃壳体之间的空间中填充设置有导热材料 体, 所述的导热材料体分别与所述的金属基电路板和玻璃壳体均紧密接触。  The space between the metal-based circuit board and the glass housing in the heat-dissipating structure of the light-emitting body is filled with a heat-conducting material body, and the heat-conducting material body is in close contact with the metal-based circuit board and the glass housing, respectively. .
该发光灯体散热结构中的导热材料体为填充设置于金属基电路板与玻璃壳体之间的空间 中的导热硅胶。  The heat conductive material body in the light emitting body heat dissipation structure is a heat conductive silica gel filled in a space provided between the metal base circuit board and the glass case.
该发光灯体散热结构中的玻璃壳体的后部还结合设置有灯座, 所述的导热硅胶与灯座之 间填充有环氧树脂灌封物。  The rear portion of the glass casing in the heat dissipation structure of the illuminating lamp body is further provided with a lamp holder, and the thermal conductive silicone and the lamp holder are filled with an epoxy resin potting material.
该发光灯体散热结构中的灯座的材料可以为工程塑料或者陶瓷材料。  The material of the socket in the heat dissipation structure of the light body may be an engineering plastic or a ceramic material.
该发光灯体散热结构中的金属基电路板上还固定设置有垂直于该金属基电路板表面的金 属电源导针, 所述的金属电源导针贯穿于所述的导热材料体中且与该导热材料体紧密接触。  The metal base circuit board in the heat dissipation structure of the light emitting body is further fixed with a metal power supply pin perpendicular to the surface of the metal base circuit board, and the metal power supply guide pin penetrates through the heat conductive material body and The body of thermally conductive material is in intimate contact.
该发光灯体散热结构中的金属电源导针的材料为黄铜, 其中铜的含量至少为 59 %。 该发光灯体散热结构中的金属电源导针表面还包覆有绝缘套管, 所述的金属电源导针通 过该绝缘套管与所述的导热材料体紧密接触, 所述的绝缘套管为导热材料。 该发光灯体散热结构中的绝缘套管可以为液晶聚合物 LCP、 聚苯硫醚 PPS、 尼龙 PA66 或者尼龙 PA46。 The material of the metal power supply pin in the heat dissipation structure of the light body is brass, and the content of copper is at least 59%. The metal power supply pin surface of the light emitting body heat dissipation structure is further covered with an insulating sleeve, and the metal power supply pin is in close contact with the heat conductive material body through the insulating sleeve, and the insulating sleeve is Thermally conductive material. The insulating sleeve in the heat dissipation structure of the light body may be a liquid crystal polymer LCP, polyphenylene sulfide PPS, nylon PA66 or nylon PA46.
该发光灯体散热结构中的发光灯体中所具有的发光元件为发光二极管 LED。  The light-emitting element included in the light-emitting lamp body in the light-emitting body of the light-emitting body is a light-emitting diode LED.
该发光灯体散热结构中的发光二极管 LED可以为贴片发光 LED元件, 所述的贴片发光 LED元件贴设于所述的驱动电路板上; 或者发光二极管 LED也可以为集成 LED模块, 所述 的集成 LED模块固定设置于所述的驱动电路板上。  The light emitting diode LED in the heat dissipation structure of the light emitting body may be a patch light emitting LED component, the patch light emitting LED component is attached to the driving circuit board; or the light emitting diode LED may also be an integrated LED module. The integrated LED module is fixedly disposed on the driving circuit board.
另一方面, 该发光灯体散热结构中的发热部件与玻璃壳体之间的空间中填充设置有导热 材料体, 所述的导热材料体分别与所述的发热部件和玻璃壳体均紧密接触。  On the other hand, a space between the heat-generating component and the glass casing in the heat-dissipating structure of the light-emitting lamp body is filled with a heat-conducting material body, and the heat-conducting material body is in close contact with the heat-generating component and the glass casing, respectively. .
该发光灯体散热结构中的导热材料体为填充设置于发热部件与玻璃壳体之间的空间中的 导热硅胶。  The heat conductive material body in the heat radiating structure of the light emitting body is a heat conductive silica gel filled in a space provided between the heat generating component and the glass casing.
该发光灯体散热结构中的玻璃壳体的后部还结合设置有灯座, 所述的导热硅胶与灯座之 间填充有环氧树脂灌封物。  The rear portion of the glass casing in the heat dissipation structure of the illuminating lamp body is further provided with a lamp holder, and the thermal conductive silicone and the lamp holder are filled with an epoxy resin potting material.
该发光灯体散热结构中的灯座的材料可以为工程塑料或者陶瓷材料。  The material of the socket in the heat dissipation structure of the light body may be an engineering plastic or a ceramic material.
该具有上述的散热结构的照明装置, 其主要特点是, 所述的玻璃壳体前端设置有聚光折 射透镜, 所述的聚光折射透镜的位置与所述的发光灯体中所具有的发光元件相对应。  The illuminating device having the above-mentioned heat dissipating structure is characterized in that: the front end of the glass casing is provided with a condensing and refracting lens, and the position of the condensing and refracting lens and the illuminating light in the illuminating lamp body The components correspond.
该照明装置中的聚光折射透镜通过光硬化树脂粘合层固定粘接于所述的玻璃壳体前端。 该制造上述的照明装置的方法, 其特征在于, 所述的方法包括以下步骤:  The condensing and refracting lens in the illuminating device is fixedly bonded to the front end of the glass casing by a photo-curable resin adhesive layer. The method of manufacturing the above lighting device, characterized in that the method comprises the following steps:
( 1 )在装配夹具中将所述的发热部件安设于所述的玻璃壳体中;  (1) arranging the heat generating component in the glass casing in an assembly jig;
( 2 )使得该玻璃壳体与发热部件相紧密接触;  (2) bringing the glass casing into close contact with the heat generating component;
( 3 )将聚光折射透镜装设于所述的玻璃壳体的前端, 且使得该聚光折射透镜的位置与所 述的发光灯体中所具有的发光元件相对应。  (3) A condensing and refracting lens is attached to the front end of the glass casing, and the position of the condensing and refracting lens corresponds to the illuminating element included in the illuminating lamp body.
该制造照明装置的方法中的使得该玻璃壳体与发热部件相紧密接触, 包括以下步骤: ( 21 )将导热材料通过该玻璃壳体后端的开口注入发热部件与玻璃壳体之间的空间中; ( 22 )使得所述的玻璃壳体与所述的发热部件的接触面之间形成导热材料层;  The method of manufacturing the illuminating device is such that the glass casing is in close contact with the heat generating component, and the method comprises the following steps: (21) injecting the heat conductive material into the space between the heat generating component and the glass casing through the opening at the rear end of the glass casing (22) forming a layer of thermally conductive material between the glass casing and the contact surface of the heat generating component;
( 23 )等待所述的发热部件与玻璃壳体之间的空间中的导热材料凝固形成导热材料体, 且使得该导热材料体分别与所述的玻璃壳体和发热部件均紧密接触。  (23) waiting for the heat conductive material in the space between the heat generating component and the glass casing to solidify to form a heat conductive material body, and the heat conductive material body is in close contact with the glass shell and the heat generating component, respectively.
该制造照明装置的方法中的步骤(23 ) 中还包括以下步骤:  The step (23) in the method of manufacturing the lighting device further includes the following steps:
( 24 )将玻璃壳体后端的开口塞紧密封。  (24) Plug the opening at the rear end of the glass casing tightly.
该制造照明装置的方法中的将玻璃壳体后端的开口塞紧密封, 包括以下步骤: ( 241 )使用塞子插入在发热部件与玻璃壳体之间的空间中所注入的导热材料中, 并将玻 璃壳体后端的开口塞紧; The sealing of the opening at the rear end of the glass casing in the method of manufacturing the lighting device comprises the steps of: (241) inserting a plug into the heat conductive material injected into the space between the heat generating component and the glass casing, and plugging the opening of the rear end of the glass casing;
( 242 )等待该塞子固结于所述的导热材料凝固所形成的导热材料体中,从而将玻璃壳体 后端密封。  (242) waiting for the plug to be fixed in the heat conductive material body formed by solidification of the heat conductive material, thereby sealing the rear end of the glass casing.
该制造照明装置的方法中的在装配夹具中将所述的发热部件安设于所述的玻璃壳体中, 包括以下步骤:  In the method of manufacturing a lighting device, installing the heat generating component in the glass casing in an assembly jig includes the following steps:
( 11 )将所述的驱动电路板卡设于装配夹具中, 且使得所述的金属电源导针朝外;  (11) locating the driving circuit board in the assembly jig, and causing the metal power supply pin to face outward;
( 12 )将所述的玻璃壳体套设于该驱动电路板外, 且使得金属电源导针贯穿该玻璃壳体, 并与该玻璃壳体后端所设置的导电触端相紧密电接触。  (12) The glass casing is sleeved outside the driving circuit board, and the metal power guiding pin penetrates the glass casing and is in close electrical contact with the conductive contact end provided at the rear end of the glass casing.
该制造照明装置的方法中的步骤(21 )之后还包括以下步骤:  The step (21) in the method of manufacturing the lighting device further comprises the following steps:
( 211 )使得所述的金属电源导针贯穿于所述的导热材料中且与该导热材料紧密接触。 该制造照明装置的方法中的将聚光折射透镜装设于所述的玻璃壳体的前端, 包括以下步 骤:  (211) causing the metal power guide pin to penetrate through the heat conductive material and in close contact with the heat conductive material. In the method of manufacturing a lighting device, the condensing refractive lens is mounted on the front end of the glass casing, and the method includes the following steps:
( 41 )将所述的装配夹具翻转, 使得该玻璃壳体的前端朝上;  (41) inverting the assembly jig such that the front end of the glass casing faces upward;
( 42 )在聚光折射透镜与玻璃壳体的前端的接触面上涂覆光硬化树脂层;  (42) coating a photocurable resin layer on a contact surface of the condensing refractive lens and the front end of the glass casing;
( 43 )将聚光折射透镜放置于所述的玻璃壳体的前端对应位置上;  (43) placing a condensing and refracting lens at a corresponding position on the front end of the glass casing;
( 44 )使用紫外线对该聚光折射透镜与玻璃壳体的粘合位置进行照射, 直至该光硬化树 脂层完全固化。  (44) The position where the condensing refractive lens is bonded to the glass casing is irradiated with ultraviolet rays until the photo-curable resin layer is completely cured.
釆用了该发明的发光灯体散热结构、 相应的照明装置及其制造方法, 由于其中使用玻璃 作为发光灯体的壳体的主要材料, 不仅廉价经济, 而且能够起到绝缘和热传递的双重作用; 同时该散热结构中能够确保玻璃壳体与发热部件具有尽可能大的接触面积, 从而成为主要热 负荷传递途径, 而导热硅胶灌封能够确保高效传热, 比单纯的空气传热的效果有了显著的提 高; 不仅如此, 该驱动电路板釆用金属基电路板, 进一步提高了热传递的效率, 从而实现了 高效散热, 有效避免发光灯体内部温度过高, 节能安全环保, 由于灯体长时间工作状态下能 够保持相对较低的温度, 因此显著延长了使用寿命, 而且结构筒单实用, 制造过程方便快捷, 工作性能稳定可靠, 适用范围较为广泛, 为人们的工作和生活都带来了很大的便利。 附图说明  The light-emitting body heat-dissipating structure of the invention, the corresponding illuminating device and the manufacturing method thereof are used, and since the glass is used as the main material of the casing of the illuminating lamp body, it is not only cheap and economical, but also capable of both insulation and heat transfer. At the same time, the heat dissipation structure can ensure that the glass shell and the heat-generating component have the largest possible contact area, thereby becoming the main heat load transmission path, and the thermal conductive silicone potting can ensure efficient heat transfer, and the heat transfer effect is simpler than that of the simple air. Not only that, the drive circuit board uses a metal-based circuit board, which further improves the efficiency of heat transfer, thereby achieving efficient heat dissipation, effectively avoiding excessive temperature inside the light-emitting lamp body, saving energy, safety and environmental protection, due to the lamp The body can maintain a relatively low temperature under long working conditions, thus significantly prolonging the service life, and the structure is simple and practical, the manufacturing process is convenient and quick, the work performance is stable and reliable, and the scope of application is wide, and it is carried out for people's work and life. It has come a lot of convenience. DRAWINGS
图 la为本发明的发光灯体散热结构的内部透视示意图。 图 lb为本发明的发光灯体散热结构从另一个方向的纵向剖视图。 Figure la is an internal perspective view of the heat dissipation structure of the light-emitting lamp body of the present invention. Figure 1b is a longitudinal cross-sectional view of the light-emitting body heat dissipation structure of the present invention from another direction.
图 2a、 2b为本发明的发光灯体散热结构的玻璃壳体的两种具体形式示意图。  2a and 2b are schematic views showing two specific forms of a glass casing of the heat dissipation structure of the light-emitting lamp body of the present invention.
图 3a、 3b为本发明的发光灯体散热结构中的驱动电路板结构示意图。  3a and 3b are schematic views showing the structure of a driving circuit board in the heat dissipation structure of the light-emitting lamp body of the present invention.
图 4为本发明的照明装置的整体结构示意图。  4 is a schematic view showing the overall structure of a lighting device of the present invention.
图 5a ~ 5h为本发明的照明装置的制造方法的装配过程各个步骤示意图。 具体实施方式  5a to 5h are schematic views showing respective steps of an assembly process of a method of manufacturing a lighting device of the present invention. detailed description
为了能够更清楚地理解本发明的技术内容, 特举以下实施例详细说明。  In order to more clearly understand the technical content of the present invention, the following embodiments are specifically described.
请参阅图 la、 lb所示, 该发光灯体散热结构, 包括:  Referring to Figures la and lb, the illuminating body heat dissipation structure includes:
( 1 )玻璃壳体 1 ;  (1) glass housing 1;
( 2 )设置于玻璃壳体 1中的发热部件 2;  (2) a heat generating component 2 disposed in the glass casing 1;
其中, 所述的发热部件 2与玻璃壳体 1之间相紧密接触, 且相紧密接触的部分的面积最 大化。  Among them, the heat generating component 2 and the glass casing 1 are in close contact with each other, and the area of the portions in close contact with each other is maximized.
其中, 所述的玻璃壳体 1 内壁上具有传热接触部 11 , 该传热接触部 11与所述的发热部 件 2相紧密接触; 该传热接触部 11至少可以为以下两种形式:  The inner wall of the glass casing 1 has a heat transfer contact portion 11 , and the heat transfer contact portion 11 is in close contact with the heat generating component 2; the heat transfer contact portion 11 can be at least two forms:
( a )请参阅图 2a所示, 其为环形凸台, 该环形凸台的底面与所述的发热部件 2相紧密 接触; 这种结构便于制造, 而且较为坚固耐用;  (a) Referring to Fig. 2a, which is an annular boss, the bottom surface of the annular boss is in close contact with the heat generating component 2; the structure is easy to manufacture and more durable;
( b )请参阅图 2b所示, 其为环形均匀分布于该玻璃壳体 1边缘上的至少二个外凹内凸 体 12, 且每个外凹内凸体 12的内表面与所述的发热部件 2相紧密接触。 这种结构不仅可以 增大与发热部件 2的接触面积, 而且也增加了玻璃壳体 1与外部空气接触的面积, 改善了散 热效果, 同时也更加节约原材料。  (b) Please refer to FIG. 2b, which is at least two concave inner protrusions 12 uniformly distributed on the edge of the glass casing 1, and the inner surface of each of the concave inner protrusions 12 is The heat generating component 2 is in close contact with each other. This structure not only increases the contact area with the heat generating component 2, but also increases the area in which the glass casing 1 is in contact with the outside air, improves the heat dissipation effect, and also saves raw materials.
在本发明的具体实施方式中, 该发光灯体散热结构中的玻璃壳体 1可以通过导热材料层 3与所述的发热部件 2相紧密接触, 这样能够进一步改善热传递的效果, 将接触面间隙之间 的导热不良的空气完全排除掉; 所述的导热材料层 3可以为导热硅脂层 3 , 也可以为其它可 以起到理想的紧密接触效果并且导热良好的材料。  In a specific embodiment of the present invention, the glass casing 1 in the heat dissipation structure of the illuminating lamp body can be in close contact with the heat generating component 2 through the heat conductive material layer 3, which can further improve the heat transfer effect, and the contact surface The poorly thermally conductive air between the gaps is completely eliminated; the thermally conductive material layer 3 may be a thermally conductive silicone layer 3, or other materials that can provide a desired close contact effect and have good thermal conductivity.
同时, 请参阅图 3a和 3b所示, 为了获得更好的散热效果, 在本发明的实施方式中, 该 发光灯体散热结构中的发热部件 2为发光灯体的驱动电路板 2, 所述的驱动电路板 2为金属 基电路板 2。  At the same time, as shown in FIG. 3a and FIG. 3b, in order to obtain a better heat dissipation effect, in the embodiment of the present invention, the heat generating component 2 in the heat dissipation structure of the light emitting lamp body is the driving circuit board 2 of the light emitting lamp body, The drive circuit board 2 is a metal base circuit board 2.
该发光灯体散热结构中的金属基电路板 2可以具有单侧棵露金属面 21 , 所述的单侧棵露 金属面 21与所述的玻璃壳体 1 内壁上所具有的传热接触部 11相紧密接触; 或者所述的金属 基电路板 2也可以具有双侧棵露金属面,且其中一侧棵露金属面 21与所述的玻璃壳体 1内壁 上所具有的传热接触部 11相紧密接触; 为了获得良好的导热效果, 并且重量较轻, 该金属基 电路板 2可以为铝基电路板 2, 当然也可以釆用其它合适的金属材料。 The metal-based circuit board 2 in the heat-dissipating structure of the light-emitting lamp body may have a single-sided exposed metal surface 21, and the one-side dew The metal surface 21 is in close contact with the heat transfer contact portion 11 on the inner wall of the glass casing 1; or the metal base circuit board 2 may have a metal surface on both sides, and one side of the metal surface is exposed. The metal surface 21 is in close contact with the heat transfer contact portion 11 on the inner wall of the glass casing 1; in order to obtain a good heat conduction effect and light weight, the metal base circuit board 2 may be an aluminum base circuit board 2 Of course, other suitable metal materials can also be used.
不仅如此, 作为尽可能增加散热接触面积, 该发光灯体散热结构中的金属基电路板 2与 玻璃壳体 1之间的空间中还填充设置有导热材料体 4, 所述的导热材料体 4分别与所述的金 属基电路板 2和玻璃壳体 1均紧密接触, 在本发明的具体实施方式中, 该发光灯体散热结构 中的导热材料体 4可以为填充设置于金属基电路板 2与玻璃壳体 1之间的空间中的导热硅胶 4。  In addition, as the heat-dissipating contact area is increased as much as possible, the space between the metal-based circuit board 2 and the glass housing 1 in the heat-dissipating structure of the light-emitting body is further filled with a heat-conducting material body 4, and the heat-conductive material body 4 The metal-based circuit board 2 and the glass housing 1 are in close contact with each other. In the embodiment of the present invention, the heat conductive material body 4 in the heat dissipation structure of the light-emitting body can be filled and disposed on the metal-based circuit board 2 The thermally conductive silicone 4 in the space between the glass housing 1 and the glass housing 1.
同时, 该发光灯体散热结构中的玻璃壳体 1 的后部还结合设置有灯座 5 , 所述的导热硅 胶 4与灯座 5之间填充有环氧树脂灌封物 51。  At the same time, the rear portion of the glass casing 1 in the heat-dissipating structure of the light-emitting body is further provided with a lamp holder 5, and the heat-conductive silicone rubber 4 and the lamp holder 5 are filled with an epoxy resin potting material 51.
该发光灯体散热结构中的灯座 5可以与玻璃壳体 1结合成为一体, 也可以是与玻璃壳体 1可分离的一个部分, 该灯座 5的材料可以为工程塑料或者陶瓷材料, 也可以为其它合适的 材料。  The lamp holder 5 in the heat dissipation structure of the illuminating lamp body may be integrated with the glass case 1 or may be a part detachable from the glass case 1. The material of the lamp holder 5 may be engineering plastic or ceramic material. It can be other suitable materials.
该发光灯体散热结构中的金属基电路板 2上还固定设置有垂直于该金属基电路板 2表面 的金属电源导针 6,所述的金属电源导针 6贯穿于所述的导热材料体 4中且与该导热材料体 4 相紧密接触; 在本发明的具体实施方式中, 该金属电源导针 6的材料为黄铜, 其中铜的含量 至少为 59 %。  A metal power supply lead pin 6 perpendicular to the surface of the metal base circuit board 2 is fixedly disposed on the metal base circuit board 2 in the heat dissipation structure of the light emitting lamp body, and the metal power supply guide pin 6 penetrates through the heat conductive material body. 4 and in close contact with the body 4 of thermal conductive material; in a specific embodiment of the invention, the material of the metal power supply pin 6 is brass, wherein the content of copper is at least 59%.
同时, 所述的金属电源导针 6的表面还包覆有绝缘套管 61 , 所述的金属电源导针 6通过 该绝缘套管 61与所述的导热材料体 4紧密接触, 所述的绝缘套管的材料为导热材料; 该绝缘 套管可以为液晶聚合物 LCP、 聚苯硫醚 PPS、 尼龙 PA66或者尼龙 PA46, 其中:  At the same time, the surface of the metal power supply pin 6 is further covered with an insulating sleeve 61, and the metal power supply pin 6 is in close contact with the heat conductive material body 4 through the insulating sleeve 61, the insulation The material of the sleeve is a heat conductive material; the insulating sleeve may be a liquid crystal polymer LCP, polyphenylene sulfide PPS, nylon PA66 or nylon PA46, wherein:
• 液晶聚合物 (LCP ) ——是一种新型的高分子材料, 在熔融态时一般呈现液晶性。  • Liquid Crystal Polymer (LCP) – is a new type of polymer material that generally exhibits liquid crystallinity in the molten state.
这类材料具有优异的耐热性能和成型加工性能;  These materials have excellent heat resistance and molding processability;
• 聚苯硫醚(PPS ) ——具有硬而脆、 结晶度高、 难燃、 热稳定性好、 机械强度较高、 电性能优良等优点;  • Polyphenylene sulfide (PPS) – has the advantages of being hard and brittle, high crystallinity, flame retardant, good thermal stability, high mechanical strength, and excellent electrical properties;
• 尼龙 -66 ( PA66 ) —— 又称聚酰胺 -66, 即聚己二酰己二胺, 其突出的特点是坚韧、 耐磨、 耐油、 耐水、 抗酶菌, 但吸水大, 适于制作一般机械零件、 减磨耐磨零件、 传动零件、 以及化工、 电器、 仪表等零件;  • Nylon-66 (PA66) - Also known as polyamide-66, polyhexamethylene adipamide, its outstanding features are tough, wear-resistant, oil-resistant, water-resistant, anti-enzytic, but absorbent, suitable for production General mechanical parts, wear-reducing parts, transmission parts, and chemical, electrical, instrumentation and other parts;
• 尼龙 -46 ( PA46 ) —— 又称聚酰胺 -46 , 即聚己二酰丁二胺, 其突出的特点是具有 高结晶度, 耐高温、 高刚性, 高强度。 主要用于汽车发动机及周边部件, 如缸盖、 油缸灯座、 油封盖、 变速器。 电气工业中用作接触器、 插座、 线圏骨架、 开关等对 耐热性、 抗疲劳强度要求很高的领域。 • Nylon-46 (PA46) - also known as polyamide-46, which is polyadipyldiamine, its outstanding feature is High crystallinity, high temperature resistance, high rigidity, high strength. Mainly used in automotive engines and peripheral components, such as cylinder heads, cylinder bases, oil seals, and transmissions. Used in the electrical industry as a contactor, socket, wire bobbin, switch, etc., which require high heat resistance and fatigue strength.
不仅如此, 为了尽可能提高光转换效率, 降低发光灯体的发热量, 该发光灯体散热结构 中的发光灯体中所具有的发光元件可以为发光二极管 LED 7, 也可以为其它具有高效光转换 效率的发光元件; 在本发明的具体实施方式中, 该发光灯体散热结构中的发光二极管 LED 7 可以为贴片发光 LED元件 7,所述的贴片发光 LED元件 7贴设于所述的驱动电路板 2上;或 者发光二极管 LED 7也可以为集成 LED模块, 所述的集成 LED模块固定设置于所述的驱动 电路板上, 这样可以获得更好的散热效果。  In addition, in order to increase the light conversion efficiency as much as possible and reduce the heat generation of the light-emitting lamp body, the light-emitting elements in the light-emitting lamp body in the light-emitting body of the light-emitting body may be light-emitting diodes LED 7 or other high-efficiency light. a light-emitting element of a conversion efficiency; in a specific embodiment of the present invention, the light-emitting diode LED 7 in the heat-dissipating structure of the light-emitting body may be a patch-emitting LED element 7, and the patch-emitting LED element 7 is attached to the On the driving circuit board 2; or the LEDs 7 can also be an integrated LED module, the integrated LED module is fixedly disposed on the driving circuit board, so that a better heat dissipation effect can be obtained.
作为本发明的另一种实施例, 该发光灯体散热结构中的发热部件在不釆用金属基电路板 而釆用其它形式的情况下, 该发热部件与玻璃壳体 1之间的空间中仍然可以填充设置有导热 材料体 4, 所述的导热材料体 4分别与所述的发热部件和玻璃壳体 1均紧密接触。  As another embodiment of the present invention, the heat-generating component in the heat-dissipating structure of the light-emitting lamp body is in a space between the heat-generating component and the glass casing 1 without using a metal-based circuit board and other forms. It is still possible to fill the body 4 with a heat-conducting material 4 which is in close contact with the heat-generating component and the glass casing 1, respectively.
其中, 该发光灯体散热结构中的导热材料体 4为填充设置于发热部件与玻璃壳体 1之间 的空间中的导热硅胶 4; 该玻璃壳体 1的后部还结合设置有灯座 5 , 所述的导热硅胶 4与灯座 5之间填充有环氧树脂灌封物 51; 该灯座 5的材料可以为工程塑料或者陶瓷材料。  The heat conductive material body 4 in the heat dissipation structure of the light emitting body is filled with the heat conductive silicone 4 disposed in the space between the heat generating component and the glass housing 1; the rear portion of the glass housing 1 is further provided with the lamp holder 5 The thermal conductive silicone 4 and the lamp holder 5 are filled with an epoxy resin potting material 51; the material of the lamp holder 5 may be an engineering plastic or a ceramic material.
再请参阅图 4所示, 作为本发明的具体应用的范例, 该具有上述的散热结构的照明装置, 其中, 所述的玻璃壳体 1前端设置有聚光折射透镜 8, 所述的聚光折射透镜 8的位置与所述 的发光灯体中所具有的发光元件相对应; 该聚光折射透镜 8通过光硬化树脂粘合层固定粘接 于所述的玻璃壳体 1的前端。  Referring to FIG. 4, as an example of a specific application of the present invention, the illumination device having the above-mentioned heat dissipation structure, wherein the front end of the glass casing 1 is provided with a condensing and refracting lens 8, and the concentrating light The position of the refractive lens 8 corresponds to the light-emitting element included in the light-emitting lamp body; the light-condensing refractive lens 8 is fixedly bonded to the front end of the glass casing 1 by a photo-curable resin adhesive layer.
再请参阅图 5a至 5h所示, 该制造上述的照明装置的方法, 其中包括以下步骤:  Referring again to Figures 5a through 5h, the method of manufacturing the above lighting device includes the following steps:
( 1 )在装配夹具 9中将所述的发热部件 2安设于所述的玻璃壳体 1中, 包括以下步骤: ( a )将所述的驱动电路板 2卡设于装配夹具中, 且使得所述的金属电源导针 6朝夕卜; ( b )将所述的玻璃壳体 1套设于该驱动电路板 2外, 且使得金属电源导针 6贯穿该 玻璃壳体 1 , 并与该玻璃壳体 1后端所设置的导电触端相紧密电接触;  (1) Locating the heat generating component 2 in the glass housing 1 in the assembly jig 9, comprising the steps of: (a) locating the driving circuit board 2 in an assembly jig, and (b) arranging the glass housing 1 outside the driving circuit board 2, and causing the metal power supply pin 6 to penetrate the glass housing 1 and The conductive contact end provided at the rear end of the glass casing 1 is in close electrical contact;
( 2 )使得该玻璃壳体 1与发热部件 2相紧密接触, 包括以下步骤:  (2) bringing the glass casing 1 into close contact with the heat generating component 2, comprising the steps of:
( a )将导热材料通过该玻璃壳体 1后端的开口 13注入发热部件 2与玻璃壳体 1之间 的空间中;  (a) injecting a heat conductive material into the space between the heat generating component 2 and the glass casing 1 through the opening 13 at the rear end of the glass casing 1;
( al )使得所述的金属电源导针 6 贯穿于所述的导热材料中且与该导热材料紧密接 触; ( b )使得所述的玻璃壳体 1与所述的发热部件 2的接触面之间形成导热材料层 3;(al) causing said metal power supply lead 6 to penetrate through said thermally conductive material and in intimate contact with said thermally conductive material; (b) forming a layer of thermally conductive material 3 between the glass housing 1 and the contact surface of the heat generating component 2;
( c )等待所述的发热部件 2与玻璃壳体 1之间的空间中的导热材料凝固形成导热材 料体 4, 且使得该导热材料体 4分别与所述的玻璃壳体 1和发热部件 2均紧密接触; 其中还包括以下步骤: (c) waiting for the heat conductive material in the space between the heat generating component 2 and the glass casing 1 to solidify to form the heat conductive material body 4, and causing the heat conductive material body 4 to be respectively associated with the glass casing 1 and the heat generating component 2 All are in close contact; it also includes the following steps:
( d )将玻璃壳体 1后端的开口 13塞紧密封, 包括以下步骤:  (d) Plugging the opening 13 at the rear end of the glass casing 1 tightly, including the following steps:
( i )使用塞子 14插入在发热部件 2与玻璃壳体 1之间的空间中所注入的导热材 料中, 并将玻璃壳体 1后端的开口 13塞紧;  (i) inserting the plug 14 into the heat conductive material injected into the space between the heat generating component 2 and the glass casing 1, and plugging the opening 13 at the rear end of the glass casing 1;
( ii )等待该塞子 14固结于所述的导热材料凝固所形成的导热材料体 4中, 从而 将玻璃壳体 1后端密封;  (ii) waiting for the plug 14 to be consolidated in the heat conductive material body 4 formed by solidification of the heat conductive material, thereby sealing the rear end of the glass casing 1;
( 3 )将聚光折射透镜 8装设于所述的玻璃壳体 1的前端, 且使得该聚光折射透镜 8的位 置与所述的发光灯体中所具有的发光元件相对应, 包括以下步骤:  (3) mounting the condensing and refracting lens 8 at the front end of the glass casing 1 so that the position of the condensing and refracting lens 8 corresponds to the illuminating element included in the illuminating lamp body, including the following Steps:
( a )将所述的装配夹具 9翻转, 使得该玻璃壳体 1的前端朝上;  (a) inverting the assembly jig 9 so that the front end of the glass casing 1 faces upward;
( b )在聚光折射透镜 8与玻璃壳体 1的前端的接触面上涂覆光硬化树脂层;  (b) applying a photo-curable resin layer on the contact surface of the condensing refractive lens 8 and the front end of the glass casing 1;
( c )将聚光折射透镜 8放置于所述的玻璃壳体 1的前端对应位置上;  (c) placing the condensing and refracting lens 8 at a corresponding position on the front end of the glass casing 1;
( d )使用紫外线对该聚光折射透镜 8与玻璃壳体 1的粘合位置进行照射, 直至该光 硬化树脂层完全固化。  (d) The bonding position of the condensing refractive lens 8 and the glass casing 1 is irradiated with ultraviolet rays until the photo-curable resin layer is completely cured.
在实际应用当中, 本发明主要釆用非常廉价的玻璃作为灯的主要构成原料, 同时起到了 绝缘和热导体材料的功能, 同时使得玻璃和金属基电路板的接触面积最大化作为主要热负荷 传递途径, 另外, 将导热硅胶灌封作为辅助的途径, 从而确保完全传热。  In practical applications, the present invention mainly uses very inexpensive glass as the main constituent material of the lamp, and at the same time functions as an insulating and heat conductor material, and at the same time maximizes the contact area of the glass and the metal-based circuit board as the main heat load transfer. In addition, thermal silica gel potting is used as an auxiliary route to ensure complete heat transfer.
本发明中, 金属基电路板将 LED发光元件电路及驱动电路均是设置在一侧面上, 使得该 金属基电路板能够将该 LED发光元件电路及驱动电路所产生的热量散发出来,从而获得最大 的接触面积与玻璃外壳的表面相接触。  In the present invention, the metal-based circuit board has the LED light-emitting element circuit and the driving circuit disposed on one side, so that the metal-based circuit board can dissipate the heat generated by the LED light-emitting element circuit and the driving circuit, thereby obtaining the maximum The contact area is in contact with the surface of the glass envelope.
同时, 导热硅脂设置于玻璃外壳及金属基电路板的结合面上, 以确保在整个接触面的热 传导连续性; 金属电源导针有两个作用, 一个作用是从灯座接入电源, 另一个作用是能够进 一步将金属基电路板的热量直接传导到导热硅胶或者环氧树脂灌封物, 然后再传导到玻璃壳 体和空气中。  At the same time, the thermal grease is placed on the bonding surface of the glass casing and the metal-based circuit board to ensure the continuity of heat conduction throughout the contact surface; the metal power supply pin has two functions, one function is to connect the power from the lamp holder, and One effect is to further conduct heat from the metal-based board directly to the thermally conductive silicone or epoxy potting and then to the glass housing and air.
釆用本发明的发光灯体散热结构的照明装置, 能够实现有效的热管理功能, 使玻璃灯, 例如 GUI 0 LED射灯, 消耗 2 ~ 4 iL特的能源, 但输出光能量相当于 50瓦的 GU10卤素灯, 所节约的能源消耗为 90 %。 釆用了上述的发光灯体散热结构、 相应的照明装置及其制造方法, 由于其中使用玻璃作 为发光灯体的壳体的主要材料, 不仅廉价经济, 而且能够起到绝缘和热传递的双重作用; 同 时该散热结构中能够确保玻璃壳体 1与发热部件 2具有尽可能大的接触面积, 从而成为主要 热负荷传递途径, 而导热硅胶灌封能够确保高效传热, 比单纯的空气传热的效果有了显著的 提高; 不仅如此, 该驱动电路板 2釆用金属基电路板 2, 进一步提高了热传递的效率, 从而 实现了高效散热, 有效避免发光灯体内部温度过高, 节能安全环保, 由于灯体长时间工作状 态下能够保持相对较低的温度, 因此显著延长了使用寿命, 而且结构筒单实用, 制造过程方 便快捷, 工作性能稳定可靠, 适用范围较为广泛, 为人们的工作和生活都带来了很大的便利。 The illumination device using the heat dissipation structure of the light-emitting body of the present invention can realize an effective heat management function, so that a glass lamp, such as a GUI 0 LED spotlight, consumes 2 to 4 iL of energy, but the output light energy is equivalent to 50 watts. The GU10 halogen lamp saves 90% of its energy consumption. The above-mentioned light-emitting body heat-dissipating structure, the corresponding lighting device and the manufacturing method thereof are used, and since the glass is used as the main material of the casing of the light-emitting lamp body, it is not only cheap and economical, but also has the dual functions of insulation and heat transfer. At the same time, the heat dissipation structure can ensure that the glass casing 1 and the heat generating component 2 have the largest possible contact area, thereby becoming the main heat load transmission path, and the thermal conductive silicone potting can ensure efficient heat transfer and heat transfer than pure air. The effect is significantly improved; not only that, the driving circuit board 2 uses the metal-based circuit board 2, further improving the efficiency of heat transfer, thereby achieving efficient heat dissipation, effectively avoiding excessive temperature inside the light-emitting lamp body, saving energy, safety and environmental protection. Because the lamp body can maintain a relatively low temperature under long working conditions, the service life is significantly prolonged, and the structure is simple and practical, the manufacturing process is convenient and quick, the work performance is stable and reliable, and the scope of application is wide, for people's work and Life has brought great convenience.
在此说明书中, 本发明已参照其特定的实施例作了描述。 但是, 很显然仍可以作出各种 修改和变换而不背离本发明的精神和范围。 因此, 说明书和附图应被认为是说明性的而非限 制性的。  In this specification, the invention has been described with reference to specific embodiments thereof. However, it will be apparent that various modifications and changes can be made without departing from the spirit and scope of the invention. Accordingly, the specification and figures are to be regarded as illustrative and not limiting.

Claims

权利要求 Rights request
1、 一种发光灯体散热结构, 包括: 1. A heat dissipation structure for a light body, comprising:
- 玻璃壳体, 以及  - glass housing, and
- 设置于玻璃壳体中的发热部件;  - a heat generating component disposed in the glass housing;
其特征在于,  It is characterized in that
所述的发热部件与玻璃壳体之间相紧密接触, 且相紧密接触的部分的面积最大化。 The heat-generating component is in close contact with the glass casing, and the area of the closely contacting portion is maximized.
2、 根据权利要求 1所述的发光灯体散热结构, 其特征在于, 所述的玻璃壳体内壁上具有 传热接触部, 该传热接触部与所述的发热部件相紧密接触。 2. The illuminating lamp body heat dissipating structure according to claim 1, wherein the inner wall of the glass casing has a heat transfer contact portion, and the heat transfer contact portion is in close contact with the heat generating component.
3、 根据权利要求 2所述的发光灯体散热结构, 其特征在于, 所述的传热接触部为环形凸 台, 该环形凸台的底面与所述的发热部件相紧密接触。  3. The light-emitting body heat dissipation structure according to claim 2, wherein the heat transfer contact portion is an annular boss, and a bottom surface of the annular boss is in close contact with the heat generating component.
4、 根据权利要求 2所述的发光灯体散热结构, 其特征在于, 所述的传热接触部为环形均 匀分布于该玻璃壳体边缘上的至少二个外凹内凸体, 且每个外凹内凸体的内表面与所述的发 热部件相紧密接触。  The illuminating lamp body heat dissipating structure according to claim 2, wherein the heat transfer contact portion is at least two outer concave inner protrusions uniformly distributed on the edge of the glass casing, and each The inner surface of the concave inner convex body is in close contact with the heat generating component.
5、 根据权利要求 1至 4中任一项所述的发光灯体散热结构, 其特征在于, 所述的玻璃壳 体通过导热材料层与所述的发热部件相紧密接触。  The illuminating lamp body heat dissipating structure according to any one of claims 1 to 4, wherein the glass casing is in close contact with the heat generating component through a layer of a heat conductive material.
6、 根据权利要求 5所述的发光灯体散热结构, 其特征在于, 所述的导热材料层为导热硅 脂层。  6. The light-emitting body heat dissipation structure according to claim 5, wherein the heat conductive material layer is a heat conductive silicone layer.
7、 根据权利要求 1至 4中任一项所述的发光灯体散热结构, 其特征在于, 所述的发热部 件为发光灯体的驱动电路板, 所述的驱动电路板为金属基电路板。  The heat-dissipating structure for a light-emitting lamp body according to any one of claims 1 to 4, wherein the heat-generating component is a driving circuit board of the light-emitting lamp body, and the driving circuit board is a metal-based circuit board. .
8、 根据权利要求 7所述的发光灯体散热结构, 其特征在于, 所述的金属基电路板具有单 侧棵露金属面, 所述的单侧棵露金属面与所述的玻璃壳体相紧密接触; 或者所述的金属基电 路板具有双侧棵露金属面, 且其中一侧棵露金属面与所述的玻璃壳体相紧密接触。  The illuminating lamp body heat dissipation structure according to claim 7, wherein the metal base circuit board has a single-sided exposed metal surface, and the one-side exposed metal surface and the glass housing In close contact; or the metal-based circuit board has a metal surface on both sides, and one of the exposed metal faces is in close contact with the glass casing.
9、 根据权利要求 7所述的发光灯体散热结构, 其特征在于, 所述的金属基电路板为铝基 电路板。  9. The light-emitting body heat dissipation structure according to claim 7, wherein the metal-based circuit board is an aluminum-based circuit board.
10、 根据权利要求 7所述的发光灯体散热结构, 其特征在于, 所述的金属基电路板与玻 璃壳体之间的空间中填充设置有导热材料体, 所述的导热材料体分别与所述的金属基电路板 和玻璃壳体均紧密接触。  The heat dissipation structure of the illuminating lamp body according to claim 7, wherein the space between the metal base circuit board and the glass housing is filled with a heat conductive material body, and the heat conductive material body is respectively The metal-based circuit board and the glass housing are in close contact.
11、根据权利要求 10所述的发光灯体散热结构, 其特征在于, 所述的导热材料体为填充 设置于金属基电路板与玻璃壳体之间的空间中的导热硅胶。 The light-emitting body heat dissipation structure according to claim 10, wherein the heat conductive material body is a heat conductive silica gel filled in a space provided between the metal base circuit board and the glass casing.
12、 根据权利要求 11所述的发光灯体散热结构, 其特征在于, 所述的玻璃壳体的后部还 结合设置有灯座, 所述的导热硅胶与灯座之间填充有环氧树脂灌封物。 The illuminating lamp body heat dissipation structure according to claim 11, wherein the rear portion of the glass casing is further provided with a lamp holder, and the thermal conductive silicone and the lamp holder are filled with epoxy resin. Potting.
13、 根据权利要求 12所述的发光灯体散热结构, 其特征在于, 所述的灯座的材料为工程 塑料或者陶瓷材料。  13. The heat dissipation structure for a light-emitting body according to claim 12, wherein the material of the socket is an engineering plastic or a ceramic material.
14、 根据权利要求 10所述的发光灯体散热结构, 其特征在于, 所述的金属基电路板上还 固定设置有垂直于该金属基电路板表面的金属电源导针, 所述的金属电源导针贯穿于所述的 导热材料体中且与该导热材料体紧密接触。  The illuminating lamp body heat dissipation structure according to claim 10, wherein the metal base circuit board is further fixed with a metal power supply pin perpendicular to the surface of the metal base circuit board, and the metal power source is A guide pin extends through the body of thermally conductive material and is in intimate contact with the body of thermally conductive material.
15、 根据权利要求 14所述的发光灯体散热结构, 其特征在于, 所述的金属电源导针的材 料为黄铜, 其中铜的含量至少为 59 %。  The illuminating lamp body heat dissipating structure according to claim 14, wherein the metal power guiding pin material is brass, wherein the content of copper is at least 59%.
16、 根据权利要求 14所述的发光灯体散热结构, 其特征在于, 所述的金属电源导针表面 还包覆有绝缘套管, 所述的金属电源导针通过该绝缘套管与所述的导热材料体紧密接触, 所 述的绝缘套管为导热材料。  The illuminating lamp body heat dissipating structure according to claim 14, wherein the metal power guiding pin surface is further covered with an insulating sleeve, and the metal power guiding pin passes through the insulating sleeve and the The heat conductive material body is in close contact, and the insulating sleeve is a heat conductive material.
17、 根据权利要求 16所述的发光灯体散热结构, 其特征在于, 所述的绝缘套管为液晶聚 合物 LCP、 聚苯硫醚 PPS、 尼龙 PA66或者尼龙 PA46。  The illuminating lamp body heat dissipating structure according to claim 16, wherein the insulating sleeve is a liquid crystal polymer LCP, polyphenylene sulfide PPS, nylon PA66 or nylon PA46.
18、 根据权利要求 7所述的发光灯体散热结构, 其特征在于, 所述的发光灯体中所具有 的发光元件为发光二极管 LED。  The light-emitting body heat dissipation structure according to claim 7, wherein the light-emitting element included in the light-emitting lamp body is a light-emitting diode LED.
19、 根据权利要求 18所述的发光灯体散热结构, 其特征在于, 所述的发光二极管 LED 为贴片发光 LED元件, 所述的贴片发光 LED元件贴设于所述的驱动电路板上; 或者发光二 极管 LED为集成 LED模块, 所述的集成 LED模块固定设置于所述的驱动电路板上。  The illuminating lamp body heat dissipating structure according to claim 18, wherein the illuminating diode LED is a patch illuminating LED component, and the splicing LED component is attached to the driving circuit board. Or the LED is an integrated LED module, and the integrated LED module is fixedly disposed on the driving circuit board.
20、 根据权利要求 1至 4中任一项所述的发光灯体散热结构, 其特征在于, 所述的发热 部件与玻璃壳体之间的空间中填充设置有导热材料体 , 所述的导热材料体分别与所述的发热 部件和玻璃壳体均紧密接触。  The illuminating lamp body heat dissipating structure according to any one of claims 1 to 4, wherein a space between the heat generating component and the glass casing is filled with a heat conductive material body, and the heat conduction The material bodies are in intimate contact with the heat generating component and the glass casing, respectively.
21、 根据权利要求 20所述的发光灯体散热结构, 其特征在于, 所述的导热材料体为填充 设置于发热部件与玻璃壳体之间的空间中的导热硅胶。  The light-emitting body heat dissipation structure according to claim 20, wherein the heat conductive material body is a heat conductive silica gel filled in a space provided between the heat generating component and the glass casing.
22、 根据权利要求 21所述的发光灯体散热结构, 其特征在于, 所述的玻璃壳体的后部还 结合设置有灯座, 所述的导热硅胶与灯座之间填充有环氧树脂灌封物。  The illuminating lamp body heat dissipation structure according to claim 21, wherein the rear portion of the glass casing is further provided with a lamp holder, and the thermal conductive silicone and the lamp holder are filled with epoxy resin. Potting.
23、 根据权利要求 22所述的发光灯体散热结构, 其特征在于, 所述的灯座的材料为工程 塑料或者陶瓷材料。  The illuminating lamp body heat dissipation structure according to claim 22, wherein the lamp holder is made of engineering plastic or ceramic material.
24、 一种具有权利要求 1所述的散热结构的照明装置, 其特征在于, 所述的玻璃壳体前 端设置有聚光折射透镜, 所述的聚光折射透镜的位置与所述的发光灯体中所具有的发光元件 相对应。 24. A lighting device having the heat dissipation structure of claim 1 wherein: said glass housing front The end is provided with a condensing refractive lens, and the position of the condensing and refracting lens corresponds to the illuminating element included in the illuminating lamp body.
25、 根据权利要求 24所述的照明装置, 其特征在于, 所述的聚光折射透镜通过光硬化树 脂粘合层固定粘接于所述的玻璃壳体前端。  The illuminating device according to claim 24, wherein the condensing and refracting lens is fixedly bonded to the front end of the glass casing by a photo-curable resin adhesive layer.
26、 一种制造权利要求 24所述的照明装置的方法, 其特征在于, 所述的方法包括以下步 骤:  26. A method of manufacturing the illumination device of claim 24, wherein the method comprises the steps of:
( 1 )在装配夹具中将所述的发热部件安设于所述的玻璃壳体中;  (1) arranging the heat generating component in the glass casing in an assembly jig;
( 2 )使得该玻璃壳体与发热部件相紧密接触;  (2) bringing the glass casing into close contact with the heat generating component;
( 3 )将聚光折射透镜装设于所述的玻璃壳体的前端, 且使得该聚光折射透镜的位置与所 述的发光灯体中所具有的发光元件相对应。  (3) A condensing and refracting lens is attached to the front end of the glass casing, and the position of the condensing and refracting lens is made to correspond to the illuminating element included in the illuminating lamp body.
27、 根据权利要求 26所述的制造照明装置的方法, 其特征在于, 所述的使得该玻璃壳体 与发热部件相紧密接触, 包括以下步骤:  27. The method of manufacturing a lighting device according to claim 26, wherein said bringing said glass casing into close contact with said heat generating component comprises the steps of:
( 21 )将导热材料通过该玻璃壳体后端的开口注入发热部件与玻璃壳体之间的空间中; ( 22 )使得所述的玻璃壳体与所述的发热部件的接触面之间形成导热材料层;  (21) injecting a heat conductive material into a space between the heat generating component and the glass casing through an opening at a rear end of the glass casing; (22) forming a heat conduction between the glass casing and a contact surface of the heat generating component Material layer
( 23 )等待所述的发热部件与玻璃壳体之间的空间中的导热材料凝固形成导热材料体, 且使得该导热材料体分别与所述的玻璃壳体和发热部件均紧密接触。  (23) waiting for the heat conductive material in the space between the heat generating component and the glass casing to solidify to form a heat conductive material body, and the heat conductive material body is in close contact with the glass shell and the heat generating component, respectively.
28、 根据权利要求 27所述的制造照明装置的方法, 其特征在于, 所述的步骤(23 ) 中还 包括以下步骤:  The method of manufacturing a lighting device according to claim 27, wherein the step (23) further comprises the following steps:
( 24 )将玻璃壳体后端的开口塞紧密封。  (24) Plug the opening at the rear end of the glass casing tightly.
29、 根据权利要求 28所述的制造照明装置的方法, 其特征在于, 所述的将玻璃壳体后端 的开口塞紧密封, 包括以下步骤:  29. The method of manufacturing a lighting device according to claim 28, wherein said sealing the opening of the rear end of the glass casing comprises the following steps:
( 241 )使用塞子插入在发热部件与玻璃壳体之间的空间中所注入的导热材料中, 并将玻 璃壳体后端的开口塞紧;  (241) inserting a plug into the heat conductive material injected into the space between the heat generating component and the glass casing, and plugging the opening at the rear end of the glass casing;
( 242 )等待该塞子固结于所述的导热材料凝固所形成的导热材料体中,从而将玻璃壳体 后端密封。  (242) waiting for the plug to be fixed in the heat conductive material body formed by solidification of the heat conductive material, thereby sealing the rear end of the glass casing.
30、 根据权利要求 27所述的制造照明装置的方法, 其特征在于, 所述的发热部件为发光 灯体的驱动电路板, 所述的驱动电路板为金属基电路板, 所述的金属基电路板上还固定设置 有垂直于该金属基电路板表面的金属电源导针, 所述的在装配夹具中将所述的发热部件安设 于所述的玻璃壳体中, 包括以下步骤: ( 11 )将所述的驱动电路板卡设于装配夹具中, 且使得所述的金属电源导针朝外;The method of manufacturing a lighting device according to claim 27, wherein the heat generating component is a driving circuit board of the light emitting lamp body, the driving circuit board is a metal base circuit board, and the metal base A metal power supply pin perpendicular to the surface of the metal base circuit board is further fixed on the circuit board, and the heat generating component is disposed in the glass casing in the assembly jig, and the following steps are included: (11) locating the driving circuit board in the assembly jig, and causing the metal power supply pin to face outward;
( 12 )将所述的玻璃壳体套设于该驱动电路板外, 且使得金属电源导针贯穿该玻璃壳体, 并与该玻璃壳体后端所设置的导电触端相紧密电接触。 (12) The glass casing is sleeved outside the driving circuit board, and the metal power guiding pin penetrates the glass casing and is in close electrical contact with the conductive contact end provided at the rear end of the glass casing.
31、 根据权利要求 30所述的制造照明装置的方法, 其特征在于, 所述的步骤(21 )之后 还包括以下步骤:  The method of manufacturing a lighting device according to claim 30, wherein the step (21) further comprises the following steps:
( 211 )使得所述的金属电源导针贯穿于所述的导热材料中且与该导热材料紧密接触。 (211) causing the metal power guide pin to penetrate through the heat conductive material and in close contact with the heat conductive material.
32、 根据权利要求 26至 31中任一项所述的制造照明装置的方法, 其特征在于, 所述的 将聚光折射透镜装设于所述的玻璃壳体的前端, 包括以下步骤: The method of manufacturing a lighting device according to any one of claims 26 to 31, wherein the condensing and refracting lens is mounted on the front end of the glass casing, comprising the steps of:
( 41 )将所述的装配夹具翻转, 使得该玻璃壳体的前端朝上;  (41) inverting the assembly jig such that the front end of the glass casing faces upward;
( 42 )在聚光折射透镜与玻璃壳体的前端的接触面上涂覆光硬化树脂层;  (42) coating a photocurable resin layer on a contact surface of the condensing refractive lens and the front end of the glass casing;
( 43 )将聚光折射透镜放置于所述的玻璃壳体的前端对应位置上;  (43) placing a condensing and refracting lens at a corresponding position on the front end of the glass casing;
( 44 )使用紫外线对该聚光折射透镜与玻璃壳体的粘合位置进行照射, 直至该光硬化树 脂层完全固化。  (44) The position where the condensing refractive lens is bonded to the glass casing is irradiated with ultraviolet rays until the photo-curable resin layer is completely cured.
PCT/CN2012/076563 2011-06-07 2012-06-07 Heat dissipation structure for lamp body, corresponding lighting device and manufacturing method therefor WO2012167732A1 (en)

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