KR101679832B1 - Heat radiating type led streetlights - Google Patents

Heat radiating type led streetlights Download PDF

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Publication number
KR101679832B1
KR101679832B1 KR1020160033851A KR20160033851A KR101679832B1 KR 101679832 B1 KR101679832 B1 KR 101679832B1 KR 1020160033851 A KR1020160033851 A KR 1020160033851A KR 20160033851 A KR20160033851 A KR 20160033851A KR 101679832 B1 KR101679832 B1 KR 101679832B1
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KR
South Korea
Prior art keywords
heat
heat sink
thermally conductive
adhesive layer
circuit board
Prior art date
Application number
KR1020160033851A
Other languages
Korean (ko)
Inventor
박영직
박성현
최명준
Original Assignee
주식회사 서광이에스
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Priority to KR1020160033851A priority Critical patent/KR101679832B1/en
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Publication of KR101679832B1 publication Critical patent/KR101679832B1/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S8/00—Lighting devices intended for fixed installation
    • F21S8/08—Lighting devices intended for fixed installation with a standard
    • F21S8/085—Lighting devices intended for fixed installation with a standard of high-built type, e.g. street light
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F21V29/717—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements using split or remote units thermally interconnected, e.g. by thermally conductive bars or heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2101/00—Point-like light sources

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Led Device Packages (AREA)

Abstract

LED Streetlight. Case integral heat sink; A heat-sensitive adhesive layer formed between the heat sink and the printed circuit board; Wherein the heat sink is configured to conduct an LED heat source to the heat sink by the heat-sensitive adhesive layer, wherein the heat sink comprises: a partition wall defining a space in which the heat-sensitive adhesive layer and the printed circuit board are seated; And a surface to which the thermally conductive adhesive penetrates, thereby providing a high-efficiency, high-performance LED streetlight in which the heat sink is replaced with a case, and a complicated substrate fastening operation is simplified while being light and slim.

Description

{HEAT RADIATING TYPE LED STREETLIGHTS}

The present invention relates to an LED streetlight, and more particularly, to an LED streetlight designed to conduct an LED heat source generated by an LED streetlight directly to a heat sink and to dissipate heat and to be suitable for high-brightness LED illumination.

LED street light is solved by placing heat sinks such as heat sinks on the back of printed circuit board, which is a heat source, because heat management is important in actual operation.

1 is a schematic view showing a conventional LED streetlight 10, which is configured to dissipate a printed circuit board 20 on which LED light emitting chips 11 are arranged through a heat sink 30, For heat dissipation of the substrate 20, a heat transfer material 40 is inserted between the printed circuit board and the heat sink as shown in FIG. 2, and the printed circuit board is assembled with a large number of attachment screws 50 to the heat sink .

The heat transfer material 40 is made of a thermal interface material (TIM) sheet and a plate, or a heat conductive paste, so that the heat is transmitted through the heat sink. However, thermal grease, thermal compound, and heat transfer paste (HTP) are used to help dissipate heat through the heat sink. However, when used for a long time, heat resistance and temperature can do.

In addition, since the LED light emitting chip and the printed circuit board do not consider the weight of the LED light emitting chip and a large number of mounting screws are used to attach the LED light emitting chip and the heat sink in the same manner from light weight to weight, the manufacturing process of the street light is complicated and costly .

The life span of the LED is about 10 years, but the high-brightness LED used in the streetlight has a problem of heat generation. Because street LEDs use multiple LEDs, it is difficult to solve the problem that the life time is shortened without adequate heat dissipation. Accordingly, it is necessary to develop an LED streetlight which can be manufactured by a simple process, and can stably use the heat generated from the LED efficiently while emitting it to the outside.

Patent Document 1. Korean Patent No. 10-1059084 B1

Patent Document 2: Korean Patent No. 10-1346352 B1

Patent Document 3: Korean Patent No. 10-1545115 B1

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems of the conventional art, and an object of the present invention is to efficiently heat the LED street lamp.

It is another object of the present invention to dissipate the LED heat source of the LED streetlight by conducting heat to the heat sink without obstacle.

Another object of the present invention is to perform stable heat radiation control for a heat source of an LED streetlight.

It is a further object of the present invention to advantageously install and manufacture a heat dissipation system for a heat source of an LED streetlight.

It is a further object of the present invention to provide an LED streetlight which is light in weight and structurally simple yet slim.

According to the present invention, the above-mentioned objects are achieved by providing a case-integrated heat sink; A heat-sensitive adhesive layer directly bonding the printed circuit board to the heat sink; Wherein the heat sink is configured to conduct the LED heat source to the heat sink by the heat conductive adhesive layer, wherein the heat sink comprises: a partition wall defining a space in which the heat conductive adhesive layer and the printed circuit board are seated; And a surface through which the thermally conductive adhesive penetrates.

Further, according to the embodiment of the present invention, the heat conductive adhesive layer comprises a thermally conductive adhesive comprising 55 to 70% by weight of an epoxy resin, 15 to 25% by weight of an acrylic resin, and 4 to 6% by weight of a curing agent; And 11 to 14 wt% filler impregnated in the thermally conductive adhesive.

Further, according to an embodiment of the present invention, the filler includes powder particles or carbon compounds selected from graphene, graphite, and carbon nanotube, or metals and non-metal powder particles including copper, silver and aluminum.

Further, according to the embodiment of the present invention, the heat conductive adhesive layer comprises a thermally conductive adhesive comprising 55 to 70% by weight of an epoxy resin, 15 to 25% by weight of an acrylic resin, and 4 to 6% by weight of a curing agent; And 11 to 14 wt% filler impregnated in the thermally conductive adhesive.

Further, according to an embodiment of the present invention, the filler may be selected from among powder particles or carbon compounds selected from graphene, graphite, and carbon nanotube, or metals including non-metallic powder including copper, silver, and aluminum.

According to the embodiment of the present invention, when the filler is a crystalline particle having an average particle size of 1 to 3 占 퐉 in the unit of powder particles, the filler occupying ratio (n%) in the volume area of the thermally conductive adhesive is 20 to 30% . ≪ / RTI >

Further, according to the embodiment of the present invention, the heat-sensitive adhesive layer may further include carbon compound composite particles.

Further, according to the embodiment of the present invention, the heat-sensitive adhesive layer may comprise a thermally conductive plate.

Further, according to the embodiment of the present invention, the surface of the thermally conductive plate may be composed of a flat surface or a corrugated surface, a surface having a concavo-convex shape, and may have a plurality of opening holes. It is preferable that the opening ratio formed by the opening holes is 50% or less in the total area.

Further, according to the embodiment of the present invention, the heat sink is replaced with the outer case of the LED streetlight.

Further, according to the embodiment of the present invention, the partition wall of the heat sink is a protruding shape protruding from the surface of the heat sink, and forms a step at the outer periphery thereof.

According to an embodiment of the present invention, a finishing material is attached along a step formed outside the partition of the heat sink.

Further, according to the embodiment of the present invention, a gap formed on the surface of the heat sink and a development groove extending from the gap and penetrating the thermally conductive adhesive body are included.

Further, according to the embodiment of the present invention, the printed circuit board may include a groove for increasing the surface area of the surface facing the heat sink, and a development groove extending from the groove to induce the penetration of the thermally conductive adhesive .

The present invention has the effect of providing a structurally simple LED streetlight without incorporating a separate mounting screw for heat dissipation by integrating the printed circuit board around the surface of the heat sink.

Further, the present invention provides an LED streetlight of high performance and high efficiency which conducts heat of the LED heat source to the heat dissipation system without obstruction and effectively cools it.

Further, the present invention provides an LED streetlight that forms a stable heat-sensitive adhesive layer between the heat sink and the printed circuit board to perform stable heat radiation control.

In addition, the present invention has an effect of providing an LED streetlight which is easy to install and manufacture a heat dissipation system for an LED heat source.

In addition, the present invention provides an LED streetlight that is relatively light in weight and structurally simple and slim in a heat dissipation condition that provides a brightness equal to that of existing LED street lamps.

1 is a schematic view showing a conventional LED streetlight in a plane.
2 is a sectional view taken along the line A-A 'in Fig.
3 is an exploded perspective view illustrating an LED streetlight according to an embodiment of the present invention.
4 is a schematic diagram of an LED streetlight according to an embodiment of the present invention.
5 is a plan view of an LED streetlight according to an embodiment of the present invention.
Fig. 6 is a front view of Fig. 5. Fig.
7 is a cross-sectional view illustrating an assembled state of an LED streetlight according to an embodiment of the present invention.
8 is a sectional view showing an assembly state of an LED streetlight according to another embodiment of the present invention.
9 is a partial cut-away sectional view of an LED streetlight according to an embodiment of the present invention.
10 is an illustration of a cross-sectional structure of the heat-sensitive adhesive layer according to the embodiment of the present invention.
11 is an enlarged view of part A of Fig.
12 is an illustration showing the layer structure of the heat-sensitive adhesive layer according to the embodiment of the present invention.
Fig. 13 is an example of a thermally conductive plate shape according to an embodiment of the present invention, wherein (a) and (b) are plan views, (c) d) is an upper surface protruding concavo-convex shape, and (e) is an example of a bottom surface protruding concavo-convex type.
14 (a) and 14 (b) are illustrations showing the structure of a printed circuit board according to an embodiment of the present invention.
Fig. 15 is an example of a heat sink according to an embodiment of the present invention, wherein (a) is a front view and (b) is a sectional view taken along the line B-B 'in Fig.
16 is a sectional view of an LED streetlight according to an embodiment of the present invention.
17 is a sectional view of an LED streetlight according to another embodiment of the present invention.
18 is a sectional view of an LED streetlight according to another embodiment of the present invention.
19 is a sectional view of an LED streetlight according to another embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

3 is an exploded perspective view illustrating an LED streetlight according to an embodiment of the present invention. 4 is a schematic diagram of an LED streetlight according to an embodiment of the present invention. 5 is a plan view of an LED streetlight according to an embodiment of the present invention. Fig. 6 is a front view of Fig. 5. Fig. 7 is a cross-sectional view illustrating an assembled state of an LED streetlight according to an embodiment of the present invention.

3 to 7, the present invention can be applied to a case where a printed circuit board 200 on which a plurality of LED light emitting devices 110 constituting the LED chip 100 are arranged and a heat sink 300, So that an LED streetlight A is manufactured.

The heat sink 300 is configured to function as a heat dissipation and an outer case. There is no need for a separate case to mount and protect electrical components.

The printed circuit board 200 is directly bonded to the heat sink 300. The heat sink and the printed circuit board are adhered by the thermally conductive adhesive 410 to form a heat-sensitive adhesive layer 400 between the heat sink and the printed circuit board after curing.

And is configured to conduct the LED heat source to the heat sink 300 through the heat and pressure sensitive adhesive layer 400.

The heat sink 300 includes a barrier rib 340 for forming a space in which the heat-sensitive adhesive layer 400 and the printed circuit board 200 are seated. The partition wall 340 protrudes along the edge of the heat sink 300. A space is formed inward by the projected height step and a step 341 is formed in the outward direction.

The heat sink 300 forms a surface 320 through which the thermally conductive adhesive 410 penetrates to induce the heat sink to firmly adhere to the printed circuit board without detaching from each other.

7 is a cross-sectional view illustrating an assembled state of an LED streetlight according to an embodiment of the present invention. 8 is a cross-sectional view illustrating an assembled state of the LED streetlight according to another embodiment of the present invention, in which the heat sink 300 includes the heat dissipation fin 330. FIG.

7 and 8, the printed circuit board 200 and the heat sink 300 are adhered to each other through the heat-sensitive adhesive layer 400. As shown in FIG. The heat-sensitive adhesive layer (400) is formed by curing the thermally conductive adhesive (410).

As shown in Figs. 9 to 11, the heat and pressure sensitive adhesive layer 400 includes a thermally conductive adhesive 410 comprising 55 to 70% by weight of an epoxy resin, 15 to 25% by weight of an acryl resin, and 4 to 6% by weight of a curing agent, And 11 to 14 wt% filler 420 impregnated with the adhesive.

The filler 420 may be composed of powder particles or carbon compounds selected from graphene, graphite, and carbon nanotube, or metal and non-metal powder particles including copper, silver, aluminum, (N%) of the filler occupying in the volume area of the thermally conductive adhesive 410 may be 20 to 30% when the particles are crystalline particles having an average particle size of 1 to 3 占 퐉.

In addition, the heat-sensitive adhesive layer 400 may include carbon composite particles 440 and may include a thermally conductive plate 450. The surface of the thermally conductive plate 450 includes a planar surface or a corrugated surface as shown in each of FIGS. 13A, 13B, 13C, 13D and 13E, And the opening ratio of the opening hole 451 is preferably 50% or less in the total area.

The printed circuit board 200 is bonded directly to the surface 320 of the heat sink 300 by the heat sensitive adhesive layer 400 in any case as shown in FIG. And can be adhered and supported on the surface 320 of the heat sink 300, so that a complicated attachment screw fastening operation for joining the printed circuit board and the heat sink is not required. The heat generated from the LED chip 100 is conducted to the heat sink 300 through the heat-sensitive adhesive layer 400 to dissipate heat.

The printed circuit board 200 may be manufactured to include the grooves 220 that increase the surface area of the surface facing the heat sink 300 and may be thermally conductive to increase the adhesive force and the supporting force of the thermally conductive adhesive 410. [ And a development groove 221 extending from the groove 220 so that the sieve 410 can penetrate.

The heat sink 300 is composed of a surface 320 through which the thermally conductive adhesive 410 penetrates, as shown in FIG. The surface 320 has grooves 310 punctured and extended from the gaps 310 to form an extended groove 311. When the thermally conductive adhesive 410 is forcibly injected through the gap 310, it penetrates into the development groove 311 to improve the adhesive effect.

The partition 340 of the heat sink 300 is a protruding type protruding from the surface 320 of the heat sink and forms a step 341 at the outer side.

The finishing material 500 is attached along the step 341 formed at the outer edge of the partition wall 340 of the heat sink 300 to finish the edge portion.

The finishing material 500 may be a rubber packing material of an elastic material that can be inserted immediately, or a sealant of a metal or non-metal material that prevents the penetration of moisture. However, it is not limited thereto.

A light transmitting plate 600 is installed on the front surface of the heat sink 300 to emit the light of the LED chip 100 and to prevent dust and contaminants from contacting the printed circuit board and electrical components.

The light transmitting plate 600 may be coated with a photocatalyst coating agent in whole or in part to prevent a decrease in light transmittance due to contamination. The photocatalyst coating agent may be selected from any one of titanium dioxide (TiO 2 ) and titanium oxynitride (TiON), or a mixture of TiO 2 and TiON powder mixed with 60 to 70 wt% of TiO 2 powder and 30 to 40 wt% of TiON powder desirable. When TiO 2 is more than 70 wt%, the decontamination performance is lowered. When the TiO 2 is less than 60 wt%, the decontamination performance is similarly deteriorated. Therefore, TiO 2 A photocatalyst coating agent mixed in an amount of 60 to 70% by weight can be selected as a preferable photocatalytic coating agent.

Provided is a highly efficient heat dissipation LED streetlight that prevents deterioration in light efficiency due to adsorption of dust on a surface of a photocatalyst coating surface and removes surface contamination due to dust resolution. The decomposition of dust by the photocatalyst coating agent, and the removal performance of the contamination source may be different depending on the components of the photocatalyst coating agent used.

In addition, the present invention can be configured to include a structure in which the surface of the heat sink 300 is coated with a photocatalytic coating agent. When a photocatalytic coating layer made of a coating film is placed on the outer surface of the heat sink 300, it is possible to prevent deterioration of cooling efficiency due to adsorption of dust on the surface and to eliminate surface contamination due to dust resolution, thereby providing a highly efficient streetlight with air purification performance. Do. And a durability deterioration due to adsorption of surface contaminants of the heat sink is improved, thereby providing a highly reliable streetlight with a long service life.

Reference numeral 301 denotes a 'support head' which can be integrally or in combination with a heat sink and can be coupled to a structure such as a lamppost.

The LED streetlight according to the present invention will be described in detail as follows.

The assembly of the LED streetlight A according to the present invention first attaches the printed circuit board 200 to the surface 320 of the heat sink 300 through the thermally conductive adhesive 410 in a face-to- It may be preferable that the thermally conductive adhesive 410 is treated in a gel state having a certain viscosity. Consider that the lower the viscosity, the lower the viscosity, which may be disadvantageous in the bonding process.

The thermally conductive adhesive 410 has a gap 310 and a development groove 311 provided in the groove 220 and the development groove 221 formed in the printed circuit board 200 and the surface 320 of the heat sink 300, Infiltrate. The heat-sensitive adhesive layer 400 that conducts the heat of the printed circuit board 200 directly to the heat sink 300 is formed, and at the same time, a firm adhesion state is maintained by the penetration effect.

In the case of bonding the printed circuit board and the heat sink through the thermally conductive adhesive 410, the thermally conductive plate 450 may be provided to improve the thermal conductivity. An opening hole 451 is formed in the thermally conductive plate 450 to allow the flow of the thermally conductive adhesive 410 in a gel state before the adhesive is allowed to freely flow and the adhesive strength between the printed circuit board 200 and the heat sink 300 after curing Can be improved.

When the bonding of the printed circuit board 200 and the heat sink 300 is completed, the finishing material 500 is mounted on the outer edge rim 341 of the protruding partition wall 340 to finish the process. In the finishing process, it is preferable to apply a sealing structure that protects the circuit and electrical components.

When the bonding of the printed circuit board 200 and the heat sink 300 is completed, the heat sink is in a state in which all surfaces except the surface contacting the printed circuit board come into contact with the air, thereby exhibiting good ventilation.

The detailed structure of the heat-emitting LED streetlight according to the present invention is as follows.

The LED chip 100 is usually connected to the lead frame 120 by wire bonding in a plastic-type package, as shown in FIG. 9, in which 1-4 LED dies for mounting the LED light emitting device 110 are connected And is connected to the electrode pattern 210 of the printed circuit board 200 by soldering or adhesive. On the other hand, a chip-on-board (COB) type LED chip having a different type is connected by directly bonding an LED light emitting element to a printed circuit board by die bonding, and by wire bonding via a metal wire.

The present invention integrates a printed circuit board (200) on which LED chips (100) are arranged and a heat sink (300), which is a heat dissipating system, through a case (500) Here, the type of the LED chip 100 is not limited to any one of the specified LED chip types.

10 is an exemplary view showing the layer structure of the heat-sensitive adhesive layer according to the embodiment of the present invention.

9 and 10, the LED chip 100 including the lead frame 120 having the LED light emitting device 110 mounted thereon is disposed on the printed circuit board 200, The heat sink 300 is bonded to the printed circuit board 200 and the heat sink 300 by bonding the heat sink 300 with the heat conductive adhesive so that the heat conductive adhesive layer 400 faces the printed circuit board 200 and the heat sink 300.

The printed circuit board 200 includes an electrode pattern 210 corresponding to the lead frame 120 connected to the LED light emitting device 110 of the LED chip 100. The electrode pattern 210 may have various patterns as a circuit path connecting the LED light emitting device 110.

The heat sink 300 faces the printed circuit board 200 and dissipates heat. Usually aluminum materials are used, but are not limited thereto. A metal material such as copper, stainless steel, silver, nickel, titanium or iron or an inorganic material such as graphite, alumina, aluminum nitride or zirconium oxide, May be used. The shape of the heat sink may be shaped to include shapes such as projections, heat exchange fins, etc., which increase the surface area if possible.

The heat and pressure sensitive adhesive layer (400) adheres and supports the printed circuit board (200) and the heat sink (400) in a face - to - face manner. As shown in FIGS. 10 and 11, the heat conductor 420 may be a component.

The printed circuit board 200 or the heat sink 300 adhered by the heat and pressure sensitive adhesive layer 400 can be prevented from being deteriorated by deterioration of the adhesive force due to long time use on the basis of the heat and pressure sensitive adhesive layer 400, The heat conductive adhesive 410 penetrates and hardens due to peeling or the like due to peeling.

The heat and pressure sensitive adhesive layer 400 comprises a thermally conductive adhesive 410 consisting of 55 to 70% by weight of an epoxy resin, 15 to 25% by weight of an acrylic resin and 4 to 6% by weight of a curing agent, and 11 To 14% by weight of filler (420).

The epoxy resin forming the heat and pressure sensitive adhesive layer (400) can be synthesized by condensation polymerization of bisphenol A and epichlorohydrin. By controlling the ratio of bisphenol A to epichlorohydrin, epoxy resins having various molecular weights can be prepared.

The epoxy resin reacts with the curing agent to form a three-dimensional polymer structure that is crosslinked after curing, and exhibits strong adhesion between the printed circuit board 200 and the heat sink 300. If the content of the epoxy resin in the heat-sensitive adhesive layer 400 is 55% by weight or less, the adhesive strength is lowered. If the epoxy resin is 70% by weight or more, the resistance to fracture (toughness) may be lowered. The content of the epoxy resin in the heat-sensitive adhesive layer (400) is in the range of 55 to 70% by weight in consideration of adhesive strength and toughness.

The acrylic resin forming the heat and pressure sensitive adhesive layer 400 is a polymer compound containing a polymer such as acrylamide, acrylonitrile and the like, which is acrylic acid, methacrylic acid and derivatives thereof, and an epoxy resin having different properties and a copolymer It is possible to compensate the physical properties of the epoxy resin.

If the content of acrylic resin is less than 15% by weight in the heat-sensitive adhesive layer 400, it affects little to the physical properties of the epoxy resin. If it is more than 25% by weight, the toughness may be increased. However, Weakness can be brought about. The content of 15 to 25% by weight of acrylic resin in the heat-sensitive adhesive layer (400) is in a range in consideration of adhesive strength and toughness.

As the curing agent, a curing agent obtained by mixing at least one selected from amines, acid anhydrides, boron trifluoride, etc. in a prepolymer obtained by reacting epichlorohydrin can be used. This curing agent can be cured by reacting with a liquid epoxy / acrylic resin. If the curing agent is not more than 4% by weight in the heat-sensitive adhesive layer 400, the curing time can not be reached, and if the curing agent is more than 6% by weight, the cured state can not be reached. The curing agent content of 4 to 6 wt% may be an amount capable of stabilizing the cured state by controlling the curing reaction time of the liquid epoxy / acrylic resin.

The LED streetlight A according to the present invention is manufactured by bonding the printed circuit board 200 on which the LED chips 100 are arranged and the heat sink 300 through the heat adhesive layer 400, It is possible to integrate the heat sink with the printed circuit board in the manufacturing process of the LED street lamp, and can be commercialized as a self-heat-emitting LED street light.

In addition, the LED streetlight according to the present invention conducts the heat of the LED heat source to the heat sink 300 through the heat-sensitive adhesive layer 400 without a hindrance. The heat-sensitive adhesive layer 400 is freely adjustable in terms of peel strength, adhesive strength, and withstand voltage characteristics as compared with a thermally conductive paste such as a TIM sheet and a sheet selected as a heat transfer material, a thermal grease or a thermal compound, or a heat transfer paste And it can be applied by adjusting the thermal conductivity conveniently so that there is no problems such as detachment of sticking force and deviation of peeling, and a stable heat conduction state can be maintained without increasing the heat resistance for a long time with a strong adhesive force.

The LED streetlight according to the present invention may be mounted on the printed circuit board 200 such that the weight of the LED chip 100 and the printed circuit board 200 and the heat sink 300 The adhesive force of the heat-sensitive adhesive layer 400 may be adjusted in advance to provide a solid LED streetlight, so that stable heat radiation control of the LED streetlight can be performed in the final product state.

In addition, the LED streetlight according to the present invention produces a highly reliable LED streetlight that can be used without problems such as separation and separation of the surface contact portions between the printed circuit board 200 and the heat sink 300. This can replace the existing complex manufacturing process of attaching the heat sink 300 to the printed circuit board 200 using light weight to heavy weight mounting screws in a simple and inexpensive manner.

In addition, the LED streetlight according to the present invention can systematically apply and manage the installation and manufacture of the heat sink 300 installed for heat dissipation of the LED heat source.

In order to evaluate the characteristics of the heat-sensitive adhesive layer constituting the LED streetlight according to the embodiment of the present invention, Samples 1 and 2 were prepared in the same manner as in Examples 1 and 2. In the same manner as in Comparative Examples 1 and 2 Samples 3 and 4 were prepared in a comparative manner.

Examples 1 and 2 and Comparative Examples 1 and 2 of the present invention will be described in detail.

The heat-sensitive adhesive layer may be Sample 1 of Example 1, Sample 2 of Example 2, Sample 3 of Comparative Example 1, or Sample 4 of Comparative Example 2.

Composition and composition of the heat-sensitive adhesive layer Item
division Content ratio (% by weight),
100 wt% glue Thermoconductor
ingredient

Epoxy resin Filler - Graphite
Crystalline particles having an average particle diameter of 1 to 3 mu m Epoxy resin 63.0 Acrylic resin Acrylic resin 20.0 Hardener Curing agent 4.5 Filler 12.5

Adhesive (including hardener): 87.5% by weight (based on ± 1.5)

Thermal conductor (filler): 12.5 wt% (standard of 1.5), occupancy: 12.5% (standard of 1.5)

Composition and composition of the heat-sensitive adhesive layer Item
division Content ratio (% by weight),
100 wt% glue Thermoconductor
ingredient
Epoxy resin Filler - Graphite
Crystalline particles having an average particle diameter of 1 to 3 mu m Epoxy resin 63.0 Acrylic resin Acrylic resin 17.5 Hardener Curing agent 4.5 Filler 15.0

Adhesive (including hardener): 85% by weight (based on ± 1.5)

Thermal conductivity (filler): 15% by weight (standard of 1.5), occupancy: 12.5% (standard of 1.5)

Composition and composition of the heat-sensitive adhesive layer (Comparative Example 1) Item
division Content ratio (% by weight),
100 wt% glue Thermoconductor
ingredient
Epoxy resin Filler - Graphite
Crystalline particles having an average particle diameter of 15 to 30 탆 Epoxy resin 85.5 Hardener Curing agent 4.5 Filler 10.0

Adhesive (including hardener): 90% by weight (based on ± 1.5)

Thermal conductor (filler): 10 wt% (± 1.5 standard)

Composition and composition of the heat-sensitive adhesive layer (Comparative Example 2) Item
division Content ratio (% by weight),
100 wt% glue Thermoconductor ingredient
Epoxy resin Filler - Graphite
Crystalline particles having an average particle diameter of 15 to 30 탆 Epoxy resin 80.5 Hardener Curing agent 4.5 Filler 15.0

Adhesive (including hardener): 86 wt% (based on ± 1.5)

Thermal conductor (filler): 15% by weight (standard of 1.5)

Example 1

63% by weight of epoxy resin and 20% by weight of acrylic resin were heated and mixed in a liquid molten state, liquefied, and 12.5% by weight of a graphite filler having an average particle size of 1 to 3 탆 was added to the mixed liquid epoxy / acrylic resin , And further heating and stirring were carried out. Then, 4.5 wt% of a curing agent containing amine was added to the prepolymer, and the mixture was uniformly mixed. The mixture was uniformly coated on a smooth flat plate to have a thickness of 0.15 mm, To form a pressure-sensitive adhesive layer corresponding to the pressure-sensitive adhesive layer. The prepared sample 1 corresponds to the heat-sensitive adhesive layer.

Example 2

A sample 2 was prepared by forming the heat-sensitive adhesive layer on the flat sheet by the same procedure and by the same method as in Example 1. The difference from Example 1 was that Sample 2 corresponding to the heat-sensitive adhesive layer was prepared by adjusting the acrylic resin to 17.5 wt% and adjusting the graphite filler having an average particle size of 1 to 3 mu m to 15 wt%.

Comparative Example 1

85.5% by weight of epoxy resin was heated and liquefied, 10% by weight of a graphite filler having an average particle size of 1 to 3 占 퐉 was put into a liquid epoxy resin, and the mixture was heated and stirred. Then, 4.5% by weight of a curing agent, And the mixture was uniformly mixed and then coated and cured so as to have a thickness of 0.15 mm on a smooth flat plate to prepare a pressure sensitive adhesive layer corresponding to the heat sensitive adhesive layer to be formed in the present invention on a flat sheet. The prepared sample 3 corresponds to the heat-sensitive adhesive layer.

Comparative Example 2

A sample 4 was prepared by forming the heat-sensitive adhesive layer on the flat sheet by the same process and method as those of the comparative example 1. The difference from the comparative example 1 is that a sample 4 corresponding to the heat-sensitive adhesive layer was prepared by adjusting the epoxy resin of TORAY Co. to 80.5% by weight and adjusting the graphite filler having an average particle size of 1 to 3 μm to 15% by weight.

In order to comparatively evaluate the physical properties of the heat-sensitive adhesive layer sheets (Sample 1 to Sample 4) on the flat plate prepared in Examples 1 and 2 and Comparative Examples 1 and 2, the thickness and the peel strength ), Thermal conductivity, withstand voltage (DC), and adhesion.

The thermal conductivity was measured by a laser pulse method with a measurement temperature of 100 ° C and a ruby laser light as an irradiation light. To accurately measure the heat transfer ability of the material, The specific gravity of the sample, and the specific heat as constants.

The measurement results of the sample 1 of Example 1 were measured as shown in Table 5 below.

Evaluation result (measurement result of sample 1 of Example 1) Item unit Measure thickness mm 0.15 + 0.02 peel strength Kgf / cm 2 or more thermal conductivity W / (mk) 3 withstand voltage / DC KV 5 or more adhesion g / 25mm 1800

Samples 2 and 3 and Samples 3 and 4 prepared from the remaining Example 2 and Comparative Examples 1 and 2 were measured in the same manner as in the measurement method for the sample 1 of Example 1 and the sample 1 and the samples 2 to 4 The results and evaluations were evaluated as follows.

Evaluation results of the examples and the control group [ Evaluation items thickness Peel strength Thermal conductivity Withstand voltage adhesiveness Example
Example 1 (Sample 1) 0.15 + 0.02 2 or more 3 5 or more 1800 Example 2 (Sample 2) 0.15 + 0.02 2 or more 3.2 5 or more 1780 Control group
Comparative Example 1 (Sample 3) 0.15 + 0.02 2 or less 2 4 or less 1720 Comparative Example 2 (Sample 4) 0.15 + 0.02 2 or less 2.4 4 or less 1700

As a result of the comparative evaluation, in Examples 1 and 2 in which epoxy resin and acrylic resin were mixed and liquefied and an appropriate amount of a curing agent containing amine added to the prepolymer was added as an additive, the peel strength was "2 or more" Comparative Examples 1 and 2 using epoxy resin alone showed peel strength of less than 2, withstand voltage of less than 4, adhesiveness of 1780, and adhesion strength of 1880 and 1780, respectively. 1700 '.

As a result, the heat-sensitive adhesive layers of Examples 1 and 2 formed by mixing epoxy resin and acrylic resin have excellent peeling strength, resistance to withstand voltage, adhesion and the like, as compared with Comparative Examples 1 and 2 using only epoxy resin Respectively.

As a result, the epoxy resin and acrylic resin showed meaningful results that can be used as a thermally conductive adhesive for a printed circuit board and a heat sink of a heat dissipating LED streetlight.

General comparison evaluation of thermal adhesives (ACRYLIC, EPOXY, PHENOLIC) division ACRYLIC TYPE EPOXY TYPE PHENOLIC TYPE



Item

Properties THERMO PLASTIC THERMO PLASTIC
Advantages Good adhesion.
Dimensional stability is excellent.
Flexibility is excellent. Absorption rate is low. No abnormality even when exposed to high temperature for a long time. No POST BAKING required. Excellent chemical resistance.
Flexibility is good. Low moisture absorption rate.
Disadvantages Prolonged exposure to high temperatures will degrade the properties. CULING TIME required. My flexibility is poor.
Can not be modified when the operation is completed. Adhesion is poor.
Weak to THERMAL SHOCK MAKER DUPONT ROGERS SHELDAHL TORAY SHELDAHL NIKKAN TORAY SONY ROGERS OAK
Remarks Adhesive thickness varies by manufacturer, base and coverlay.

[Table 7] shows properties of ACRYLIC and EPOXY used as a thermal adhesive, and acrylic is evaluated as having excellent physical properties such as adhesive strength, dimensional stability and bending property as compared with an epoxy-based thermal adhesive. As described above, the physical properties of the acrylic resin and the epoxy resin are compared, and it is confirmed that the pros and cons are represented by the physical properties. When they are mixed in proper amounts, the acrylic resin can exhibit superior performance to the adhesive by mixing resins having different physical properties.

In addition, according to the embodiment of the present invention, it can be seen that the thermally conductive thermal adhesive through liquid-phase mixing of acrylic and epoxy resin can be usefully used as a thermally conductive adhesive forming a heat-sensitive adhesive layer in the production of a heat- .

When epoxy resin and acryl resin are mixed and liquefied, it can be confirmed that the adhesive strength can be easily adjusted by considering the weight of the LED chip, the printed circuit board and the heat sink constituting the heat dissipating LED streetlight in advance.

Further, according to the embodiment of the present invention, the thermally conductive adhesive includes a thermally conductive filler, so that the thermally conductive adhesive becomes thermally conductive or thermally conductive.

The filler may preferably be selected from powder particles selected from graphene, graphite, carbon nanotubes, or carbon compounds, and may include metals and non-metal powder particles including copper, silver, and aluminum.

The occupancy rate (n%) of the filler in the heat-sensitive adhesive layer was evaluated to be preferably a criterion occupying 12.5% in the volume area of the thermally conductive adhesive when the average particle diameter of the powder particles was a crystalline particle having an average particle diameter of 1 to 3 μm . The occupancy (n%) of the filler used affects the adhesive substrate and the thermal conductivity according to the occupancy, except for the inherent properties.

A range of ± 1.5 when the filler occupies about 12.5% of the total area of the adhesive is a permissible occupancy. As a result of the experiment, when 12.5% by weight of graphite particles having an average particle size of 1 to 3 μm was mixed with an adhesive containing 63% by weight of epoxy resin, 20% by weight of acrylic resin and 4.5% by weight of a curing agent, the occupancy rate was the degree corresponding to the average particle size of graphite particles , The thermal conductivity was changed according to the occupancy rate, and the strength of adhesive strength was also different.

The occupancy rate was measured to be more than 11 (n%) and 14 (n%), which shows excellent thermal conductivity and satisfactory adhesive strength.

Since the thermal conductor of the heat-sensitive adhesive layer 400 includes the carbon compound composite particle, it can be simply replaced with the carbon compound composite particle having better heat conduction performance.

The heat conductive adhesive layer 400 may be provided with a thermally conductive plate 450. The thermally conductive plate 450 may be the same as a thin foil.

Fig. 13 shows an example of the shape of the thermally conductive plate, in which (a), (b) are planes, (c) (E) is an example of a bottom surface protruding concave-convex shape having an opening hole.

As shown in FIG. 13, the thermally conductive plate 450 can be manufactured in various shapes. It is preferable to have an aperture hole 451, and the aperture ratio should preferably be 50% or less in the entire area. The opening hole 451 allows the gelatinous (liquid) thermally conductive adhesive 410 to flow between the printed circuit board 200 and the heat sink 300 or to facilitate free movement during manufacturing of the heat dissipating LED street lamp. The aperture hole 451 has a good thermal conductivity at an aperture ratio of 50% or less and can be advantageous in preserving the adhesive force.

As the liquid thermally conductive adhesive 410 flows along the opening hole 451 during the LED street lamp manufacturing process, the adhesive is evenly distributed over the upper and lower portions of the thermally conductive plate 450 to form a hard adhered state on the upper and lower substrates, .

As shown in FIG. 14, the groove 220 that increases the surface area of the surface of the printed circuit board 200 facing the heat sink 300 increases the peel strength through the increase of the surface area, and maintains the close adhesion. Further, the expandable development groove 221 extending from the groove 220 induces penetration of the thermally conductive adhesive 451 to form a firm adhesive force.

15, the heat sink 300 facing the printed circuit board 200 may have a development groove 311 through which the air gap 310 and the thermally conductive adhesive 410 penetrate. In the heat sink 300, The lower deployment groove 311 is wider than the gap 310 to increase the supporting force due to the penetration hardening of the thermally conductive adhesive 410. The thermally conductive adhesive 410 penetrating into the expansion grooves 311 and hardened restricts the flow and separation of the heat sink 300 and enhances the impact resistance and durability of the heat sink type LED street lamp in the finished product state.

16 is a cross-sectional view of a heat-sensitive adhesive layer formed between a printed circuit board and a heat sink constituting the LED streetlight according to the present invention (hereinafter referred to as a "first structure").

17 is another sectional structure of the heat-sensitive adhesive layer formed between the heat sink and the printed circuit board constituting the heat-radiating LED streetlight according to the present invention. In Fig. 17, a heat conductive adhesive layer is impregnated with a thermally conductive plate (hereinafter referred to as a "second structure").

18 is another cross-sectional structure of the heat-sensitive adhesive layer formed between the heat sink and the printed circuit board constituting the heat-radiating LED streetlight according to the present invention. In FIG. 18, the heat-sensitive adhesive layer has a structure penetrating and curing into voids and development grooves formed in a heat sink (hereinafter referred to as a "third structure").

19 is another cross-sectional structure of a heat-sensitive adhesive layer formed between a heat sink and a printed circuit board constituting a heat radiating LED streetlight according to the present invention. The heat-sensitive adhesive layer is a structure having a groove and a development groove formed in an upper printed circuit board, and an air gap and a development groove formed in a heat sink at a lower portion, and penetration-cured (hereinafter, a 'fourth structure').

Here, the adhesion strength order may be a first structure? Second structure? Third structure? Fourth structure.

In the fabrication of the LED streetlight as shown in FIGS. 16 to 19, the adhesion between the printed circuit board and the heat sink can be adhered in the following order. However, it is not limited to the order in which they are listed.

A thermally conductive adhesive may be prepared and applied to the surface of the heat sink and the printed circuit board may be brought into close contact with the applied thermally conductive adhesive to form a cured heat and pressure sensitive adhesive layer between the heat sink and the printed circuit board.

Further, a thermally conductive plate in which a plurality of opening holes are drilled as a heat conductor is prepared, a thermally conductive plate is accommodated in a thermally conductive adhesive so that the thermally conductive plate is accommodated in the thermally conductive adhesive, and then the thermally conductive adhesive containing the thermally conductive plate is gelled And the printed circuit board is pressed on the surface of the thermally conductive adhesive so as to form a hardened heat-sensitive adhesive layer between the heat sink and the printed circuit board and adhere.

Further, it is also possible to form a groove and a development groove in the printed circuit board, to form a gap and a development groove in the heat sink, and to press-inject the thermally conductive adhesive on the gel (liquid) into the groove of the printed circuit board and the gap of the heat sink Alternatively, the thermally conductive adhesive may be adhered while penetrating through the spraying process.

The thermally conductive adhesive forming the heat-sensitive adhesive layer is composed of 55 to 70% by weight of an epoxy resin, 15 to 25% by weight of an acryl resin, and 4 to 6% by weight of a curing agent, and the filler is impregnated in an amount of 11 to 14% Thereby providing a stable thermal conductivity for heat dissipation and maintaining a firm adhesion for a long time.

Further, since the liquid thermally conductive adhesive can be injected into the heat sink or the printed circuit board along the plurality of opening holes formed in the thermally conductive plate, the adhesive force can be improved by the penetration effect of the adhesive.

The thickness of the heat-sensitive adhesive layer is not particularly limited, but is preferably determined in consideration of the heat resistance of the heat sink. In the case of application of the thermally conductive adhesive and pressure spraying, the thickness of the heat-sensitive adhesive layer may be mechanically adjusted.

Since the LED streetlight according to the present invention has a large area of the heat sink itself in contact with the outside air and does not require a separate casing treatment, heat dissipation is improved with good ventilation.

A light transmitting plate coated with a photocatalyst coating agent is installed on the front surface of the case to emit light of the LED light emitting element and protect the printed circuit board mounted inside the case from contact with contaminants such as dust.

Further, the light-transmitting plate includes the photocatalyst-coated surface, thereby providing a high-efficiency LED streetlight that prevents deterioration in light efficiency due to adsorption of dust on the surface and removes surface contamination with dust-resolving power.

In addition, since a photocatalytic coating layer can be placed on the heat sink, a highly efficient streetlight is provided which prevents deterioration in heat radiation due to adsorption of dust on the surface and removes surface contamination due to dust resolution.

Further, by integrating the printed circuit board around the surface of the heat sink, it is unnecessary to perform a separate attachment screw installation work for heat dissipation, and it is possible to prevent the distortion of the board due to deterioration of the printed circuit board due to a large number of attachment screws , It is possible to reduce the weight relatively in the heat dissipation condition which produces the luminance corresponding to the existing LED street light, and to finish the assembly simply and structurally simply, and it can be manufactured as a whole slim LED street light There is an advantage.

As described above, the present invention has been described with reference to the embodiment shown in the drawings, but it should be understood that the present invention is not limited to the embodiment, but can be modified and changed without departing from the gist of the present invention. It is included in technical thought.

100: LED package 110: LED light emitting element
200: printed circuit board 210: electrode pattern
220: groove 221: deployment groove
300: heat sink 310: air gap
311: unfolding groove (extended groove) 320: surface
340: partition wall 400: heat conductive adhesive layer
410: thermally conductive adhesive 420: filler
440: carbon compound composite particle 450: thermally conductive plate
451: aperture hole 500: finishing material
600: Transparent plate

Claims (11)

Case integral heat sink; A heat-sensitive adhesive layer formed between the heat sink and the printed circuit board; And the LED heat source is conducted to the heat sink by the heat-sensitive adhesive layer,
Wherein the heat sink comprises: a partition wall defining a space in which the heat-sensitive adhesive layer and the printed circuit board are seated; And a surface to which the thermally conductive adhesive penetrates,
The surface comprising a cavity punctured to infuse and penetrate a thermally conductive adhesive; And a development groove extending from the gap to expand the area wider than the gap to infiltrate the thermally conductive adhesive through the gap to adhere the heat sink. The method according to claim 1,
Wherein the heat conductive adhesive layer comprises a thermally conductive adhesive comprising 55 to 70% by weight of an epoxy resin, 15 to 25% by weight of an acryl resin, and 4 to 6% by weight of a curing agent; And 11 to 14 wt% filler impregnated in the thermally conductive adhesive. 3. The method of claim 2,
Wherein the filler is powder particles or carbon compounds selected from graphene, graphite, and carbon nanotubes, or metal and non-metal powder particles including copper, silver, and aluminum. The method according to claim 1,
Wherein the heat conductive adhesive layer comprises a thermally conductive plate. 5. The method of claim 4,
Wherein the thermally conductive plate has a plurality of aperture holes, and an aperture ratio of the aperture holes is 50% or less in the total area. The method according to claim 1,
Wherein the heat sink is replaced with an outer case of an LED streetlight, and an outer surface of the heat sink is formed of a photocatalytic coating layer. The method according to claim 1,
The partition wall of the heat sink is a protruding type protruding from the surface of the heat sink, and forms a step to the outside. 8. The method of claim 7,
And a finishing material mounted along the step formed at an outer periphery of the partition wall. delete The method according to claim 1,
Wherein the printed circuit board includes a groove for increasing the surface area of the surface facing the heat sink. 11. The method of claim 10,
Wherein the printed circuit board further comprises a groove for increasing the surface area of the surface facing the heat sink and a development groove extending from the groove to induce the penetration of the thermally conductive adhesive.








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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200066799A (en) * 2018-12-03 2020-06-11 정상옥 Led light apparatus with heat radiating structure
KR102208789B1 (en) * 2020-06-17 2021-01-28 주식회사 하이엠에스 Functional stand lighting device with sterilization function
WO2022036194A1 (en) * 2020-08-13 2022-02-17 Lumileds Llc Electronic device, light emitting device and method for manufacturing an electronic device

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JP2009295578A (en) * 2008-06-02 2009-12-17 Advanced Optoelectronic Technology Inc Photocatalyst illuminating device
JP2011014593A (en) * 2009-06-30 2011-01-20 Hitachi High-Technologies Corp Led light source, its manufacturing method, and led-based photolithography apparatus and method source
JP2014216527A (en) * 2013-04-26 2014-11-17 京セラ株式会社 Light irradiation module and printer

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JP2009295578A (en) * 2008-06-02 2009-12-17 Advanced Optoelectronic Technology Inc Photocatalyst illuminating device
JP2011014593A (en) * 2009-06-30 2011-01-20 Hitachi High-Technologies Corp Led light source, its manufacturing method, and led-based photolithography apparatus and method source
JP2014216527A (en) * 2013-04-26 2014-11-17 京セラ株式会社 Light irradiation module and printer

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Publication number Priority date Publication date Assignee Title
KR20200066799A (en) * 2018-12-03 2020-06-11 정상옥 Led light apparatus with heat radiating structure
KR102151856B1 (en) * 2018-12-03 2020-09-03 정상옥 Led light apparatus with heat radiating structure
KR102208789B1 (en) * 2020-06-17 2021-01-28 주식회사 하이엠에스 Functional stand lighting device with sterilization function
WO2022036194A1 (en) * 2020-08-13 2022-02-17 Lumileds Llc Electronic device, light emitting device and method for manufacturing an electronic device

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