KR102151856B1 - Led light apparatus with heat radiating structure - Google Patents

Abstract

An LED lighting device according to an embodiment of the present invention includes a lens unit 101 provided on a lower surface of a plurality of lens shapes; A PCB unit 110 mounted on a lower surface of the LED chips 112 corresponding to each of the plurality of lens shapes; A first heat dissipation unit 120 provided on the upper surface of the PCB unit 110; A second radiating part 130 provided on the upper surface of the first radiating part 120; A third radiating part 140 provided on the upper surface of the second radiating part 130; And a guide plate 150 surrounding the second heat dissipation part 130 and the third heat dissipation part 140 and coupled to the edge of the lens part 101.
The LED lighting device according to an embodiment of the present invention increases heat dissipation efficiency by water-cooled and air-cooled heat transfer, heat accumulation and heat dissipation action using a first heat dissipation unit, a second heat dissipation unit and a third heat dissipation unit. Instead, there is an effect that can achieve weight reduction.

Description

LED lighting device with heat dissipation structure {LED LIGHT APPARATUS WITH HEAT RADIATING STRUCTURE}

The present invention relates to an LED lighting device having a heat dissipation structure, and in particular, to an LED lighting device having a heat dissipation structure capable of performing heat dissipation by water cooling and air cooling and reducing weight.

In general, lighting devices using high-brightness light-emitting diodes with a consumption current of less than 0.3W generate less heat from the light-emitting diodes, so by arranging a plurality of light-emitting diodes, high luminance can be obtained with little energy consumption, and the life of the lamp element is reduced. Because it is long, it is widely used for lighting signs such as traffic lights and electronic signs.

However, power-class high-brightness LED devices used in places that require high illumination such as streetlights, tunnels, and automobile conduction lights use 3W-class high-power LED devices that consume more than 10 times the current consumption compared to general high-brightness LED devices.

At this time, a street light using a power-class high-brightness light-emitting diode device has a very small amount of light compared to a street light using a conventional metal halide lamp or a mercury lamp, so a large number of power-class high-brightness light-emitting diodes are densely used, and heat per unit area is rapidly generated. As a result, the light-emitting diode device deteriorates rapidly, thereby causing a phenomenon in which the illuminance and lifetime of the light-emitting diode are rapidly deteriorated.

Therefore, when developing a lighting fixture using a power-class high-power LED device, it must be designed in a structure capable of effectively dissipating heat from a light source of the light-emitting device.

To solve this problem, conventionally, a printed circuit board made by stacking an aluminum heat sink on which a plurality of light emitting diodes are mounted and an aluminum heat sink having a plurality of heat dissipating protrusions are in close contact with each other, so that the heat emitted from the light emitting diodes is quickly transferred to outside air. It is using a method of radiating heat.

Conventionally, a heat sink is used for such heat dissipation, and as described in the patent document, the heat sink is based on RSF (Rectangular Straight Fin) type, each of which has a plate shape in the vertical direction, and SRSF (Splitted Rectangilar Straight Fin). Type and PF (Pin Fin) type are also widely used.

Such a conventional heat sink performs a method in which heat is conducted from a heat source to a heat sink, which is a bottom surface of the heat sink, is heat conducted from the bottom surface of the heat sink to a radiating fin, and cooled by contacting air through the heat sink again.

However, most of the heat sinks used in the prior art are extruded, but they exhibit limitations in use due to the problem of radiated heat, and to solve this problem, the heat sink is made large, so that the weight is heavy and the manufacturing cost is high.

Korean Patent Publication No. 10-2002-0048844

The present invention has been conceived to solve the above problems, and an object of the present invention is to provide an LED lighting device having a heat dissipation structure capable of performing heat dissipation in a water-cooled and air-cooled manner and reducing weight.

An LED lighting device according to an embodiment of the present invention includes a lens unit 101 having a plurality of lens shapes on its lower surface; A PCB unit 110 mounted on a lower surface of the LED chips 112 corresponding to each of the plurality of lens shapes; A first heat dissipation unit 120 provided on the upper surface of the PCB unit 110; A second radiating part 130 provided on the upper surface of the first radiating part 120; A third radiating part 140 provided on the upper surface of the second radiating part 130; And a guide plate 150 surrounding the second heat dissipation part 130 and the third heat dissipation part 140 and coupled to the edge of the lens part 101.

In the LED lighting device according to the embodiment of the present invention, the first heat dissipation unit 120 includes a heat transfer plate 121 in contact with the upper surface of the PCB unit 110; Heat transfer bars 122-1 and 122-2 symmetrically provided in the longitudinal direction in the shape of a rod on the upper surface of the heat transfer plate 121; And a plurality of heat transfer fins 123 provided between the heat transfer bars 122-1 and 122-2.

In the LED lighting device according to the embodiment of the present invention, the second heat dissipation part 130 includes a first case in contact with the upper surface of the first heat dissipation part 120; A second case bonded to an edge of the first case and having a plurality of grooves 131 bonded to the first case by pressure; And a refrigerant fluid (A) contained in a space between the first case and the second case.

In the LED lighting device according to the embodiment of the present invention, the third heat dissipation unit 140 may include a breathable porous structure made of a plurality of voids connected through each other in three dimensions.

In the LED lighting device according to the embodiment of the present invention, the pores are formed in a diameter of several tens of microns to several millimeters, and formed in an open structure connected to each other in three dimensions by forming a plurality of connection passages with other pores. I can.

Features and advantages of the present invention will become more apparent from the following detailed description based on the accompanying drawings.

Prior to this, terms or words used in the present specification and claims are conventional and should not be interpreted in a dictionary meaning, and the concept of terms is appropriately defined in order for the inventor to describe his own invention in the best way. It should be interpreted as a meaning and concept consistent with the technical idea of the present invention based on the principle that it can be done.

The LED lighting device according to an embodiment of the present invention increases heat dissipation efficiency by means of water-cooled and air-cooled heat transfer, heat accumulation and heat dissipation action using a first radiating part, a second radiating part, and a third radiating part, and a conventional heavy heat sink. Instead, there is an effect that can achieve weight reduction.

1 is an exploded perspective view of an LED lighting device according to an embodiment of the present invention.
2 is a cross-sectional view of an LED lighting device according to an embodiment of the present invention.
3 is a photograph showing a second heat dissipation unit constituting an LED lighting device according to an embodiment of the present invention.
4 is a photograph showing a third heat dissipation unit constituting the LED lighting device according to an embodiment of the present invention.

Objects, specific advantages and novel features of the present invention will become more apparent from the following detailed description and preferred embodiments in conjunction with the accompanying drawings. In adding reference numerals to elements of each drawing in the present specification, it should be noted that, even though they are indicated on different drawings, only the same elements are to have the same number as possible. In addition, terms such as first and second may be used to describe various elements, but the elements should not be limited by the terms. These terms are used only for the purpose of distinguishing one component from another component. In addition, in describing the present invention, if it is determined that a detailed description of related known technologies may unnecessarily obscure the subject matter of the present invention, the detailed description thereof will be omitted.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. 1 is an exploded perspective view of an LED lighting device according to an embodiment of the present invention, Figure 2 is a cross-sectional view of an LED lighting device according to an embodiment of the present invention, Figure 3 is a configuration of an LED lighting device according to an embodiment of the present invention It is a photograph showing a second heat dissipation unit, and Figure 4 is a photograph showing a third heat dissipation unit constituting the LED lighting device according to an embodiment of the present invention.

The LED lighting device according to the embodiment of the present invention includes a lens unit 101, a PCB unit 110 in which a plurality of LED chips 112 are mounted on a lower surface, and a first heat dissipation unit contacting the upper surface of the PCB unit 110 ( 120), the second heat dissipation part 130 in contact with the upper surface of the first heat dissipation part 120, the third heat dissipation part 140 and the second heat dissipation part 130 in contact with the upper surface of the second heat dissipation part 130 3 It includes a guide plate 150 surrounding the heat dissipation unit 140 and coupled to the lens unit 101.

The lens unit 101 is a plate-shaped member that has a plurality of lens shapes on its lower surface to transmit and scatter light and protect against external factors. In consideration of such durability and transparency, the lens unit 101 is, for example, polyethylene terephthalate (PET), polycarbonate (PC), polymethyl methacrylate (PMMA), polyethylene naphthalate (PEN), polyether sulfone. (PES), cyclic olefin polymer (COC), TAC (Triacetylcellulose), polyvinyl alcohol (PVA), polyimide (PI), polystyrene (PS), biaxially oriented PS, BOPS), glass or tempered glass. In particular, the lens unit 101 may be made of polyethylene terephthalate (PET) for transparency, strength and bendability, and when heat resistance and chemical resistance are required, polycarbonate may be used. Of course, it is not necessarily limited thereto.

The PCB unit 110 includes a plurality of LEDs 112 corresponding to the lens of the lens unit 101 on the lower surface, and is mounted in engagement with the lens unit 101 and has a circuit therein.

The first heat dissipation unit 120 is a heat transfer plate 121 in contact with the upper surface of the PCB unit 110, and heat transfer bars 122-1 and 122-2 having a rod shape on the upper surface of the heat transfer plate 121 and symmetrically provided in the longitudinal direction. And a plurality of heat transfer fins 123 provided between the heat transfer bars 122-1 and 122-2. Here, the heat transfer bars 122-1 and 122-2 have a first heat transfer bar 122-1 on one side and a second heat transfer bar 122-on the other side, which have an area corresponding to the heat source of the PCB unit 110 and are symmetrically provided. 2), and the first heat transfer bar 122-1 and the second heat transfer bar 122-2 are an alloy or metal material capable of maximally transferring heat to the second heat dissipation unit 130 while accumulating heat. Is formed by

The first heat dissipation part 120 transfers the heat generated from the PCB part 110 to the second heat dissipation part 130 while accumulating in the heat transfer bars 122-1 and 122-2 or a plurality of heat transfer fins 123. Heat can be released through.

As shown in FIGS. 1 and 2, the second heat dissipation unit 130 includes a first case of a flat plate shape below and a plurality of grooves 131 bonded to the rim of the first case from above and press-bonded to the first case. And a refrigerant fluid (A) contained in a space between the provided second case and the first case and the second case.

Specifically, the first case and the second case are formed of a metal material and are joined along the rim, and the first case and the second case are joined at the groove 131 to form an inner space surrounding the groove 131. . At this time, the plurality of grooves 131 may be formed by, for example, machining, casting, press molding, or other processes, and may be simultaneously formed by press working, especially when the second case is made of metal. The plurality of grooves 131 are illustrated in a circular cross-section, but are not limited thereto and may be formed in a cross-section of various shapes such as polygons.

The refrigerant fluid (A) is, for example, a solution in which a coolant is mixed with water (H ₂ O) as a main component, for example, (i) a solution in which LiBr or LiSCN is mixed in 60 to 80 wt% of water (H ₂ O), (ⅱ) of water (H ₂ O) of 60 to 80% by weight 3 fluorine ethanol (CF ₃ CH ₂ OH) a solution, and (ⅲ) of water (H ₂ O) mixture of fluoride alcohol, such as 60 to 80% by weight As a result, any one of a mixture of alkylene glycol such as ethylene glycol or propylene glycol may be used. Here, in order to prevent the first case and the second case from being corroded by the mixed coolant, the refrigerant fluid A may further mix a corrosion inhibitor.

This refrigerant fluid (A) is a liquid with low specific heat and is provided in a volume ratio of 5 to 50% in the inner space between the first case and the second case, and is phased by heat transferred through the first case. The (phase) changes to absorb heat and evaporate to sufficient entropy energy. At this time, the refrigerant gas due to evaporation spreads through the inner space between the first case and the second case, dissipates heat to the outside through the second case, and then returns to the liquid phase again. Such an endothermic and vaporizing action may be cooled by forming a flow path and convection centered on each of the grooves 131. Here, when the volume ratio of the refrigerant fluid A is out of the range of 5 to 50%, there is a problem in that the heat absorption is lowered or the vaporization is not smooth, so that the cooling efficiency is lowered.

The second heat dissipation unit 130 containing the refrigerant fluid A may additionally include a microfiber bundle (not shown) to form a flow path due to capillary convection therein. In this case, the microfiber bundle may be formed of, for example, a carbon nanotube so as to be provided in a tube shape that maintains its shape at high temperatures, and may be provided in a shape surrounding each groove 131.

The third heat dissipation unit 140 is a member made of a breathable porous structure, and is a form in which a cross-sectional area having a porosity of 90% or more is maximized by being constituted of a breathable porous structure consisting of a plurality of pores connected through each other in three dimensions. In this case, the third heat dissipation unit 140 is shown in a flat plate shape in FIG. 1, but is not limited thereto and may be provided in various shapes having a bend according to the shape of the LED device.

Specifically, the third heat dissipation unit 140 is, for example, a non-metal material such as carbon, carbon nanotubes, silicon, a metal material such as nickel (Ni), copper (Cu), aluminum, magnesium oxide, alumina, It may be formed of any one of a metal oxide and a metal nitride of titanium dioxide (TiO ₂ ). Here, the pores may be formed in a diameter of several tens of microns to several millimeters, and are formed in an open structure connected to each other in three dimensions by forming a plurality of connection passages with other pores.

The third heat dissipation unit 140 is implemented as a porous porous structure in which air gaps are connected to each other in three dimensions, and may be hard bonded to the second heat dissipation unit 130 using a heat dissipation paint. The third heat dissipation unit 140 implemented in this way may improve heat dissipation efficiency by increasing the amount of heat dissipated per unit volume by air-cooling natural convection and maximizing porosity by air-cooling through a porous porous structure connected to each other in three dimensions.

The LED lighting device according to the embodiment of the present invention configured as described above has a water-cooled and air-cooled heat transfer, heat accumulation and heat dissipation action using the first radiating part 120, the second radiating part 130, and the third radiating part 140. As a result, heat dissipation efficiency can be increased, and weight reduction can be achieved instead of the conventional heavy heat sink.

Although the technical idea of the present invention has been described in detail according to the above preferred embodiment, it should be noted that the above-described embodiments are for the purpose of explanation and not limitation.

In addition, those skilled in the art of the present invention will understand that various implementations are possible within the scope of the technical idea of the present invention.

101: lens unit 110: PCB
112: LED chip 118: sealing unit
120: first radiator 121: heat transfer plate
122-1,122-2: heat transfer bar 123: heat transfer pin
130: second radiating part 131: groove
140: third radiating part 150: guide plate
A: refrigerant fluid

Claims (5)

A lens unit 101 having a plurality of lens shapes on its lower surface;
A PCB unit 110 mounted on a lower surface of the LED chips 112 corresponding to each of the plurality of lens shapes;
A first heat dissipation unit 120 provided on the upper surface of the PCB unit 110;
A second radiating part 130 provided on the upper surface of the first radiating part 120;
A third radiating part 140 provided on the upper surface of the second radiating part 130; And
A guide plate 150 surrounding the second heat dissipation part 130 and the third heat dissipation part 140 and coupled to the edge of the lens part 101;
Including,
The third heat dissipation part 140 is a flat plate-shaped member made of a porous porous structure comprising a plurality of voids connected through each other in three dimensions using any one of a metal material, a metal oxide, and a metal nitride,
The pores are formed in a diameter of several tens of microns to several millimeters, and form a plurality of connection passages with other pores to form an open structure connected to each other in a three-dimensional LED lighting apparatus, characterized in that it has breathability.
The method of claim 1,
The first radiating part 120 is
A heat transfer plate 121 in contact with the upper surface of the PCB unit 110;
Heat transfer bars 122-1 and 122-2 symmetrically provided in the longitudinal direction in the shape of a rod on the upper surface of the heat transfer plate 121; And
A plurality of heat transfer fins 123 provided between the heat transfer bars 122-1 and 122-2;
LED lighting device comprising a. The method of claim 1,
The second radiating part 130 is
A first case in contact with the upper surface of the first radiating part 120;
A second case bonded to an edge of the first case and having a plurality of grooves 131 bonded to the first case by pressure; And
A refrigerant fluid (A) contained in the space between the first case and the second case;
LED lighting device comprising a. delete delete

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